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Intel BX80605I7870 Data Sheet - Page 11

Introduction - i7

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Introduction 1 Introduction Note: 1.1 1.1.1 The Intel® Core™ i7 processor Extreme Edition and Intel® Core™ i7 processor are intended for high performance high-end desktop, Uni-processor (UP) server, and workstation systems. The processor implements key new technologies: • Integrated Memory Controller • Point-to-point link interface based on Intel® QuickPath Interconnect (Intel® QPI). Reference to this interface may sometimes be abbreviated with Intel QPI throughout this document. In this document the Intel® Core™ i7 processor Extreme Edition and Intel® Core™ i7 processor will be referred to as "the processor." This datasheet provides register descriptions for some of the registers located on the processor. The processor is optimized for performance with the power efficiencies of a low-power microarchitecture to enable smaller, quieter systems. The Intel® Core™ i7 processor Extreme Edition and Intel® Core™ i7 processor are multi-core processors, based on 45 nm process technology. Processor features vary by component and include up to two Intel QuickPath Interconnect point to point links capable of up to 6.4 GT/s, up to 8 MB of shared cache, and an integrated memory controller. The processors support all the existing Streaming SIMD Extensions 2 (SSE2), Streaming SIMD Extensions 3 (SSE3) and Streaming SIMD Extensions 4 (SSE4). The processor supports several Advanced Technologies: Execute Disable Bit, Intel® 64 Technology, Enhanced Intel SpeedStep® Technology, Intel® Virtualization Technology (Intel® VT), Intel® Turbo Boost Technology, and Hyper-Threading Technology. Terminology A '#' symbol after a signal name refers to an active low signal, indicating a signal is in the active state when driven to a low level. For example, when RESET# is low, a reset has been requested. Processor Terminology Commonly used terms are explained here for clarification: • DDR3 - Double Data Rate 3 synchronous dynamic random access memory (SDRAM) is the name of the new DDR memory standard that is being developed as the successor to DDR2 SDRAM. • Enhanced Intel SpeedStep® Technology - Enhanced Intel SpeedStep Technology allows trade-offs to be made between performance and power consumption. • Execute Disable Bit - Execute Disable allows memory to be marked as executable or non-executable, when combined with a supporting operating system. If code attempts to run in non-executable memory the processor raises an error to the operating system. This feature can prevent some classes of viruses or worms that exploit buffer over run vulnerabilities and can thus help improve the overall security of the system. See the Intel Architecture Software Developer's Manual for Datasheet 11

