HP Superdome SX2000 User Service Guide, Seventh Edition - HP Integrity Superdo - Page 19

Power Subsystem, One Front End Power Supply FEPS

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SD64 consists of left backplane and right backplane cabinets, which are connected using 12 m-Link cables. When the PA-RISC dual-core or the Itanium dual-core processors are used, the CPU counts are doubled by the use of the dual-die processors, as supported on the Intel® Itanium® cell boards. Up to 128 processors can be supported. Figure 1-2 Superdome Cabinet Components Power Subsystem The power subsystem consists of the following components: • One or two PDCAs • One Front End Power Supply (FEPS) • Up to six BPS • One power board per cell • An HIOB power system • Backplane power bricks • Power monitor (PM) on the Universal Glob of Utilities (UGUY) • Local power monitors (LPM) on the cell, the HIOB, and the backplanes Power Subsystem 19

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SD64 consists of left backplane and right backplane cabinets, which are connected using 12
m-Link cables.
When the PA-RISC dual-core or the Itanium dual-core processors are used, the CPU counts are
doubled by the use of the dual-die processors, as supported on the Intel
®
Itanium
®
cell boards.
Up to 128 processors can be supported.
Figure 1-2 Superdome Cabinet Components
Power Subsystem
The power subsystem consists of the following components:
•
One or two PDCAs
•
One Front End Power Supply (FEPS)
•
Up to six BPS
•
One power board per cell
•
An HIOB power system
•
Backplane power bricks
•
Power monitor (PM) on the Universal Glob of Utilities (UGUY)
•
Local power monitors (LPM) on the cell, the HIOB, and the backplanes
Power Subsystem
19