AMD AMD-K6-2/400 User Guide - Page 24
AMD-K6™-2E+ Embedded Processor, - 3d processor
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Preliminary Information AMD-K6™-2E+ Embedded Processor Data Sheet 23542A/0-September 2000 x Takes advantage of existing system support, logic integration, and designs for superior value x Provides an easy upgrade path for embedded applications and a bridge to legacy applications s AMD PowerNow!™ technology dynamically manages power and performance x Monitors application requirements for performance or power utilization x Supports continuously varying operating frequency and voltage, delivering performance on demand while dissipating the lowest amount of power possible s 3DNow!™ technology for better multimedia and audio performance x x86 instruction set extension accelerates 3D graphics and other singleprecision floating-point compute-intensive operations x Offers fast frame rates on high-resolution graphics applications, superior modeling of real-world environments and physics, life-like images and graphics, and big-screen sound and video x Additional 3DNow! technology DSP instructions enhance communications applications x Separate multiplier and ALU for superscalar instruction execution s High-performance IEEE 754-compatible and 854-compatible floating-point unit s High-performance industry-standard MMX™ instructions x Dual-integer ALU for superscalar execution s Industry-standard System Management Mode (SMM) s IEEE 1149.1 boundary scan s 321-Pin Ceramic Pin Grid Array (CPGA) or 349-Ball Organic Ball Grid Array (OBGA) package s Low-voltage 0.18-micron process technology x Split-plane power with support for full 3.3 V I/O x Lower core voltages enable low-power operation s Operating frequencies x Standard-power and standard-temperature devices: 400, 450, and 500 MHz x Low-power and extended-temperature devices: 350, 400, and 450 MHz 2 AMD-K6™-2E+ Embedded Processor Chapter 1