Section	Page
1 Introduction	11
1.1 Terminology	11
1.1.1 Processor Terminology	11
1.2 References	13
2 Register Description	15
2.1 Register Terminology	15
2.2 Platform Configuration Structure	16
2.3 Device Mapping	17
2.4 Detailed Configuration Space Maps	18
2.5 PCI Standard Registers	36
2.5.1 VID - Vendor Identification Register	36
2.5.2 DID - Device Identification Register	36
2.5.3 RID - Revision Identification Register	37
2.5.4 CCR - Class Code Register	37
2.5.5 HDR - Header Type Register	38
2.5.6 SID/SVID - Subsystem Identity/Subsystem Vendor Identification Register	38
2.5.7 PCICMD - Command Register	39
2.5.8 PCISTS - PCI Status Register	40
2.6 SAD - System Address Decoder Registers	41
2.6.1 SAD_PAM0123	41
2.6.2 SAD_PAM456	43
2.6.3 SAD_HEN	44
2.6.4 SAD_SMRAM	44
2.6.5 SAD_PCIEXBAR	45
2.6.6 SAD_DRAM_RULE_0, SAD_DRAM_RULE_1, SAD_DRAM_RULE_2, SAD_DRAM_RULE_3 SAD_DRAM_RULE_4, SAD_DRAM_RULE_5 SAD_DRAM_RULE_6, SAD_DRAM_RULE_7	45
2.6.7 SAD_INTERLEAVE_LIST_0, SAD_INTERLEAVE_LIST_1 SAD_INTERLEAVE_LIST_2, SAD_INTERLEAVE_LIST_3 SAD_INTERLEAVE_LIST_4, SAD_INTERLEAVE_LIST_5 SAD_INTERLEAVE_LIST_6, SAD_INTERLEAVE_LIST_7	46
2.7 Intel QPI Link Registers	47
2.7.1 QPI_QPILCL_L0, QPI_QPILCL_L1	47
2.8 Integrated Memory Controller Control Registers	47
2.8.1 MC_CONTROL	47
2.8.2 MC_STATUS	49
2.8.3 MC_SMI_SPARE_DIMM_ERROR_STATUS	50
2.8.4 MC_SMI_SPARE_CNTRL	51
2.8.5 MC_RESET_CONTROL	51
2.8.6 MC_CHANNEL_MAPPER	52
2.8.7 MC_MAX_DOD	53
2.8.8 MC_RD_CRDT_INIT	54
2.8.9 MC_CRDT_WR_THLD	55
2.8.10 MC_SCRUBADDR_LO	55
2.8.11 MC_SCRUBADDR_HI	56
2.9 TAD - Target Address Decoder Registers	57
2.9.1 TAD_DRAM_RULE_0, TAD_DRAM_RULE_1 TAD_DRAM_RULE_2, TAD_DRAM_RULE_3 TAD_DRAM_RULE_4, TAD_DRAM_RULE_5 TAD_DRAM_RULE_6, TAD_DRAM_RULE_7	57
2.9.2 TAD_INTERLEAVE_LIST_0, TAD_INTERLEAVE_LIST_1 TAD_INTERLEAVE_LIST_2, TAD_INTERLEAVE_LIST_3 TAD_INTERLEAVE_LIST_4, TAD_INTERLEAVE_LIST_5 TAD_INTERLEAVE_LIST_6, TAD_INTERLEAVE_LIST_7	58
2.10 Integrated Memory Controller Channel Control Registers	59
2.10.1 MC_CHANNEL_0_DIMM_RESET_CMD MC_CHANNEL_1_DIMM_RESET_CMD MC_CHANNEL_2_DIMM_RESET_CMD	59
2.10.2 MC_CHANNEL_0_DIMM_INIT_CMD MC_CHANNEL_1_DIMM_INIT_CMD MC_CHANNEL_2_DIMM_INIT_CMD	60
2.10.3 MC_CHANNEL_0_DIMM_INIT_PARAMS MC_CHANNEL_1_DIMM_INIT_PARAMS MC_CHANNEL_2_DIMM_INIT_PARAMS	61
2.10.4 MC_CHANNEL_0_DIMM_INIT_STATUS MC_CHANNEL_1_DIMM_INIT_STATUS MC_CHANNEL_2_DIMM_INIT_STATUS	62
2.10.5 MC_CHANNEL_0_DDR3CMD MC_CHANNEL_1_DDR3CMD MC_CHANNEL_2_DDR3CMD	63
2.10.6 MC_CHANNEL_0_REFRESH_THROTTLE_SUPPORT MC_CHANNEL_1_REFRESH_THROTTLE_SUPPORT MC_CHANNEL_2_REFRESH_THROTTLE_SUPPORT	64
