AMD AMD-K6-2/400 User Guide - Page 336
Package Thermal Specification for Low-Power AMD-K6™-2E, Devices, for Standard-Power AMD-K6™-2E - 400 processor
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Preliminary Information AMD-K6™-2E+ Embedded Processor Data Sheet 23542A/0-September 2000 Table 72. Package Thermal Specification for Low-Power AMD-K6™-2E+ Devices qJC Junction-Case 1.0° C/W Stop Grant Mode Stop Clock Mode TC Case Temperature Maximum Thermal Power 350 MHz 7.50 W 400 MHz 9.50 W 450 MHz 12.00 W 2.50 W 1.60 W 1.90 W 0°C-85°C Table 73. Package Thermal Specification for Standard-Power AMD-K6™-2E+ Devices qJC Junction-Case 1.0°C/W Stop Grant Mode Stop Clock Mode TC Case Temperature Maximum Thermal Power 400 MHz 16.50 W 450 MHz 17.50 W 500 MHz 18.50 W 4.50 W 4.00 W 0°C-70°C Figure 113 on page 315 shows the thermal model of a processor w it h a p as sive t h e rm a l so lut i on. The c a se -t o -a m b ie n t temperature (TCA) can be calculated from the following equation: TCA = PMAX • qCA = PMAX • ( qIF + qSA) Where: PMAX qCA qIF qSA = Maximum Power Consumption = Case-to-Ambient Thermal Resistance = Interface Material Thermal Resistance = Sink-to-Ambient Thermal Resistance 314 Thermal Design Chapter 17