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Intel X38ML Product Specification - Page 124

Design and Environmental Specifications

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Design and Environmental Specifications Intel® Server Board X38ML 8. Design and Environmental Specifications 8.1 Server Board Design Specification Operating the server board at conditions beyond those shown in the following table may cause permanent damage to the system. The table is provided for stress testing purposes only. Exposure to absolute maximum rating conditions for extended periods may affect system reliability. Table 66. Absolute Maximum Ratings Notes: 1. 2. Operating Temperature Storage Temperature Voltage on any signal with respect to ground 3.3 V Supply Voltage with Respect to ground 5 V Supply Voltage with Respect to ground -5 C to 60 C 1 -40 C to +70 C -0.3 V to Vdd + 0.3V 2 -0.3 V to 3.63 V -0.3 V to 5.5 V Chassis design must provide proper airflow to avoid exceeding the processor maximum case temperature. VDD is the supply voltage for the device. 8.2 Product Regulatory Compliance Intended Application - This product was evaluated as Information Technology Equipment (ITE), which may be installed in offices, schools, computer rooms, and similar commercial type locations. The suitability of this product for other product categories and environments (such as: medical, industrial, telecommunications, NEBS, residential, alarm systems, test equipment, and so on), other than an ITE application, may require further evaluation. This is an FCC Class A device. Integration of it into a Class B chassis does not result in a Class B device. 8.2.1 Product Safety Compliance The server board complies with the following safety requirements: ƒ UL 60950 Recognition (USA) ƒ CE Declaration to EU Low Voltage Directive 93/68/EEC (Europe - EN60950) ƒ IEC60950 (International) ƒ CB Certificate and Report, IEC60950 (report to include all country national deviations) ƒ CSA 60950 Certification (Canada) or cUL 8.2.2 Product EMC Compliance - Class A Compliance Note: This product requires complying with Class A EMC requirements. However, Intel targets a 10 db margin to support customer enablement. ƒ FCC - Part 15 Emissions (USA) Verification ƒ CISPR 22 - Emissions (International) ƒ EN55022 - Emissions (Europe) ƒ EN61000-4-2 - ESD (Europe) 112 Revision 1.3 Intel order number E15331-006

