Intel BX80601920 Data Sheet - Page 71

Thermal Specifications 6 Thermal Specifications 6.1 6.1.1 Note: Note: Package Thermal Specifications The processor requires a thermal solution to maintain temperatures within its operating limits. Any attempt to operate the processor outside these operating limits may result in permanent damage to the processor and potentially other components within the system. Maintaining the proper thermal environment is key to reliable, long-term system operation. A complete solution includes both component and system level thermal management features. Component level thermal solutions can include active or passive heatsinks attached to the processor integrated heat spreader (IHS). This chapter provides data necessary for developing a complete thermal solution. For more information on designing a component level thermal solution, refer to the appropriate processor Thermal and Mechanical Design Guidelines (see Section 1.2). Thermal Specifications The processor thermal specification uses the on-die Digital Thermal Sensor (DTS) value reported using the PECI interface for all processor temperature measurements. The DTS is a factory calibrated, analog to digital thermal sensor. As a result, it will no longer be necessary to measure the processors case temperature. Consequently, there will be no need for a Thermal Profile specification defining the relationship between the processors TCASE and power dissipation. Unless otherwise specified, the term "DTS" refers to the DTS value returned by the PECI interface gettemp command. A thermal solution that was verified compliant to the processor case temperature thermal profile at the customer defined boundary conditions is expected to be compliant with this update. No redesign of the thermal solution should be necessary. A fan speed control algorithms that was compliant to the previous thermal requirements is also expected to be compliant with this specification. The fan speed control algorithm can be updated to use the additional information to optimize acoustics. To allow the optimal operation and long-term reliability of Intel processor-based systems, the processor thermal solution must deliver the specified thermal solution performance in response to the DTS sensor value. The thermal solution performance will be measured using a Thermal Test Vehicle (TTV). See Table 6-1 and Figure 6-1 for the TTV thermal profile and Table 6-3 for the required thermal solution performance table when DTS values are greater than TCONTROL. Thermal solutions not designed to provide this level of thermal capability may affect the long-term reliability of the processor and system. When the DTS value is less than TCONTROL, the thermal solution performance is not defined and the fans may be slowed down. This is unchanged from the prior specification. For more details on thermal solution design, refer to the appropriate processor Thermal and Mechanical Design Guidelines (see Section 1.2). The processors implement a methodology for managing processor temperatures, which is intended to support acoustic noise reduction through fan speed control and to assure processor reliability. Selection of the appropriate fan speed is based on the relative temperature data reported by the processor's Digital Temperature Sensor (DTS). The DTS can be read using the Platform Environment Control Interface (PECI) as described Datasheet 71