Intel BX80601920 Data Sheet - Page 9

Datasheet

9

Introduction

1

Introduction

The Intel

®

Core™ i7-900 desktop processor Extreme Edition series and Intel

®

Core™

i7-900 desktop processor series are intended for high performance high-end desktop,

Uni-processor (UP) server, and workstation systems. Several architectural and

microarchitectural enhancements have been added to this processor including four

processor cores in the processor package and increased shared cache.

The Intel

®

Core™ i7-900 desktop processor Extreme Edition series and Intel

®

Core™

i7-900 desktop processor series are the first desktop multi-core processor to

implement key new technologies:

•

Integrated memory controller

•

Point-to-point link interface based on Intel QPI

Figure 1-1

shows the interfaces used with these new technologies.

Note:

In this document the Intel

®

Core™ i7-900 desktop processor Extreme Edition series

and Intel

®

Core™ i7-900 desktop processor series will be referred to as “the processor.”

Note:

The Intel Core™ i7-900 desktop processor series refers to the Intel Core™ i7-900

desktop processors i7-960, i7-950, i7-940, i7-930, and i7-920.

Note:

The Intel Core™ i7-900 desktop processor Extreme Edition series refers to the Intel

Core™ i7-900 desktop processor Extreme Edition i7-975 and i7-965.

The processor is optimized for performance with the power efficiencies of a low-power

microarchitecture.

This document provides DC electrical specifications, differential signaling specifications,

pinout and signal definitions, package mechanical specifications and thermal

requirements, and additional features pertinent to the implementation and operation of

the processor. For information on register descriptions, refer to the

Intel

®

Core™ i7-

900 Desktop Processor Extreme Edition Series and Intel

®

Core™ i7-900 Desktop

Processor Series Datasheet, Volume 2

.

Figure 1-1.

High-Level View of Processor Interfaces

Processor

Intel

®

QuickPath

Interconnect (Intel

®

QPI)

CH 0

CH 1

CH 2

System

Memory

(DDR3)

Section	Page
Contents	3
Figures	4
Tables	5
Intel® Core™ i7-900 Desktop Processor Extreme Edition Series and Intel® Core™ i7-900 Desktop Processor Series Features	7
Revision History	8
1 Introduction	9
1.1 Terminology	10
1.2 References	11
2 Electrical Specifications	13
2.1 Intel® QPI Differential Signaling	13
2.2 Power and Ground Lands	13
2.3 Decoupling Guidelines	13
2.3.1 VCC, VTTA, VTTD, VDDQ Decoupling	14
2.4 Processor Clocking (BCLK_DP, BCLK_DN)	14
2.4.1 PLL Power Supply	14
2.5 Voltage Identification (VID)	14
2.6 Reserved or Unused Signals	17
2.7 Signal Groups	18
2.8 Test Access Port (TAP) Connection	19
2.9 Platform Environmental Control Interface (PECI) DC Specifications	20
2.9.1 DC Characteristics	20
2.9.2 Input Device Hysteresis	21
2.10 Absolute Maximum and Minimum Ratings	21
2.11 Processor DC Specifications	22
2.11.1 DC Voltage and Current Specification	23
2.11.2 VCC Overshoot Specification	29
2.11.3 Die Voltage Validation	30
3 Package Mechanical Specifications	31
3.1 Package Mechanical Drawing	31
3.2 Processor Component Keep-Out Zones	34
3.3 Package Loading Specifications	34
3.4 Package Handling Guidelines	34
3.5 Package Insertion Specifications	34
3.6 Processor Mass Specification	35
3.7 Processor Materials	35
3.8 Processor Markings	35
3.9 Processor Land Coordinates	36
4 Land Listing	37
5 Signal Descriptions	67
6 Thermal Specifications	71
6.1 Package Thermal Specifications	71
6.1.1 Thermal Specifications	71
6.1.2 Thermal Metrology	75
6.2 Processor Thermal Features	76
6.2.1 Processor Temperature	76
6.2.2 Adaptive Thermal Monitor	76
6.2.3 THERMTRIP# Signal	79
6.3 Platform Environment Control Interface (PECI)	79
6.3.1 Introduction	79
6.3.2 PECI Specifications	81
6.4 Storage Conditions Specifications	82
7 Features	83
7.1 Power-On Configuration (POC)	83
7.2 Clock Control and Low Power States	83
7.2.1 Thread and Core Power State Descriptions	84
7.2.2 Package Power State Descriptions	85
7.3 Sleep States	86
7.4 ACPI P-States (Intel® Turbo Boost Technology)	86
7.5 Enhanced Intel® SpeedStep® Technology	87
8 Boxed Processor Specifications	89
8.1 Introduction	89
8.2 Mechanical Specifications	90
8.2.1 Boxed Processor Cooling Solution Dimensions	90
8.2.2 Boxed Processor Fan Heatsink Weight	92
8.2.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly	92
8.3 Electrical Requirements	92
8.3.1 Fan Heatsink Power Supply	92
8.4 Thermal Specifications	93
8.4.1 Boxed Processor Cooling Requirements	93

Intel BX80601920 Data Sheet - Page 9

Introduction - core i7 920 processor

Page 9 highlights