Section	Page
1. Introduction	13
1.1 Server Board Use Disclaimer	13
2. Server Board Overview	14
2.1 Server Board Feature Set	14
2.2 Server Board Layout	16
3. Functional Architecture	19
3.1 Processor Subsystem	20
3.2 Intel® X38 Chipset	20
3.2.2.1 Direct Media Interface (DMI)	21
3.2.2.2 PCI Express* Interfaces	21
3.2.2.3 Serial ATA II Interface	22
3.2.2.4 Low Pin Count Interface (LPC)	22
3.2.2.5 Compatibility Modules	22
3.2.2.6 Universal Serial Bus (USB) Controller	22
3.2.2.7 Real Time Clock (RTC)	23
3.2.2.8 GPIO	23
3.2.2.9 Enhanced Power Management	23
3.2.2.10 System Management Interface	23
3.2.2.11 Serial Peripheral Interface (SPI)	23
3.2.2.12 Manageability	24
3.3 Integrated Baseboard Management Controller	24
3.4 Memory Subsystem	27
3.5 I/O Subsystem	28
3.5.2.1 SATA RAID	28
3.5.2.2 Intel® RAID Technology Option ROM	29
3.5.6.1 Serial Ports	30
3.5.6.2 Keyboard and Mouse Support	31
3.5.6.3 Wake-up Control	31
3.6 Replacing the Back-Up Battery	31
4. System BIOS	33
4.1 BIOS Identification String	33
4.2 Logo/Diagnostic Screen	33
4.3 BIOS Setup Utility	34
4.3.1.1 Setup Page Layout	34
4.3.1.2 Entering BIOS Setup	35
4.3.1.3 Keyboard Commands	35
4.3.1.4 Menu Selection Bar	36
4.3.2.1 Main Screen	37
4.3.2.2 Advanced Screen	39
4.3.2.2.1 Processor Configuration Screen	40
4.3.2.2.2 Memory Configuration Screen	42
4.3.2.2.3 SATA Controller Configuration Screen	44
4.3.2.2.4 Serial Ports Screen	45
4.3.2.2.5 USB Configuration Screen	46
4.3.2.2.6 PCI Screen	48
4.3.2.3 Security Screen	49
4.3.2.4 Server Management Screen	51
4.3.2.4.1 Console Redirection Screen	52
4.3.2.4.2 System Information Screen	54
4.3.2.5 Boot Options Screen	55
4.3.2.5.1 Hard Disk Order Screen	56
4.3.2.5.2 CDROM Order Screen	56
4.3.2.5.3 Floppy Order Screen	57
4.3.2.5.4 Network Device Order Screen	58
4.3.2.5.5 BEV Device Order Screen	58
4.3.2.6 Boot Manager	59
4.3.2.7 Error Manager Screen	60
4.3.2.8 Exit Screen	60
4.4 Loading BIOS Defaults	62
4.5 Multiple Boot Blocks	62
4.6 Recovery Mode	63
4.7 OEM Logo	63
5. Platform Management	65
5.1 Platform Management Features	65
5.2 Power System	66
5.2.5.1 Power Button Signal	68
5.2.5.2 Chipset Sleep S4/S5	69
5.2.5.3 Power-On Enable	69
5.2.5.4 Power-down Disable	69
5.3 Advanced Configuration and Power Interface (ACPI)	70
5.4 System Reset Control	71
5.5 BMC Reset Control	72
5.6 System Initialization	72
5.6.2.1 Watchdog Timer Timeout Reason Bits	73
5.7 Integrated Front Panel User Interface	74
5.7.3.1 Chassis Intrusion	75
5.7.3.2 Power Button	75
5.7.3.3 Reset Button	75
5.8 Private Management I2C Buses	76
5.9 Watchdog Timer	76
5.10 BMC Internal Timestamp Clock	76
5.11 System Event Log (SEL)	77
5.12 Sensor Data Record (SDR) Repository	77
5.13 Field Replaceable Unit (FRU) Inventory Device	78
5.14 Sensor Rearm Behavior	79
5.15 Processor Sensors	80
5.15.1.1 ThermTrip Monitoring	80
5.15.1.2 IERR Monitoring	81
5.15.2.1 PECI Interface	81
5.16 Standard Fan Management	81
5.17 Power Unit Management	83
5.18 BMC Self Test	84
5.19 Messaging Interfaces	84
5.19.6.1 LPC/KCS Interface	85
5.19.6.2 Receive Message Queue	86
5.19.6.3 SMS/SMM Status Register	86
5.19.6.4 Server Management Software (SMS) Interface	86
5.19.6.5 SMM Interface	87
5.19.8.1 Serial-over-LAN (SOL 2.0)	88
5.20 Event Filtering and Alerting	88
5.21 Sensor Support	89
5.22 BIOS-BMC interactions	95
5.23 Platform Management Features Implemented by BIOS	95
5.23.2.1 Serial Configuration Settings	96
5.23.2.2 Keystroke Mappings	96
5.23.2.2.1 Standalone <Esc> Key for Headless Operation	96
5.23.2.3 Limitations	97
5.23.2.4 Interface to Server Management	97
5.23.3.1 Channel Access Modes	97
5.23.3.2 Interaction with BIOS Console Redirection	97
5.23.3.3 SOL, EMP and Console Redirection Use Case Model	98
5.23.4.1 PXE BIOS Support	100
5.23.6.1 Password Clear Jumper	101
6. Error Reporting and Handling	102
6.1 Fault Resilient Booting	102
6.2 Error Handling and Logging	103
6.2.2.1 PCI Bus Error	103
6.2.2.2 PCI Express* Errors	103
6.2.2.3 Processor Bus Error	104
6.2.2.4 Memory Bus Error	104
6.2.2.5 Operating System Watchdog Failure	104
6.2.2.6 Boot Event	104
6.2.3.1 Memory Error Events	105
6.2.3.2 Examples of Event Data Field Contents for Memory Errors	106
6.2.3.3 PCI Error Events	106
6.2.3.4 Examples of Event Data Field Contents for PCI Errors	107
6.2.3.5 FRB-2 Error Events	107
6.2.4.1 No Real-Time Clock (RTC) Access	108
6.3 Error Messages and Error Codes	109
7. Connectors and Jumper Blocks	116
7.1 Power Connectors	116
7.2 PCI Express* x16 Connector	116
7.3 SMBus Connector	118
7.4 Front Panel Connector	118
7.5 I/O Connectors	119
7.6 Fan Headers	122
7.7 Chassis Intrusion Header	122
7.8 Jumper Blocks	123
8. Design and Environmental Specifications	124
8.1 Server Board Design Specification	124
8.2 Product Regulatory Compliance	124
8.3 Electromagnetic Compatibility Notices	127
Glossary	128

Match case Limit results 1 per page

Design and Environmental Specifications

Intel® Server Board X38ML

Revision 1.3

Intel order number E15331-006

112

Design and Environmental Specifications

8.1

Server Board Design Specification

Operating the server board at conditions beyond those shown in the following table may cause

permanent damage to the system. The table is provided for stress testing purposes only.

Exposure to absolute maximum rating conditions for extended periods may affect system

reliability.

Table 66. Absolute Maximum Ratings

Operating Temperature

-5

C to 60

Storage Temperature

-40

C to +70

Voltage on any signal with respect to ground

-0.3 V to Vdd + 0.3V

3.3 V Supply Voltage with Respect to ground

-0.3 V to 3.63 V

5 V Supply Voltage with Respect to ground

-0.3 V to 5.5 V

Notes:

Chassis design must provide proper airflow to avoid exceeding the processor maximum case temperature.

VDD is the supply voltage for the device.

8.2

Product Regulatory Compliance

Intended Application

– This product was evaluated as Information Technology Equipment

(ITE), which may be installed in offices, schools, computer rooms, and similar commercial type

locations. The suitability of this product for other product categories and environments (such as:

medical, industrial, telecommunications, NEBS, residential, alarm systems, test equipment, and

so on), other than an ITE application, may require further evaluation. This is an FCC Class A

device. Integration of it into a Class B chassis does not result in a Class B device.

8.2.1

Product Safety Compliance

The server board complies with the following safety requirements:

UL 60950 Recognition (USA)

CE Declaration to EU Low Voltage Directive 93/68/EEC (Europe – EN60950)

IEC60950 (International)

CB Certificate and Report, IEC60950 (report to include all country national deviations)

CSA 60950 Certification (Canada) or cUL

8.2.2

Product EMC Compliance – Class A Compliance

Note:

This product requires complying with Class A EMC requirements. However, Intel targets a

10 db margin to support customer enablement.

FCC – Part 15 Emissions (USA) Verification

CISPR 22 – Emissions (International)

EN55022 - Emissions (Europe)

EN61000-4-2 – ESD (Europe)