HP Superdome SX2000 User Service Guide, Seventh Edition - HP Integrity Superdo - Page 198

I/O subsystem, AC0 Present

Page 198 highlights

door installation back, 79 front, 79 DP rated power cables, 20 dual in-line memory module, (see DIMM) dual-die processors, 19 E e-Link cable description, 42 ejectors cell board, 110 electrical specifications, 50 electrostatic discharge, 59 EMI panel installing, 111 removing, 89 environmental requirements, 54 equipment returning, 71 equipment footprint templates, 185 external e-Link cable description, 42 F facility guidelines computer room layout, 185 equipment footprint templates, 185 FEPS, 19 description, 20 firmware ACPI interface, 44, 46 EFI interface, 44, 46 event IDs, 44, 46 PAL interface, 44, 46 POSSE shell, 44, 46 SAL interface, 44, 46 front end power supply, (see FEPS) front panel display, 179 G gateway address, 100 global shared memory errors, 48 Gold Book, 112 H halfdome utility connector board, (see HUCB) hardware correctable errors, 48 HKP LED, 179 hot-swap oscillator, (see HSO) housekeeping power front panel display, 96 HKP LED, 96 turning on, 96, 178 housekeeping power LED, 96, 179 HSO detailed description, 28 LED status indications, 28 location on backplane, 29 part of clock subsystem, 27 HUCB 198 Index DIP switch purpose, 18, 24 general description, 25 shown outside system, 25 humidity specifications, 54 I I/O subsystem detailed description, 37 enhanced rope definition, 37 fat rope definition, 37 illustrated I/O backplane slot mapping, 39 PCI-X backplane functionality, 38 SBA chip operation, 38, 39 inspecting cables, 112 circuit boards, 112 installation EMI panel, 111 PDCA, 86 tools required for, 63 visual inspection, 110 intake air filter, 18 interference communications, 59 inventory check, 60 IP address default values, 99 LAN configuration screen, 100 setting private and customer LAN, 99 J JET invoking the software, 108 power cycling after usage, 108 purpose for invoking, 108 JTAG utility for scan test JUST, 108 JUST JTAG utility for scan test, 108 K kick plates attaching to cabinet, 109 shown on cabinet, 109 L LAN port 0, 100 port 1, 100 status, 100 LED AC0 Present, 98, 180 AC1 Present, 98, 180 Attention, 179 HKP (housekeeping), 96, 179 Present, 96, 179 leveling feet attaching, 79 local power monitors, (see LPM)

  • 1
  • 2
  • 3
  • 4
  • 5
  • 6
  • 7
  • 8
  • 9
  • 10
  • 11
  • 12
  • 13
  • 14
  • 15
  • 16
  • 17
  • 18
  • 19
  • 20
  • 21
  • 22
  • 23
  • 24
  • 25
  • 26
  • 27
  • 28
  • 29
  • 30
  • 31
  • 32
  • 33
  • 34
  • 35
  • 36
  • 37
  • 38
  • 39
  • 40
  • 41
  • 42
  • 43
  • 44
  • 45
  • 46
  • 47
  • 48
  • 49
  • 50
  • 51
  • 52
  • 53
  • 54
  • 55
  • 56
  • 57
  • 58
  • 59
  • 60
  • 61
  • 62
  • 63
  • 64
  • 65
  • 66
  • 67
  • 68
  • 69
  • 70
  • 71
  • 72
  • 73
  • 74
  • 75
  • 76
  • 77
  • 78
  • 79
  • 80
  • 81
  • 82
  • 83
  • 84
  • 85
  • 86
  • 87
  • 88
  • 89
  • 90
  • 91
  • 92
  • 93
  • 94
  • 95
  • 96
  • 97
  • 98
  • 99
  • 100
  • 101
  • 102
  • 103
  • 104
  • 105
  • 106
  • 107
  • 108
  • 109
  • 110
  • 111
  • 112
  • 113
  • 114
  • 115
  • 116
  • 117
  • 118
  • 119
  • 120
  • 121
  • 122
  • 123
  • 124
  • 125
  • 126
  • 127
  • 128
  • 129
  • 130
  • 131
  • 132
  • 133
  • 134
  • 135
  • 136
  • 137
  • 138
  • 139
  • 140
  • 141
  • 142
  • 143
  • 144
  • 145
  • 146
  • 147
  • 148
  • 149
  • 150
  • 151
  • 152
  • 153
  • 154
  • 155
  • 156
  • 157
  • 158
  • 159
  • 160
  • 161
  • 162
  • 163
  • 164
  • 165
  • 166
  • 167
  • 168
  • 169
  • 170
  • 171
  • 172
  • 173
  • 174
  • 175
  • 176
  • 177
  • 178
  • 179
  • 180
  • 181
  • 182
  • 183
  • 184
  • 185
  • 186
  • 187
  • 188
  • 189
  • 190
  • 191
  • 192
  • 193
  • 194
  • 195
  • 196
  • 197
  • 198
  • 199
  • 200

door installation
back, 79
front, 79
DP rated power cables, 20
dual in-line memory module, (
see
DIMM)
dual-die processors, 19
E
e-Link cable description, 42
ejectors
cell board, 110
electrical specifications, 50
electrostatic discharge, 59
EMI panel
installing, 111
removing, 89
environmental requirements, 54
equipment
returning, 71
equipment footprint templates, 185
external e-Link cable description, 42
F
facility guidelines
computer room layout, 185
equipment footprint templates, 185
FEPS, 19
description, 20
firmware
ACPI interface, 44, 46
EFI interface, 44, 46
event IDs, 44, 46
PAL interface, 44, 46
POSSE shell, 44, 46
SAL interface, 44, 46
front end power supply, (
see
FEPS)
front panel display, 179
G
gateway address, 100
global shared memory errors, 48
Gold Book, 112
H
halfdome utility connector board, (
see
HUCB)
hardware correctable errors, 48
HKP LED, 179
hot-swap oscillator, (
see
HSO)
housekeeping power
front panel display, 96
HKP LED, 96
turning on, 96, 178
housekeeping power LED, 96, 179
HSO
detailed description, 28
LED status indications, 28
location on backplane, 29
part of clock subsystem, 27
HUCB
DIP switch purpose, 18, 24
general description, 25
shown outside system, 25
humidity specifications, 54
I
I/O subsystem
detailed description, 37
enhanced rope definition, 37
fat rope definition, 37
illustrated I/O backplane slot mapping, 39
PCI-X backplane functionality, 38
SBA chip operation, 38, 39
inspecting
cables, 112
circuit boards, 112
installation
EMI panel, 111
PDCA, 86
tools required for, 63
visual inspection, 110
intake air filter, 18
interference
communications, 59
inventory check, 60
IP address
default values, 99
LAN configuration screen, 100
setting private and customer LAN, 99
J
JET
invoking the software, 108
power cycling after usage, 108
purpose for invoking, 108
JTAG utility for scan test
JUST, 108
JUST
JTAG utility for scan test, 108
K
kick plates
attaching to cabinet, 109
shown on cabinet, 109
L
LAN
port 0, 100
port 1, 100
status, 100
LED
AC0 Present, 98, 180
AC1 Present, 98, 180
Attention, 179
HKP (housekeeping), 96, 179
Present, 96, 179
leveling feet
attaching, 79
local power monitors, (
see
LPM)
198
Index