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Intel BX80605I7870 Data Sheet - Page 12

Core™ i7 processor Extreme Edition and Intel - core i7

UPC - 735858210461

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Introduction more detailed information. Refer to http://developer.intel.com/ for future reference on up to date nomenclatures. • Eye Definitions - The eye at any point along the data channel is defined to be the creation of overlapping of a large number of Unit Interval of the data signal and timing width measured with respect to the edges of a separate clock signal at any other point. Each differential signal pair by combining the D+ and D- signals produces a signal eye. • 1366-land LGA package - The processor is available in a Flip-Chip Land Grid Array (FC-LGA) package, consisting of the processor die mounted on a land grid array substrate with an integrated heat spreader (IHS). • Functional Operation - Refers to the normal operating conditions in which all processor specifications, including DC, AC, system bus, signal quality, mechanical, and thermal, are satisfied. • Integrated Memory Controller (IMC) - A memory controller that is integrated in the processor silicon. • Integrated Heat Spreader (IHS) - A component of the processor package used to enhance the thermal performance of the package. Component thermal solutions interface with the processor at the IHS surface. • Intel® 64 Architecture - An enhancement to Intel's IA-32 architecture, allowing the processor to execute operating systems and applications written to take advantage of Intel 64. Further details on Intel 64 architecture and programming model can be found at http://developer.intel.com/technology/intel64/. • Intel® QuickPath Interconnect - A cache-coherent, link-based interconnect specification for Intel processor, chipset, and I/O bridge components. Sometimes abbreviated as Intel QPI. • Intel® QPI - Abbreviation for Intel® QuickPath Interconnect. • Intel® Virtualization Technology (Intel® VT) - A set of hardware enhancements to Intel server and client platforms that can improve virtualization solutions. Intel VT provides a foundation for widely-deployed virtualization solutions and enables more robust hardware assisted virtualization solutions. More information can be found at: http://www.intel.com/technology/virtualization/ • Jitter - Any timing variation of a transition edge or edges from the defined Unit Interval. • LGA1366 Socket - The processor (in the LGA-1366 package) mates with the system board through this surface mount, 1366-contact socket. • Mirror Port - Pads located on the top side of the processor package used to provide logic analyzer probing access for Intel QPI signal analysis. • Non-core - The portion of the processor comprising the shared cache, IMC and Intel QPI Link interface. • OEM - Original Equipment Manufacturer. • Storage Conditions - Refers to a non-operational state. The processor may be installed in a platform, in a tray, or loose. Processors may be sealed in packaging or exposed to free air. Under these conditions, processor lands should not be connected to any supply voltages, have any I/Os biased, or receive any clocks. • Intel® Core™ i7 processor Extreme Edition and Intel® Core™ i7 processor - The desktop product, including processor substrate and integrated heat spreader (IHS). 12 Datasheet

