Intel BX80601920 Data Sheet - Page 82

Thermal Specifications

82

Datasheet

6.4

Storage Conditions Specifications

Environmental storage condition limits define the temperature and relative humidity

limits to which the device is exposed to while being stored. The specified storage

conditions are for component level prior to board attach (see following notes on post

board attach limits).

Table 6-6

specifies absolute maximum and minimum storage temperature limits which

represent the maximum or minimum device condition beyond which damage, latent or

otherwise, may occur. The table also specifies sustained storage temperature, relative

humidity, and time-duration limits. At conditions outside sustained limits, but within

absolute maximum and minimum ratings, quality and reliability may be affected. These

conditions should not be exceeded in storage or transportation.

Notes:

1.

Refers to a component device that is not assembled in a board or socket that is not to be electrically

connected to a voltage reference or I/O signals.

2.

Specified temperatures are based on data collected. Exceptions for surface mount reflow are specified in by

applicable JEDEC standard and MAS document. Non-adherence may affect processor reliability.

3.

T

ABSOLUTE STORAGE

applies to unassembled component only and does not apply to the shipping media,

moisture barrier bags, or desiccant.

4.

Intel branded board products are certified to meet the following temperature and humidity limits that are

given as an example only (Non-Operating Temperature limit: -40° C to 70° C and Humidity: 50% to 90%

non-condensing with a maximum wet bulb of 28° C) Post board attach storage temperature limits are not

specified for non-Intel branded boards.

5.

The JEDEC, J-JSTD-020 moisture level rating and associated handling practices apply to all moisture

sensitive devices removed from the moisture barrier bag.

6.

Nominal temperature and humidity conditions and durations are given and tested within the constraints

imposed by T

SUSTAINED

and customer shelf live in appl9icable Intel box and bags.

§

Table 6-6.

Storage Conditions

Symbol

Parameter

Min

Max

Notes

T

ABSOLUTE STORAGE

The non-operating device storage

temperature. Damage (latent or otherwise)

may occur when subjected to for any length

of time.

-55 °C

125 °C

1, 2, 3

T

SUSTAINED STORAGE

The ambient storage temperature limit (in

shipping media) for a sustained period of

time

-5 °C

40 °C

4, 5

RH

SUSTAINED STORAGE

The maximum device storage relative

humidity for a sustained period of time

60% @ 24°C

5, 6

Time

SUSTAINED STORAGE

A prolonged or extended period of time;

typically associated with customer shelf life.

0 months

6 months

6

Section	Page
Contents	3
Figures	4
Tables	5
Intel® Core™ i7-900 Desktop Processor Extreme Edition Series and Intel® Core™ i7-900 Desktop Processor Series Features	7
Revision History	8
1 Introduction	9
1.1 Terminology	10
1.2 References	11
2 Electrical Specifications	13
2.1 Intel® QPI Differential Signaling	13
2.2 Power and Ground Lands	13
2.3 Decoupling Guidelines	13
2.3.1 VCC, VTTA, VTTD, VDDQ Decoupling	14
2.4 Processor Clocking (BCLK_DP, BCLK_DN)	14
2.4.1 PLL Power Supply	14
2.5 Voltage Identification (VID)	14
2.6 Reserved or Unused Signals	17
2.7 Signal Groups	18
2.8 Test Access Port (TAP) Connection	19
2.9 Platform Environmental Control Interface (PECI) DC Specifications	20
2.9.1 DC Characteristics	20
2.9.2 Input Device Hysteresis	21
2.10 Absolute Maximum and Minimum Ratings	21
2.11 Processor DC Specifications	22
2.11.1 DC Voltage and Current Specification	23
2.11.2 VCC Overshoot Specification	29
2.11.3 Die Voltage Validation	30
3 Package Mechanical Specifications	31
3.1 Package Mechanical Drawing	31
3.2 Processor Component Keep-Out Zones	34
3.3 Package Loading Specifications	34
3.4 Package Handling Guidelines	34
3.5 Package Insertion Specifications	34
3.6 Processor Mass Specification	35
3.7 Processor Materials	35
3.8 Processor Markings	35
3.9 Processor Land Coordinates	36
4 Land Listing	37
5 Signal Descriptions	67
6 Thermal Specifications	71
6.1 Package Thermal Specifications	71
6.1.1 Thermal Specifications	71
6.1.2 Thermal Metrology	75
6.2 Processor Thermal Features	76
6.2.1 Processor Temperature	76
6.2.2 Adaptive Thermal Monitor	76
6.2.3 THERMTRIP# Signal	79
6.3 Platform Environment Control Interface (PECI)	79
6.3.1 Introduction	79
6.3.2 PECI Specifications	81
6.4 Storage Conditions Specifications	82
7 Features	83
7.1 Power-On Configuration (POC)	83
7.2 Clock Control and Low Power States	83
7.2.1 Thread and Core Power State Descriptions	84
7.2.2 Package Power State Descriptions	85
7.3 Sleep States	86
7.4 ACPI P-States (Intel® Turbo Boost Technology)	86
7.5 Enhanced Intel® SpeedStep® Technology	87
8 Boxed Processor Specifications	89
8.1 Introduction	89
8.2 Mechanical Specifications	90
8.2.1 Boxed Processor Cooling Solution Dimensions	90
8.2.2 Boxed Processor Fan Heatsink Weight	92
8.2.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly	92
8.3 Electrical Requirements	92
8.3.1 Fan Heatsink Power Supply	92
8.4 Thermal Specifications	93
8.4.1 Boxed Processor Cooling Requirements	93

Intel BX80601920 Data Sheet - Page 82

Storage Conditions Specifications

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