Intel BX80601920 Data Sheet - Page 13

Datasheet

13

Electrical Specifications

2

Electrical Specifications

2.1

Intel

®

QPI Differential Signaling

The processor provides an Intel QPI port for high speed serial transfer between other

Intel QPI-enabled components. The Intel QPI port consists of two unidirectional links

(for transmit and receive). Intel QPI uses a differential signalling scheme where pairs of

opposite-polarity (D_P, D_N) signals are used.

On-die termination (ODT) is provided on the processor silicon and termination is to V

SS

.

Intel chipsets also provide ODT; thus, eliminating the need to terminate the Intel QPI

links on the system board.

Intel strongly recommends performing analog simulations of the Intel

®

QPI interface.

Figure 2-1

illustrates the active ODT. Signal listings are included in

Table 2-3

and

Table 2-4

. See

Chapter 5

for the pin signal definitions. All Intel QPI signals are in the

differential signal group.

2.2

Power and Ground Lands

For clean on-chip processor core power distribution, the processor has 210 VCC pads

and 119 VSS pads associated with V

CC

; 8 VTTA pads and 5 VSS pads associated with

V

TTA

; 28 VTTD pads and 17 VSS pads associated with V

TTD

, 28 VDDQ pads and 17 VSS

pads associated with V

DDQ

; and 3 VCCPLL pads. All VCCP, VTTA, VTTD, VDDQ and

VCCPLL lands must be connected to their respective processor power planes, while all

VSS lands must be connected to the system ground plane. The processor VCC lands

must be supplied with the voltage determined by the processor

V

oltage

ID

entification

(VID) signals.

Table 2-1

specifies the voltage level for the various VIDs.

2.3

Decoupling Guidelines

Due to its large number of transistors and high internal clock speeds, the processor is

capable of generating large current swings between low and full power states. This may

cause voltages on power planes to sag below their minimum values if bulk decoupling is

not adequate. Larger bulk storage (C

BULK

), such as electrolytic capacitors, supply

current during longer lasting changes in current demand; such as, coming out of an idle

condition. Similarly, capacitors act as a storage well for current when entering an idle

condition from a running condition. Care must be taken in the baseboard design to

Figure 2-1.

Active ODT for a Differential Link Example

T

X

R

X

R

TT

R

TT

R

TT

R

TT

Signal

Signal

Section	Page
Contents	3
Figures	4
Tables	5
Intel® Core™ i7-900 Desktop Processor Extreme Edition Series and Intel® Core™ i7-900 Desktop Processor Series Features	7
Revision History	8
1 Introduction	9
1.1 Terminology	10
1.2 References	11
2 Electrical Specifications	13
2.1 Intel® QPI Differential Signaling	13
2.2 Power and Ground Lands	13
2.3 Decoupling Guidelines	13
2.3.1 VCC, VTTA, VTTD, VDDQ Decoupling	14
2.4 Processor Clocking (BCLK_DP, BCLK_DN)	14
2.4.1 PLL Power Supply	14
2.5 Voltage Identification (VID)	14
2.6 Reserved or Unused Signals	17
2.7 Signal Groups	18
2.8 Test Access Port (TAP) Connection	19
2.9 Platform Environmental Control Interface (PECI) DC Specifications	20
2.9.1 DC Characteristics	20
2.9.2 Input Device Hysteresis	21
2.10 Absolute Maximum and Minimum Ratings	21
2.11 Processor DC Specifications	22
2.11.1 DC Voltage and Current Specification	23
2.11.2 VCC Overshoot Specification	29
2.11.3 Die Voltage Validation	30
3 Package Mechanical Specifications	31
3.1 Package Mechanical Drawing	31
3.2 Processor Component Keep-Out Zones	34
3.3 Package Loading Specifications	34
3.4 Package Handling Guidelines	34
3.5 Package Insertion Specifications	34
3.6 Processor Mass Specification	35
3.7 Processor Materials	35
3.8 Processor Markings	35
3.9 Processor Land Coordinates	36
4 Land Listing	37
5 Signal Descriptions	67
6 Thermal Specifications	71
6.1 Package Thermal Specifications	71
6.1.1 Thermal Specifications	71
6.1.2 Thermal Metrology	75
6.2 Processor Thermal Features	76
6.2.1 Processor Temperature	76
6.2.2 Adaptive Thermal Monitor	76
6.2.3 THERMTRIP# Signal	79
6.3 Platform Environment Control Interface (PECI)	79
6.3.1 Introduction	79
6.3.2 PECI Specifications	81
6.4 Storage Conditions Specifications	82
7 Features	83
7.1 Power-On Configuration (POC)	83
7.2 Clock Control and Low Power States	83
7.2.1 Thread and Core Power State Descriptions	84
7.2.2 Package Power State Descriptions	85
7.3 Sleep States	86
7.4 ACPI P-States (Intel® Turbo Boost Technology)	86
7.5 Enhanced Intel® SpeedStep® Technology	87
8 Boxed Processor Specifications	89
8.1 Introduction	89
8.2 Mechanical Specifications	90
8.2.1 Boxed Processor Cooling Solution Dimensions	90
8.2.2 Boxed Processor Fan Heatsink Weight	92
8.2.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly	92
8.3 Electrical Requirements	92
8.3.1 Fan Heatsink Power Supply	92
8.4 Thermal Specifications	93
8.4.1 Boxed Processor Cooling Requirements	93

Intel BX80601920 Data Sheet - Page 13

Electrical Specifications

Page 13 highlights