Section	Page
1 Introduction	11
1.1 Terminology	11
1.1.1 Processor Terminology	11
1.2 References	13
2 Register Description	15
2.1 Register Terminology	15
2.2 Platform Configuration Structure	16
2.3 Device Mapping	17
2.4 Detailed Configuration Space Maps	18
2.5 PCI Standard Registers	36
2.5.1 VID - Vendor Identification Register	36
2.5.2 DID - Device Identification Register	36
2.5.3 RID - Revision Identification Register	37
2.5.4 CCR - Class Code Register	37
2.5.5 HDR - Header Type Register	38
2.5.6 SID/SVID - Subsystem Identity/Subsystem Vendor Identification Register	38
2.5.7 PCICMD - Command Register	39
2.5.8 PCISTS - PCI Status Register	40
2.6 SAD - System Address Decoder Registers	41
2.6.1 SAD_PAM0123	41
2.6.2 SAD_PAM456	43
2.6.3 SAD_HEN	44
2.6.4 SAD_SMRAM	44
2.6.5 SAD_PCIEXBAR	45
2.6.6 SAD_DRAM_RULE_0, SAD_DRAM_RULE_1, SAD_DRAM_RULE_2, SAD_DRAM_RULE_3 SAD_DRAM_RULE_4, SAD_DRAM_RULE_5 SAD_DRAM_RULE_6, SAD_DRAM_RULE_7	45
2.6.7 SAD_INTERLEAVE_LIST_0, SAD_INTERLEAVE_LIST_1 SAD_INTERLEAVE_LIST_2, SAD_INTERLEAVE_LIST_3 SAD_INTERLEAVE_LIST_4, SAD_INTERLEAVE_LIST_5 SAD_INTERLEAVE_LIST_6, SAD_INTERLEAVE_LIST_7	46
2.7 Intel QPI Link Registers	47
2.7.1 QPI_QPILCL_L0, QPI_QPILCL_L1	47
2.8 Integrated Memory Controller Control Registers	47
2.8.1 MC_CONTROL	47
2.8.2 MC_STATUS	49
2.8.3 MC_SMI_SPARE_DIMM_ERROR_STATUS	50
2.8.4 MC_SMI_SPARE_CNTRL	51
2.8.5 MC_RESET_CONTROL	51
2.8.6 MC_CHANNEL_MAPPER	52
2.8.7 MC_MAX_DOD	53
2.8.8 MC_RD_CRDT_INIT	54
2.8.9 MC_CRDT_WR_THLD	55
2.8.10 MC_SCRUBADDR_LO	55
2.8.11 MC_SCRUBADDR_HI	56
2.9 TAD - Target Address Decoder Registers	57
2.9.1 TAD_DRAM_RULE_0, TAD_DRAM_RULE_1 TAD_DRAM_RULE_2, TAD_DRAM_RULE_3 TAD_DRAM_RULE_4, TAD_DRAM_RULE_5 TAD_DRAM_RULE_6, TAD_DRAM_RULE_7	57
2.9.2 TAD_INTERLEAVE_LIST_0, TAD_INTERLEAVE_LIST_1 TAD_INTERLEAVE_LIST_2, TAD_INTERLEAVE_LIST_3 TAD_INTERLEAVE_LIST_4, TAD_INTERLEAVE_LIST_5 TAD_INTERLEAVE_LIST_6, TAD_INTERLEAVE_LIST_7	58
2.10 Integrated Memory Controller Channel Control Registers	59
2.10.1 MC_CHANNEL_0_DIMM_RESET_CMD MC_CHANNEL_1_DIMM_RESET_CMD MC_CHANNEL_2_DIMM_RESET_CMD	59
2.10.2 MC_CHANNEL_0_DIMM_INIT_CMD MC_CHANNEL_1_DIMM_INIT_CMD MC_CHANNEL_2_DIMM_INIT_CMD	60
2.10.3 MC_CHANNEL_0_DIMM_INIT_PARAMS MC_CHANNEL_1_DIMM_INIT_PARAMS MC_CHANNEL_2_DIMM_INIT_PARAMS	61
2.10.4 MC_CHANNEL_0_DIMM_INIT_STATUS MC_CHANNEL_1_DIMM_INIT_STATUS MC_CHANNEL_2_DIMM_INIT_STATUS	62
2.10.5 MC_CHANNEL_0_DDR3CMD MC_CHANNEL_1_DDR3CMD MC_CHANNEL_2_DDR3CMD	63
2.10.6 MC_CHANNEL_0_REFRESH_THROTTLE_SUPPORT MC_CHANNEL_1_REFRESH_THROTTLE_SUPPORT MC_CHANNEL_2_REFRESH_THROTTLE_SUPPORT	64
