AMD AMD-K6-2/400 User Guide - Page 339
Measuring Case Temperature, 17.3 Layout and Airflow Considerations, Voltage Regulator
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23542A/0-September 2000 Preliminary Information AMD-K6™-2E+ Embedded Processor Data Sheet 17.2 Measuring Case Temperature The processor case temperature is measured to ensure that the thermal solution meets the processor's operational specification. This temperature should be measured on the top center of the package, where most of the heat is dissipated. Figure 116 shows the correct location for measuring the case temperature. The tip of the thermocouple should be secured to the package surface with a small amount of thermally conductive epoxy. It is also recommended to secure a second location along the thermocouple to avoid any movement during testing. If a heatsink is installed while measuring, the thermocouple must be installed into the heatsink via a small hole drilled through the heatsink base (for example, 1/16 of an inch). Secure the thermocouple to the base of the heatsink by filling the small hole with thermal epoxy, allowing the tip of the thermocouple to protrude the epoxy and touch the top of the processor case. Thermally Conductive Epoxy Thermocouple Figure 116. Measuring Case Temperature 17.3 Layout and Airflow Considerations Voltage Regulator A voltage regulator is required to support the lower voltage (3.3 V and lower) to the processor. In most applications, the voltage regulator is designed with power transistors. As a result, additional heatsinks are required to dissipate the heat from the power transistors. Figure 117 on page 318 shows the Chapter 17 Thermal Design 317