HP Superdome SX2000 User Service Guide, Seventh Edition - HP Integrity Superdo - Page 3

Table of Contents, Backplane Power Requirements and Power Distribution

Page 3 highlights

Table of Contents About This Document...13 Intended Audience...13 Document Organization...13 Typographic Conventions...13 Related Information...14 Publishing History...14 HP contact information...15 Documentation feedback...15 1 Overview...17 Server History and Specifications...17 Server Components...18 Power Subsystem...19 AC Power...20 DC Power...20 Power Sequencing...21 Enabling 48 Volts...21 Cooling System...21 Utilities Subsystem...22 Platform Management...22 UGUY...23 CLU Functionality...23 PM3 Functionality...23 System Clocks...24 Management Processor...24 Compact Flash...25 HUCB...25 Backplane...26 Crossbar Chip...26 Switch Fabrics...27 Backplane Monitor and Control...27 I2C Bus Distribution...27 Clock Subsystem...27 System Clock Distribution...27 Hot-Swap Oscillator...28 sx2000 RCS Module...28 Cabinet ID...29 Cell ID...29 Backplane Power Requirements and Power Distribution 29 CPUs and Memories...30 Cell Controller...31 Processor Interface...31 Processors...32 Cell Memory System...32 Memory Controller ...33 DIMM Architecture...33 Memory Interconnect...33 Mixing Different Sized DIMMs 34 Memory Interleaving...34 Memory Bank Attribute Table 34 Table of Contents 3

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Table of Contents
About This Document
.......................................................................................................
13
Intended Audience
................................................................................................................................
13
Document Organization
.......................................................................................................................
13
Typographic Conventions
.....................................................................................................................
13
Related Information
..............................................................................................................................
14
Publishing History
................................................................................................................................
14
HP contact information
.........................................................................................................................
15
Documentation feedback
......................................................................................................................
15
1 Overview
.......................................................................................................................
17
Server History and Specifications
.........................................................................................................
17
Server Components
...............................................................................................................................
18
Power Subsystem
..................................................................................................................................
19
AC Power
.........................................................................................................................................
20
DC Power
.........................................................................................................................................
20
Power Sequencing
............................................................................................................................
21
Enabling 48 Volts
.............................................................................................................................
21
Cooling System
.....................................................................................................................................
21
Utilities Subsystem
................................................................................................................................
22
Platform Management
.....................................................................................................................
22
UGUY
..............................................................................................................................................
23
CLU Functionality
...........................................................................................................................
23
PM3 Functionality
...........................................................................................................................
23
System Clocks
..................................................................................................................................
24
Management Processor
....................................................................................................................
24
Compact Flash
.................................................................................................................................
25
HUCB
...............................................................................................................................................
25
Backplane
..............................................................................................................................................
26
Crossbar Chip
..................................................................................................................................
26
Switch Fabrics
..................................................................................................................................
27
Backplane Monitor and Control
......................................................................................................
27
I2C Bus Distribution
........................................................................................................................
27
Clock Subsystem
..............................................................................................................................
27
System Clock Distribution
.........................................................................................................
27
Hot-Swap Oscillator
...................................................................................................................
28
sx2000 RCS Module
....................................................................................................................
28
Cabinet ID
........................................................................................................................................
29
Cell ID
..............................................................................................................................................
29
Backplane Power Requirements and Power Distribution
...............................................................
29
CPUs and Memories
.............................................................................................................................
30
Cell Controller
.................................................................................................................................
31
Processor Interface
...........................................................................................................................
31
Processors
........................................................................................................................................
32
Cell Memory System
.......................................................................................................................
32
Memory Controller
....................................................................................................................
33
DIMM Architecture
....................................................................................................................
33
Memory Interconnect
.................................................................................................................
33
Mixing Different Sized DIMMs
..................................................................................................
34
Memory Interleaving
.................................................................................................................
34
Memory Bank Attribute Table
..............................................................................................
34
Table of Contents
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