2.10.7 MC_CHANNEL_0_MRS_VALUE_0_1 MC_CHANNEL_1_MRS_VALUE_0_1 MC_CHANNEL_2_MRS_VALUE_0_1	64
2.10.8 MC_CHANNEL_0_MRS_VALUE_2 MC_CHANNEL_1_MRS_VALUE_2 MC_CHANNEL_2_MRS_VALUE_2	65
2.10.9 MC_CHANNEL_0_RANK_PRESENT MC_CHANNEL_1_RANK_PRESENT MC_CHANNEL_2_RANK_PRESENT	65
2.10.10 MC_CHANNEL_0_RANK_TIMING_A MC_CHANNEL_1_RANK_TIMING_A MC_CHANNEL_2_RANK_TIMING_A	66
2.10.11 MC_CHANNEL_0_RANK_TIMING_B MC_CHANNEL_1_RANK_TIMING_B MC_CHANNEL_2_RANK_TIMING_B	69
2.10.12 MC_CHANNEL_0_BANK_TIMING MC_CHANNEL_1_BANK_TIMING MC_CHANNEL_2_BANK_TIMING	70
2.10.13 MC_CHANNEL_0_REFRESH_TIMING MC_CHANNEL_1_REFRESH_TIMING MC_CHANNEL_2_REFRESH_TIMING	70
2.10.14 MC_CHANNEL_0_CKE_TIMING MC_CHANNEL_1_CKE_TIMING MC_CHANNEL_2_CKE_TIMING	71
2.10.15 MC_CHANNEL_0_ZQ_TIMING MC_CHANNEL_1_ZQ_TIMING MC_CHANNEL_2_ZQ_TIMING	71
2.10.16 MC_CHANNEL_0_RCOMP_PARAMS MC_CHANNEL_1_RCOMP_PARAMS MC_CHANNEL_2_RCOMP_PARAMS	72
2.10.17 MC_CHANNEL_0_ODT_PARAMS1 MC_CHANNEL_1_ODT_PARAMS1 MC_CHANNEL_2_ODT_PARAMS1	72
2.10.18 MC_CHANNEL_0_ODT_PARAMS2 MC_CHANNEL_1_ODT_PARAMS2 MC_CHANNEL_2_ODT_PARAMS2	73
2.10.19 MC_CHANNEL_0_ODT_MATRIX_RANK_0_3_RD MC_CHANNEL_1_ODT_MATRIX_RANK_0_3_RD MC_CHANNEL_2_ODT_MATRIX_RANK_0_3_RD	73
2.10.20 MC_CHANNEL_0_ODT_MATRIX_RANK_4_7_RD MC_CHANNEL_1_ODT_MATRIX_RANK_4_7_RD MC_CHANNEL_2_ODT_MATRIX_RANK_4_7_RD	74
2.10.21 MC_CHANNEL_0_ODT_MATRIX_RANK_0_3_WR MC_CHANNEL_1_ODT_MATRIX_RANK_0_3_WR MC_CHANNEL_2_ODT_MATRIX_RANK_0_3_WR	74
2.10.22 MC_CHANNEL_0_ODT_MATRIX_RANK_4_7_WR MC_CHANNEL_1_ODT_MATRIX_RANK_4_7_WR MC_CHANNEL_2_ODT_MATRIX_RANK_4_7_WR	74
2.10.23 MC_CHANNEL_0_WAQ_PARAMS MC_CHANNEL_1_WAQ_PARAMS MC_CHANNEL_2_WAQ_PARAMS	75
2.10.24 MC_CHANNEL_0_SCHEDULER_PARAMS MC_CHANNEL_1_SCHEDULER_PARAMS MC_CHANNEL_2_SCHEDULER_PARAMS	76
2.10.25 MC_CHANNEL_0_MAINTENANCE_OPS MC_CHANNEL_1_MAINTENANCE_OPS MC_CHANNEL_2_MAINTENANCE_OPS	76
2.10.26 MC_CHANNEL_0_TX_BG_SETTINGS MC_CHANNEL_1_TX_BG_SETTINGS MC_CHANNEL_2_TX_BG_SETTINGS	77
2.10.27 MC_CHANNEL_0_RX_BGF_SETTINGS MC_CHANNEL_1_RX_BGF_SETTINGS MC_CHANNEL_2_RX_BGF_SETTINGS	77
2.10.28 MC_CHANNEL_0_EW_BGF_SETTINGS MC_CHANNEL_1_EW_BGF_SETTINGS MC_CHANNEL_2_EW_BGF_SETTINGS	78
2.10.29 MC_CHANNEL_0_EW_BGF_OFFSET_SETTINGS MC_CHANNEL_1_EW_BGF_OFFSET_SETTINGS MC_CHANNEL_2_EW_BGF_OFFSET_SETTINGS	78
2.10.30 MC_CHANNEL_0_ROUND_TRIP_LATENCY MC_CHANNEL_1_ROUND_TRIP_LATENCY MC_CHANNEL_2_ROUND_TRIP_LATENCY	78
2.10.31 MC_CHANNEL_0_PAGETABLE_PARAMS1 MC_CHANNEL_1_PAGETABLE_PARAMS1 MC_CHANNEL_2_PAGETABLE_PARAMS1	79
2.10.32 MC_CHANNEL_0_PAGETABLE_PARAMS2 MC_CHANNEL_1_PAGETABLE_PARAMS2 MC_CHANNEL_2_PAGETABLE_PARAMS2	79
