AMD AMD-K6-2/500AFX Data Sheet - Page 310
Heat Dissipation Path, Measuring Case Temperature, Processor Heat Dissipation Path
View all AMD AMD-K6-2/500AFX manuals
Add to My Manuals
Save this manual to your list of manuals |
Page 310 highlights
AMD-K6®-2 Processor Data Sheet Preliminary Information 21850J/0-February 2000 Thermal grease is recommended as interface material because it provides the lowest thermal resistance (≅ 0.20°C/W). The required thermal resistance (θSA) of the heatsink in this example is calculated as follows: θSA = θCA - θIF = 0.676 - 0.20 = 0.476(°C/W) Heat Dissipation Path Figure 106 illustrates the heat dissipation path of the processor. Due to the lower thermal resistance between the processor die junction and case, most of the heat generated by the processor is transferred from the top surface of the case. The small amount of heat generated from the bottom side of the processor where the processor socket blocks the convection can be safely ignored. Ambient Temperature Case temperature Thin Lid Measuring Case Temperature Figure 106. Processor Heat Dissipation Path The processor case temperature is measured to ensure that the thermal solution meets the processor's operational specification. This temperature should be measured on the top center of the package, where most of the heat is dissipated. Figure 107 shows the correct location for measuring the case temperature. If a heatsink is installed while measuring, the thermocouple must be installed into the heatsink via a small hole drilled through the heatsink base (for example, 1/16 of an inch). The thermocouple is then attached to the base of the heatsink and the small hole filled using thermal epoxy, allowing the tip of the thermocouple to touch the top of the processor case. 290 Thermal Design Chapter 17