2.10.7 MC_CHANNEL_0_MRS_VALUE_0_1 MC_CHANNEL_1_MRS_VALUE_0_1 MC_CHANNEL_2_MRS_VALUE_0_1	64
2.10.8 MC_CHANNEL_0_MRS_VALUE_2 MC_CHANNEL_1_MRS_VALUE_2 MC_CHANNEL_2_MRS_VALUE_2	65
2.10.9 MC_CHANNEL_0_RANK_PRESENT MC_CHANNEL_1_RANK_PRESENT MC_CHANNEL_2_RANK_PRESENT	65
2.10.10 MC_CHANNEL_0_RANK_TIMING_A MC_CHANNEL_1_RANK_TIMING_A MC_CHANNEL_2_RANK_TIMING_A	66
2.10.11 MC_CHANNEL_0_RANK_TIMING_B MC_CHANNEL_1_RANK_TIMING_B MC_CHANNEL_2_RANK_TIMING_B	69
2.10.12 MC_CHANNEL_0_BANK_TIMING MC_CHANNEL_1_BANK_TIMING MC_CHANNEL_2_BANK_TIMING	70
2.10.13 MC_CHANNEL_0_REFRESH_TIMING MC_CHANNEL_1_REFRESH_TIMING MC_CHANNEL_2_REFRESH_TIMING	70
2.10.14 MC_CHANNEL_0_CKE_TIMING MC_CHANNEL_1_CKE_TIMING MC_CHANNEL_2_CKE_TIMING	71
2.10.15 MC_CHANNEL_0_ZQ_TIMING MC_CHANNEL_1_ZQ_TIMING MC_CHANNEL_2_ZQ_TIMING	71
2.10.16 MC_CHANNEL_0_RCOMP_PARAMS MC_CHANNEL_1_RCOMP_PARAMS MC_CHANNEL_2_RCOMP_PARAMS	72
2.10.17 MC_CHANNEL_0_ODT_PARAMS1 MC_CHANNEL_1_ODT_PARAMS1 MC_CHANNEL_2_ODT_PARAMS1	72
2.10.18 MC_CHANNEL_0_ODT_PARAMS2 MC_CHANNEL_1_ODT_PARAMS2 MC_CHANNEL_2_ODT_PARAMS2	73
2.10.19 MC_CHANNEL_0_ODT_MATRIX_RANK_0_3_RD MC_CHANNEL_1_ODT_MATRIX_RANK_0_3_RD MC_CHANNEL_2_ODT_MATRIX_RANK_0_3_RD	73
2.10.20 MC_CHANNEL_0_ODT_MATRIX_RANK_4_7_RD MC_CHANNEL_1_ODT_MATRIX_RANK_4_7_RD MC_CHANNEL_2_ODT_MATRIX_RANK_4_7_RD	74
2.10.21 MC_CHANNEL_0_ODT_MATRIX_RANK_0_3_WR MC_CHANNEL_1_ODT_MATRIX_RANK_0_3_WR MC_CHANNEL_2_ODT_MATRIX_RANK_0_3_WR	74
2.10.22 MC_CHANNEL_0_ODT_MATRIX_RANK_4_7_WR MC_CHANNEL_1_ODT_MATRIX_RANK_4_7_WR MC_CHANNEL_2_ODT_MATRIX_RANK_4_7_WR	74
2.10.23 MC_CHANNEL_0_WAQ_PARAMS MC_CHANNEL_1_WAQ_PARAMS MC_CHANNEL_2_WAQ_PARAMS	75
2.10.24 MC_CHANNEL_0_SCHEDULER_PARAMS MC_CHANNEL_1_SCHEDULER_PARAMS MC_CHANNEL_2_SCHEDULER_PARAMS	76
2.10.25 MC_CHANNEL_0_MAINTENANCE_OPS MC_CHANNEL_1_MAINTENANCE_OPS MC_CHANNEL_2_MAINTENANCE_OPS	76
2.10.26 MC_CHANNEL_0_TX_BG_SETTINGS MC_CHANNEL_1_TX_BG_SETTINGS MC_CHANNEL_2_TX_BG_SETTINGS	77
2.10.27 MC_CHANNEL_0_RX_BGF_SETTINGS MC_CHANNEL_1_RX_BGF_SETTINGS MC_CHANNEL_2_RX_BGF_SETTINGS	77
2.10.28 MC_CHANNEL_0_EW_BGF_SETTINGS MC_CHANNEL_1_EW_BGF_SETTINGS MC_CHANNEL_2_EW_BGF_SETTINGS	78
2.10.29 MC_CHANNEL_0_EW_BGF_OFFSET_SETTINGS MC_CHANNEL_1_EW_BGF_OFFSET_SETTINGS MC_CHANNEL_2_EW_BGF_OFFSET_SETTINGS	78
2.10.30 MC_CHANNEL_0_ROUND_TRIP_LATENCY MC_CHANNEL_1_ROUND_TRIP_LATENCY MC_CHANNEL_2_ROUND_TRIP_LATENCY	78
2.10.31 MC_CHANNEL_0_PAGETABLE_PARAMS1 MC_CHANNEL_1_PAGETABLE_PARAMS1 MC_CHANNEL_2_PAGETABLE_PARAMS1	79
2.10.32 MC_CHANNEL_0_PAGETABLE_PARAMS2 MC_CHANNEL_1_PAGETABLE_PARAMS2 MC_CHANNEL_2_PAGETABLE_PARAMS2	79