2.10.33 MC_TX_BG_CMD_DATA_RATIO_SETTINGS_CH0 MC_TX_BG_CMD_DATA_RATIO_SETTINGS_CH1 MC_TX_BG_CMD_DATA_RATIO_SETTINGS_CH2	80
2.10.34 MC_TX_BG_CMD_OFFSET_SETTINGS_CH0 MC_TX_BG_CMD_OFFSET_SETTINGS_CH1 MC_TX_BG_CMD_OFFSET_SETTINGS_CH2	80
2.10.35 MC_TX_BG_DATA_OFFSET_SETTINGS_CH0 MC_TX_BG_DATA_OFFSET_SETTINGS_CH1 MC_TX_BG_DATA_OFFSET_SETTINGS_CH2	80
2.10.36 MC_CHANNEL_0_ADDR_MATCH MC_CHANNEL_1_ADDR_MATCH MC_CHANNEL_2_ADDR_MATCH	81
2.10.37 MC_CHANNEL_0_ECC_ERROR_MASK MC_CHANNEL_1_ECC_ERROR_MASK MC_CHANNEL_2_ECC_ERROR_MASK	82
2.10.38 MC_CHANNEL_0_ECC_ERROR_INJECT MC_CHANNEL_1_ECC_ERROR_INJECT MC_CHANNEL_2_ECC_ERROR_INJECT	82
2.10.39 Error Injection Implementation	83
2.11 Integrated Memory Controller Channel Address Registers	84
2.11.1 MC_DOD_CH0_0, MC_DOD_CH0_1, MC_DOD_CH0_2	84
2.11.2 MC_DOD_CH1_0, MC_DOD_CH1_1, MC_DOD_CH1_2	85
2.11.3 MC_DOD_CH2_0, MC_DOD_CH2_1, MC_DOD_CH2_2	86
2.11.4 MC_SAG_CH0_0, MC_SAG_CH0_1, MC_SAG_CH0_2 MC_SAG_CH0_3, MC_SAG_CH0_4, MC_SAG_CH0_5 MC_SAG_CH0_6, MC_SAG_CH0_7, MC_SAG_CH1_...	87
2.12 Integrated Memory Controller Channel Rank Registers	88
2.12.1 MC_RIR_LIMIT_CH0_0, MC_RIR_LIMIT_CH0_1 MC_RIR_LIMIT_CH0_2, MC_RIR_LIMIT_CH0_3 MC_RIR_LIMIT_CH0_4, MC_RIR_LIMIT_CH0_5 MC_R...	88
2.12.2 MC_RIR_WAY_CH0_0, MC_RIR_WAY_CH0_1 MC_RIR_WAY_CH0_2, MC_RIR_WAY_CH0_3 MC_RIR_WAY_CH0_4, MC_RIR_WAY_CH0_5 MC_RIR_WAY_CH0_6...	89
2.12.3 MC_RIR_WAY_CH1_0, MC_RIR_WAY_CH1_1 MC_RIR_WAY_CH1_2, MC_RIR_WAY_CH1_3 MC_RIR_WAY_CH1_4, MC_RIR_WAY_CH1_5 MC_RIR_WAY_CH1_6...	90
2.12.4 MC_RIR_WAY_CH2_0, MC_RIR_WAY_CH2_1 MC_RIR_WAY_CH2_2, MC_RIR_WAY_CH2_3 MC_RIR_WAY_CH2_4, MC_RIR_WAY_CH2_5 MC_RIR_WAY_CH2_6...	91
2.13 Memory Thermal Control	92
2.13.1 MC_THERMAL_CONTROL0 MC_THERMAL_CONTROL1 MC_THERMAL_CONTROL2	92
2.13.2 MC_THERMAL_STATUS0 MC_THERMAL_STATUS1 MC_THERMAL_STATUS2	92
2.13.3 MC_THERMAL_DEFEATURE0 MC_THERMAL_DEFEATURE1 MC_THERMAL_DEFEATURE2	93
2.13.4 MC_THERMAL_PARAMS_A0 MC_THERMAL_PARAMS_A1 MC_THERMAL_PARAMS_A2	93
2.13.5 MC_THERMAL_PARAMS_B0 MC_THERMAL_PARAMS_B1 MC_THERMAL_PARAMS_B2	94
2.13.6 MC_COOLING_COEF0 MC_COOLING_COEF1 MC_COOLING_COEF2	94
2.13.7 MC_CLOSED_LOOP0 MC_CLOSED_LOOP1 MC_CLOSED_LOOP2	95
2.13.8 MC_THROTTLE_OFFSET0 MC_THROTTLE_OFFSET1 MC_THROTTLE_OFFSET2	95
2.13.9 MC_RANK_VIRTUAL_TEMP0 MC_RANK_VIRTUAL_TEMP1 MC_RANK_VIRTUAL_TEMP2	96
2.13.10 MC_DDR_THERM_COMMAND0 MC_DDR_THERM_COMMAND1 MC_DDR_THERM_COMMAND2	96
2.13.11 MC_DDR_THERM_STATUS0 MC_DDR_THERM_STATUS1 MC_DDR_THERM_STATUS2	97
2.14 Integrated Memory Controller Miscellaneous Registers	97
2.14.1 MC_DIMM_CLK_RATIO_STATUS	97

