HP Cluster Platform Interconnects v2010 HP Cluster Platform InfiniBand Interco - Page 33

Cooling and Airflow, 2.2 Unpacking the ISR 9024 Interconnect, IEC Power Receptacle.

Page 33 highlights

The following features are shown: 1. Indicator (green LED ) showing the physical status of each InfiniBand link. 2. Indicator (amber LED ) showing the logical status of each InfiniBand link. 3. Reset button: • Press and hold this button for more than 2 seconds, but less than 6 seconds to reset the management card function without affecting data traffic through the high-speed network. • Press and hold this button for more than 6 seconds to reset the interconnect. This will disrupt data traffic across the high-speed network. 4. Interconnect chassis status indicators. 5. IEC Power Receptacle. 6. 24 4x InfiniBand ports and indicators that provide four transmit copper pairs and four receive copper pairs, each pair with a 2.5 Gb/s throughput. 7. Optional management card Ethernet port, for use only when the front panel port is not in use. 2.1.5 Cooling and Airflow Cooling in the ISR 9024 is passive, by intake of cooled ambient air from the climate-controlled environment of a computer room. A large heat sink transfers heat from the InfiniScale III chip. The heat exchanger provides two heat pipes to transfer energy to the far end of the heat sink and to the chassis. Heated air flows out by convection through the vent holes along the top of the front and rear of the chassis. Cooled air flows into the chassis through the side vent holes. The side entry of air is made possible by a chassis width slightly narrower than the standard rack width. Internally managed ISR 9024 interconnects are equipped with an additional heat sink on the management card. 2.2 Unpacking the ISR 9024 Interconnect The chassis is shipped in a double wall carton, surrounded by shock absorption material. Use the following procedure to unpack the container: 1. Place the carton on a secure work platform at a safe working height. 2. Check the carton to ensure that it is factory sealed and undamaged. If the box shows sign of damage or is unsealed, contact your HP sales or service representative. 3. Use only short-bladed safety knife to slit the sealing tape, ensuring that you do not damage the packaging or shock absorption material. 4. Remove the top box, which contains small parts. Retain the packing list for kit verification. 5. Grasp the sides of the chassis and lift it out of the shock absorption material. 6. Remove the anti-static plastic bag. 7. Retain all the original packing materials for reuse or for return of a defective interconnect. 2.2 Unpacking the ISR 9024 Interconnect 33

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The following features are shown:
1.
Indicator (green LED ) showing the physical status of each InfiniBand link.
2.
Indicator (amber LED ) showing the logical status of each InfiniBand link.
3.
Reset button:
Press and hold this button for more than 2 seconds, but less than 6 seconds to reset the
management card function without affecting data traffic through the high-speed network.
Press and hold this button for more than 6 seconds to reset the interconnect. This will
disrupt data traffic across the high-speed network.
4.
Interconnect chassis status indicators.
5.
IEC Power Receptacle.
6.
24 4x InfiniBand ports and indicators that provide four transmit copper pairs and four receive
copper pairs, each pair with a 2.5 Gb/s throughput.
7.
Optional management card Ethernet port, for use only when the front panel port is not in
use.
2.1.5 Cooling and Airflow
Cooling in the ISR 9024 is passive, by intake of cooled ambient air from the climate-controlled
environment of a computer room. A large heat sink transfers heat from the InfiniScale III chip.
The heat exchanger provides two heat pipes to transfer energy to the far end of the heat sink and
to the chassis. Heated air flows out by convection through the vent holes along the top of the
front and rear of the chassis. Cooled air flows into the chassis through the side vent holes. The
side entry of air is made possible by a chassis width slightly narrower than the standard rack
width. Internally managed ISR 9024 interconnects are equipped with an additional heat sink on
the management card.
2.2 Unpacking the ISR 9024 Interconnect
The chassis is shipped in a double wall carton, surrounded by shock absorption material. Use
the following procedure to unpack the container:
1.
Place the carton on a secure work platform at a safe working height.
2.
Check the carton to ensure that it is factory sealed and undamaged. If the box shows sign
of damage or is unsealed, contact your HP sales or service representative.
3.
Use only short-bladed safety knife to slit the sealing tape, ensuring that you do not damage
the packaging or shock absorption material.
4.
Remove the top box, which contains small parts. Retain the packing list for kit verification.
5.
Grasp the sides of the chassis and lift it out of the shock absorption material.
6.
Remove the anti-static plastic bag.
7.
Retain all the original packing materials for reuse or for return of a defective interconnect.
2.2 Unpacking the ISR 9024 Interconnect
33