2.10.33 MC_TX_BG_CMD_DATA_RATIO_SETTINGS_CH0 MC_TX_BG_CMD_DATA_RATIO_SETTINGS_CH1 MC_TX_BG_CMD_DATA_RATIO_SETTINGS_CH2	80
2.10.34 MC_TX_BG_CMD_OFFSET_SETTINGS_CH0 MC_TX_BG_CMD_OFFSET_SETTINGS_CH1 MC_TX_BG_CMD_OFFSET_SETTINGS_CH2	80
2.10.35 MC_TX_BG_DATA_OFFSET_SETTINGS_CH0 MC_TX_BG_DATA_OFFSET_SETTINGS_CH1 MC_TX_BG_DATA_OFFSET_SETTINGS_CH2	80
2.10.36 MC_CHANNEL_0_ADDR_MATCH MC_CHANNEL_1_ADDR_MATCH MC_CHANNEL_2_ADDR_MATCH	81
2.10.37 MC_CHANNEL_0_ECC_ERROR_MASK MC_CHANNEL_1_ECC_ERROR_MASK MC_CHANNEL_2_ECC_ERROR_MASK	82
2.10.38 MC_CHANNEL_0_ECC_ERROR_INJECT MC_CHANNEL_1_ECC_ERROR_INJECT MC_CHANNEL_2_ECC_ERROR_INJECT	82
2.10.39 Error Injection Implementation	83
2.11 Integrated Memory Controller Channel Address Registers	84
2.11.1 MC_DOD_CH0_0, MC_DOD_CH0_1, MC_DOD_CH0_2	84
2.11.2 MC_DOD_CH1_0, MC_DOD_CH1_1, MC_DOD_CH1_2	85
2.11.3 MC_DOD_CH2_0, MC_DOD_CH2_1, MC_DOD_CH2_2	86
2.11.4 MC_SAG_CH0_0, MC_SAG_CH0_1, MC_SAG_CH0_2 MC_SAG_CH0_3, MC_SAG_CH0_4, MC_SAG_CH0_5 MC_SAG_CH0_6, MC_SAG_CH0_7, MC_SAG_CH1_...	87
2.12 Integrated Memory Controller Channel Rank Registers	88
2.12.1 MC_RIR_LIMIT_CH0_0, MC_RIR_LIMIT_CH0_1 MC_RIR_LIMIT_CH0_2, MC_RIR_LIMIT_CH0_3 MC_RIR_LIMIT_CH0_4, MC_RIR_LIMIT_CH0_5 MC_R...	88
2.12.2 MC_RIR_WAY_CH0_0, MC_RIR_WAY_CH0_1 MC_RIR_WAY_CH0_2, MC_RIR_WAY_CH0_3 MC_RIR_WAY_CH0_4, MC_RIR_WAY_CH0_5 MC_RIR_WAY_CH0_6...	89
2.12.3 MC_RIR_WAY_CH1_0, MC_RIR_WAY_CH1_1 MC_RIR_WAY_CH1_2, MC_RIR_WAY_CH1_3 MC_RIR_WAY_CH1_4, MC_RIR_WAY_CH1_5 MC_RIR_WAY_CH1_6...	90
2.12.4 MC_RIR_WAY_CH2_0, MC_RIR_WAY_CH2_1 MC_RIR_WAY_CH2_2, MC_RIR_WAY_CH2_3 MC_RIR_WAY_CH2_4, MC_RIR_WAY_CH2_5 MC_RIR_WAY_CH2_6...	91
2.13 Memory Thermal Control	92
2.13.1 MC_THERMAL_CONTROL0 MC_THERMAL_CONTROL1 MC_THERMAL_CONTROL2	92
2.13.2 MC_THERMAL_STATUS0 MC_THERMAL_STATUS1 MC_THERMAL_STATUS2	92
2.13.3 MC_THERMAL_DEFEATURE0 MC_THERMAL_DEFEATURE1 MC_THERMAL_DEFEATURE2	93
2.13.4 MC_THERMAL_PARAMS_A0 MC_THERMAL_PARAMS_A1 MC_THERMAL_PARAMS_A2	93
2.13.5 MC_THERMAL_PARAMS_B0 MC_THERMAL_PARAMS_B1 MC_THERMAL_PARAMS_B2	94
2.13.6 MC_COOLING_COEF0 MC_COOLING_COEF1 MC_COOLING_COEF2	94
2.13.7 MC_CLOSED_LOOP0 MC_CLOSED_LOOP1 MC_CLOSED_LOOP2	95
2.13.8 MC_THROTTLE_OFFSET0 MC_THROTTLE_OFFSET1 MC_THROTTLE_OFFSET2	95
2.13.9 MC_RANK_VIRTUAL_TEMP0 MC_RANK_VIRTUAL_TEMP1 MC_RANK_VIRTUAL_TEMP2	96
2.13.10 MC_DDR_THERM_COMMAND0 MC_DDR_THERM_COMMAND1 MC_DDR_THERM_COMMAND2	96
2.13.11 MC_DDR_THERM_STATUS0 MC_DDR_THERM_STATUS1 MC_DDR_THERM_STATUS2	97
2.14 Integrated Memory Controller Miscellaneous Registers	97
2.14.1 MC_DIMM_CLK_RATIO_STATUS	97