Match case Limit results 1 per page

Introduction

Datasheet

more detailed information. Refer to

http://developer.intel.com/

for future reference

on up to date nomenclatures.

•

Eye Definitions

— The eye at any point along the data channel is defined to be the

creation of overlapping of a large number of Unit Interval of the data signal and

timing width measured with respect to the edges of a separate clock signal at any

other point. Each differential signal pair by combining the D+ and D- signals

produces a signal eye.

•

1366-land LGA package

— The processor is available in a Flip-Chip Land Grid

Array (FC-LGA) package, consisting of the processor die mounted on a land grid

array substrate with an integrated heat spreader (IHS).

•

Functional Operation

— Refers to the normal operating conditions in which all

processor specifications, including DC, AC, system bus, signal quality, mechanical,

and thermal, are satisfied.

•

Integrated Memory Controller (IMC)

— A memory controller that is integrated

in the processor silicon.

•

Integrated Heat Spreader (IHS)

— A component of the processor package used

to enhance the thermal performance of the package. Component thermal solutions

interface with the processor at the IHS surface.

•

Intel

64 Architecture

— An enhancement to Intel's IA-32 architecture, allowing

the processor to execute operating systems and applications written to take

advantage of Intel 64. Further details on Intel 64 architecture and programming

model can be found at

http://developer.intel.com/technology/intel64/

•

Intel

QuickPath Interconnect

– A cache-coherent, link-based interconnect

specification for Intel processor, chipset, and I/O bridge components. Sometimes

abbreviated as Intel QPI.

•

Intel

QPI

— Abbreviation for Intel

QuickPath Interconnect.

•

Intel

Virtualization Technology (Intel

VT)

— A set of hardware

enhancements to Intel server and client platforms that can improve virtualization

solutions. Intel VT provides a foundation for widely-deployed virtualization

solutions and enables more robust hardware assisted virtualization solutions. More

information can be found at:

http://www.intel.com/technology/virtualization/

•

Jitter

— Any timing variation of a transition edge or edges from the defined Unit

Interval.

•

LGA1366 Socket

— The processor (in the LGA-1366 package) mates with the

system board through this surface mount, 1366-contact socket.

•

Mirror Port

- Pads located on the top side of the processor package used to

provide logic analyzer probing access for Intel QPI signal analysis.

•

Non-core

— The portion of the processor comprising the shared cache, IMC and

Intel QPI Link interface.

•

OEM

—

Original Equipment Manufacturer.

•

Storage Conditions

— Refers to a non-operational state. The processor may be

installed in a platform, in a tray, or loose. Processors may be sealed in packaging or

exposed to free air. Under these conditions, processor lands should not be

connected to any supply voltages, have any I/Os biased, or receive any clocks.

•

Intel

Core™ i7 processor Extreme Edition and Intel

Core™ i7 processor

— The desktop product, including processor substrate and integrated heat spreader

(IHS).