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Toshiba Portege M100 Maintenance Manual - Page 324

Do not store the module at temperatures below specifications. Cold can cause the liquid

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Appendices Appendix A Handling the LCD Module 7. Do not expose the module to direct sunlight or strong ultraviolet rays for long periods. 8. Do not store the module at temperatures below specifications. Cold can cause the liquid crystals to freeze, lose their elasticity or otherwise suffer damage. A-4 PORTEGE M100 Maintenance Manual (960-452)

Section	Page
Table of Contents	6
Chapter 1 Hardware Overview	12
1.1 Features	16
1.2 System Unit Block Diagram	21
1.3 3.5-inch Floppy Disk Drive (USB External)	25
1.4 2.5-inch Hard Disk Drive	26
1.5 DVD-ROM Drive	28
1.6 CD-RW/DVD-ROM Drive	29
1.7 Power Supply	30
1.8 Batteries	33
Chapter 2 Troubleshooting Procedures	36
2.1 Troubleshooting	43
2.2 Troubleshooting Flowchart	44
2.3 Power Supply Troubleshooting	48
2.4 System Board Troubleshooting	59
2.5 FDD Troubleshooting	71
2.6 HDD Troubleshooting	74
2.7 Keyboard Troubleshooting	79
2.8 Display Troubleshooting	81
2.9 DVD-ROM Drive Troubleshooting	84
2.10 CD-RW/DVD-ROM Drive Troubleshooting	86
2.11 Modem Troubleshooting	88
2.12 LAN Troubleshooting	90
2.13 Bluetooth Troubleshooting	91
2.14 Wireless LAN Troubleshooting	95
2.15 Sound Troubleshooting	99
Chapter 3 Tests and Diagnostics	102
3.1 The Diagnostic Test	108
3.2 Executing the Diagnostic Test	110
3.3 Subtest Names	114
3.4 System Test	116
3.5 Memory Test	119
3.6 Keyboard Test	120
3.7 Display Test	124
3.8 Floppy Disk Test	127
3.9 Printer Test	129
3.10 Async Test	131
3.11 Hard Disk Test	133
3.12 Real Timer Test	136
3.13 NDP Test	138
3.14 Expansion Test	139
3.15 CD-ROM/DVD-ROM Test	141
3.16 Error Code and Error Status Names	142
3.17 Hard Disk Test Detail Status	145
3.18 Head Cleaning	147
3.19 Log Utilities	148
3.20 Running Test	150
3.21 Floppy Disk Drive Utilities	152
3.22 System Configuration	157
3.23 SETUP	159
3.24 Wireless LAN Test Program (Cisco)	180
3.25 Wireless LAN Test Program (Atheros)	183
3.26 Wireless LAN Test Program (Calexico)	187
3.27 Sound/LAN/Modem Test Program	188
3.28 Bluetooth Test Program	192
3.29 IEEE1394 test program	202
Chapter 4 Replacement Procedures	204
4.1 General	212
4.2 HDD	224
4.3 Slim Select Bay Options	230
4.4 Wireless LAN Card	232
4.5 RTC Battery	239
4.6 Keyboard	243
4.7 Memory Module	247
4.8 Palm Rest and IPS Board	249
4.9 Bluetooth Board	254
4.10 Sound/FIR Board	256
4.11 Modem Daughter Card (MDC)	259
4.12 Wireless Communication Switch Board	261
4.13 Top Cover with Display Assembly	263
4.14 Speakers	268
4.15 System Board	271
4.16 PC Card Slot	275
4.17 I/O Board	278
4.18 Display Mask	281
4.19 FL Inverter Board	284
4.20 LCD Module	286
4.21 LCD/LED Cable	289
4.22 Antenna Coaxial Cables	293
4.23 TFT FL (Model 12.1 Toshiba)	298
Appendices	313
Appendix A Handling the LCD Module	321
Appendix B Board Layout	327
Appendix C Pin Assignment	337
Appendix D Keyboard Scan/Character Codes	367
Appendix E Key Layout	375
Appendix F Wiring Diagrams	379
Appendix G BIOS Rewrite Procedures	381
Appendix H EC/KBC Rewrite Procedures	383