Match case Limit results 1 per page

Datasheet

Introduction

The Intel

Core™ i7 processor Extreme Edition and Intel

Core™ i7 processor are

intended for high performance high-end desktop, Uni-processor (UP) server, and

workstation systems. The processor implements key new technologies:

•

Integrated Memory Controller

•

Point-to-point link interface based on Intel

QuickPath Interconnect (Intel

QPI).

Reference to this interface may sometimes be abbreviated with Intel QPI

throughout this document.

Note:

In this document the Intel

Core™ i7 processor Extreme Edition and Intel

Core™ i7

processor will be referred to as “the processor.”

This datasheet provides register descriptions for some of the registers located on the

processor.

The processor is optimized for performance with the power efficiencies of a low-power

microarchitecture to enable smaller, quieter systems.

The Intel

Core™ i7 processor Extreme Edition and Intel

Core™ i7 processor are

multi-core processors, based on 45 nm process technology. Processor features vary by

component and include up to two Intel QuickPath Interconnect point to point links

capable of up to 6.4 GT/s, up to 8 MB of shared cache, and an integrated memory

controller. The processors support all the existing Streaming SIMD Extensions 2

(SSE2), Streaming SIMD Extensions 3 (SSE3) and Streaming SIMD Extensions 4

(SSE4). The processor supports several Advanced Technologies: Execute Disable Bit,

Intel

64 Technology, Enhanced Intel SpeedStep

Technology, Intel

Virtualization

Technology (Intel

VT), Intel

Turbo Boost Technology, and Hyper-Threading

Technology.

1.1

Terminology

A ‘#’ symbol after a signal name refers to an active low signal, indicating a signal is in

the active state when driven to a low level. For example, when RESET# is low, a reset

has been requested.

1.1.1

Processor Terminology

Commonly used terms are explained here for clarification:

•

DDR3

— Double Data Rate 3 synchronous dynamic random access memory

(SDRAM) is the name of the new DDR memory standard that is being developed as

the successor to DDR2 SDRAM.

•

Enhanced Intel SpeedStep

Technology

— Enhanced Intel SpeedStep

Technology allows trade-offs to be made between performance and power

consumption.

•

Execute Disable Bit

— Execute Disable allows memory to be marked as

executable or non-executable, when combined with a supporting operating system.

If code attempts to run in non-executable memory the processor raises an error to

the operating system. This feature can prevent some classes of viruses or worms

that exploit buffer over run vulnerabilities and can thus help improve the overall

security of the system. See the

Intel Architecture Software Developer's Manual

for