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Intel BX80601920 Data Sheet - Page 25

VCC VTT

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Electrical Specifications Figure 2-3. VCC Static and Transient Tolerance Load Lines 0 VID - 0.000 VID - 0.013 VID - 0.025 VID - 0.038 VID - 0.050 VID - 0.063 VID - 0.075 V c VID - 0.088 c VID - 0.100 V VID - 0.113 VID - 0.125 VID - 0.138 VID - 0.150 VID - 0.163 VID - 0.175 Icc [A] 10 20 30 40 50 60 70 80 90 100 110 120 130 140 Vcc Maximum Vcc Typical Vcc Minimum Table 2-9. VTT Voltage Identification (VID) Definition VTT VR - VID Input VID7 VID6 VID5 VID4 VID3 VID2 VID1 VID0 0 1 0 0 0 0 1 0 0 1 0 0 0 1 1 0 0 1 0 0 1 0 1 0 0 1 0 0 1 1 1 0 0 1 0 1 0 0 1 0 0 1 0 1 0 1 1 0 0 1 0 1 1 0 1 0 0 1 0 1 1 1 1 0 VTT_Typ 1.220 V 1.195 V 1.170 V 1.145 V 1.120 V 1.095 V 1.070 V 1.045 V Note: 1. This is a typical voltage, see Table 2-10 for VTT_Max and VTT_Min voltage. Datasheet 25

Section	Page
Contents	3
Figures	4
Tables	5
Intel® Core™ i7-900 Desktop Processor Extreme Edition Series and Intel® Core™ i7-900 Desktop Processor Series Features	7
Revision History	8
1 Introduction	9
1.1 Terminology	10
1.2 References	11
2 Electrical Specifications	13
2.1 Intel® QPI Differential Signaling	13
2.2 Power and Ground Lands	13
2.3 Decoupling Guidelines	13
2.3.1 VCC, VTTA, VTTD, VDDQ Decoupling	14
2.4 Processor Clocking (BCLK_DP, BCLK_DN)	14
2.4.1 PLL Power Supply	14
2.5 Voltage Identification (VID)	14
2.6 Reserved or Unused Signals	17
2.7 Signal Groups	18
2.8 Test Access Port (TAP) Connection	19
2.9 Platform Environmental Control Interface (PECI) DC Specifications	20
2.9.1 DC Characteristics	20
2.9.2 Input Device Hysteresis	21
2.10 Absolute Maximum and Minimum Ratings	21
2.11 Processor DC Specifications	22
2.11.1 DC Voltage and Current Specification	23
2.11.2 VCC Overshoot Specification	29
2.11.3 Die Voltage Validation	30
3 Package Mechanical Specifications	31
3.1 Package Mechanical Drawing	31
3.2 Processor Component Keep-Out Zones	34
3.3 Package Loading Specifications	34
3.4 Package Handling Guidelines	34
3.5 Package Insertion Specifications	34
3.6 Processor Mass Specification	35
3.7 Processor Materials	35
3.8 Processor Markings	35
3.9 Processor Land Coordinates	36
4 Land Listing	37
5 Signal Descriptions	67
6 Thermal Specifications	71
6.1 Package Thermal Specifications	71
6.1.1 Thermal Specifications	71
6.1.2 Thermal Metrology	75
6.2 Processor Thermal Features	76
6.2.1 Processor Temperature	76
6.2.2 Adaptive Thermal Monitor	76
6.2.3 THERMTRIP# Signal	79
6.3 Platform Environment Control Interface (PECI)	79
6.3.1 Introduction	79
6.3.2 PECI Specifications	81
6.4 Storage Conditions Specifications	82
7 Features	83
7.1 Power-On Configuration (POC)	83
7.2 Clock Control and Low Power States	83
7.2.1 Thread and Core Power State Descriptions	84
7.2.2 Package Power State Descriptions	85
7.3 Sleep States	86
7.4 ACPI P-States (Intel® Turbo Boost Technology)	86
7.5 Enhanced Intel® SpeedStep® Technology	87
8 Boxed Processor Specifications	89
8.1 Introduction	89
8.2 Mechanical Specifications	90
8.2.1 Boxed Processor Cooling Solution Dimensions	90
8.2.2 Boxed Processor Fan Heatsink Weight	92
8.2.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly	92
8.3 Electrical Requirements	92
8.3.1 Fan Heatsink Power Supply	92
8.4 Thermal Specifications	93
8.4.1 Boxed Processor Cooling Requirements	93