AMD AMD-K6-2/500AFX Data Sheet - Page 307
Table 72., Package Thermal Specification for OPN Suffixes AGR, AFX, and 400AFR, - 500 mhz
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21850J/0-February 2000 Preliminary Information AMD-K6®-2 Processor Data Sheet Table 72. Package Thermal Specification for OPN Suffixes AGR, AFX, and 400AFR θJC Junction-Case 1.0 °C/W Maximum Thermal Power 2.2 V Component 2.3 V Component 400 MHz1 450 MHz 475 MHz 500 MHz 533 MHz2 16.90 W 18.80 W 19.80 W 20.75 W 550 MHz 25.00 W Stop Grant Mode 4.40 W 4.44 W 4.45 W 4.46 W 4.87 W Stop Clock Mode 4.00 W 4.00 W 4.00 W 4.00 W 4.37 W TC Case Temperature 0°C-70°C 0°C-65°C 0°C-70°C Notes: 1. Specifications are applicable to OPN AMD-K6-2/400AFR. 2. The specifications provided for the 533 MHz component are identical to the specifications of the 500 MHz component. Figure 104 on page 288 shows the thermal model of a processor w it h a p a s sive t h e rm a l so l u t i on . The c a s e -t o -a m b i e n t temperature (TCA) can be calculated from the following equation: TCA = PMAX • θCA = PMAX • ( θIF + θSA) Where: PMAX θCA θIF θSA = Maximum Power Consumption = Case-to-Ambient Thermal Resistance = Interface Material Thermal Resistance = Sink-to-Ambient Thermal Resistance Chapter 17 Thermal Design 287