HP ProLiant DL170e HP ProLiant DL170e G6 Server Maintenance and Service Guide - Page 71

ProLiant DL170e G6 server., CAUTION, To apply the thermal grease compound

Get HP ProLiant DL170e - G6 Server PDF manuals and user guides View all HP ProLiant DL170e manuals
Add to My Manuals
Save this manual to your list of manuals

Page 71 highlights

Figure 30 Removing the Processor CAUTION: The pins of the socket are very fragile. Do not bend or damage them. CAUTION: Place the processor on a static-dissipating work surface or in an anti-static bag. CAUTION: To allow heat sink to draw as much heat as possible from the processor base, there must be good contact between the heat sink base and the top of the processor. To ensure good contact, you must apply thermal interface material. To apply the thermal grease compound: 1. Use a clean cloth dipped in rubbing alcohol to clean the contact surface on the heat sink and the new processor. Wipe the contact surfaces several times to make sure that no particles or dust contaminants are evident. 2. Apply the thermal grease compound to the CPU contact surface. CAUTION: HP recommends using Shin-Etsu X-23-7783D thermal grease compound for your HP ProLiant DL170e G6 server. 3. Apply all the grease to the top of the processor in one of the following patterns to insure even distribution. Removal and replacement procedures 71

  • 1
  • 2
  • 3
  • 4
  • 5
  • 6
  • 7
  • 8
  • 9
  • 10
  • 11
  • 12
  • 13
  • 14
  • 15
  • 16
  • 17
  • 18
  • 19
  • 20
  • 21
  • 22
  • 23
  • 24
  • 25
  • 26
  • 27
  • 28
  • 29
  • 30
  • 31
  • 32
  • 33
  • 34
  • 35
  • 36
  • 37
  • 38
  • 39
  • 40
  • 41
  • 42
  • 43
  • 44
  • 45
  • 46
  • 47
  • 48
  • 49
  • 50
  • 51
  • 52
  • 53
  • 54
  • 55
  • 56
  • 57
  • 58
  • 59
  • 60
  • 61
  • 62
  • 63
  • 64
  • 65
  • 66
  • 67
  • 68
  • 69
  • 70
  • 71
  • 72
  • 73
  • 74
  • 75
  • 76
  • 77
  • 78
  • 79
  • 80
  • 81
  • 82
  • 83
  • 84
  • 85
  • 86
  • 87
  • 88
  • 89
  • 90
  • 91
  • 92
  • 93
  • 94
  • 95
  • 96
  • 97
  • 98
  • 99
  • 100
  • 101
  • 102
  • 103
  • 104
  • 105
  • 106
  • 107
  • 108
  • 109
  • 110
  • 111
  • 112
  • 113
  • 114
  • 115
  • 116
  • 117
  • 118
  • 119
  • 120
  • 121
  • 122
  • 123
  • 124
  • 125
  • 126
  • 127
  • 128
  • 129
  • 130
  • 131
  • 132
  • 133
  • 134
  • 135
  • 136
  • 137
  • 138
  • 139
  • 140
  • 141
  • 142
  • 143
  • 144
  • 145
  • 146
  • 147
  • 148
  • 149
  • 150
  • 151
  • 152
  • 153
  • 154
  • 155
  • 156
  • 157
  • 158
  • 159
  • 160
  • 161
  • 162
  • 163
  • 164
  • 165
  • 166
  • 167
  • 168
  • 169
  • 170
  • 171
  • 172
  • 173
  • 174
  • 175
  • 176
  • 177
  • 178
  • 179
  • 180
Removal and replacement procedures
71
Figure 30
Removing the Processor
CAUTION:
The pins of the socket are very fragile. Do not bend or damage them.
CAUTION:
Place the processor on a static-dissipating work surface or in an anti-static bag.
CAUTION:
To allow heat sink to draw as much heat as possible from the processor base, there must
be good contact between the heat sink base and the top of the processor. To ensure good contact,
you must apply thermal interface material.
To apply the thermal grease compound:
1.
Use a clean cloth dipped in rubbing alcohol to clean the contact surface on the heat sink and the
new processor. Wipe the contact surfaces several times to make sure that no particles or dust
contaminants are evident.
2.
Apply the thermal grease compound to the CPU contact surface.
CAUTION:
HP recommends using Shin-Etsu X-23-7783D thermal grease compound for your HP
ProLiant DL170e G6 server.
3.
Apply all the grease to the top of the processor in one of the following patterns to insure even
distribution.