Intel S1200BTL Product Specification - Page 123
Design and Environmental Specifications - server motherboard
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Intel®Server Board S1200BT TPS Design and Environmental Specifications 10. Design and Environmental Specifications 10.1 Intel® Server Board S1200BT Design Specifications The operation of the server board at conditions beyond those shown in the following table may cause permanent damage to the system. Exposure to absolute maximum rating conditions for extended periods may affect system reliability. Table 45. Server Board Design Specifications Operating Temperature Non-Operating Temperature DC Voltage Shock (Unpackaged) Shock (Packaged)
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Intel®
Server Board S1200BT TPS
Design and Environmental Specifications
Revision 1.0
Intel order number G13326-003
111
10. Design and Environmental Specifications
10.1 Intel
®
Server Board S1200BT Design Specifications
The operation of the server board at conditions beyond those shown in the following table may
cause permanent damage to the system. Exposure to absolute maximum rating conditions for
extended periods may affect system reliability.
Table 45. Server Board Design Specifications
Operating Temperature
0º
C to 55º
C
1
(32º
F to 131º
F)
Non-Operating Temperature
-40º
C to 70º
C (-40º
F to 158º
F)
DC Voltage
± 5% of all nominal voltages
Shock (Unpackaged)
Trapezoidal, 50 G, 170 inches/sec
Shock (Packaged)
<20 pounds
20 to <40 pounds
40 to <80 pounds
80 to <100 pounds
100 to <120 pounds
120 pounds
36 inches
30 inches
24 inches
18 inches
12 inches
9 inches
Vibration (Unpackaged)
5 Hz to 500 Hz 3.13 g RMS random
1
Chassis design must provide proper airflow to avoid exceeding the Intel
®
Xeon
®
processor maximum case
temperature.
Disclaimer Note
: Intel Corporation server boards contain a number of high-density VLSI and
power delivery components that need adequate airflow to cool. Intel
®
ensures through its own
chassis development and testing that when Intel
®
server building blocks are used together, the
fully integrated system will meet the intended thermal requirements of these components. It is
the responsibility of the system integrator who chooses not to use Intel
®
developed server
building blocks to consult vendor datasheets and operating parameters to determine the
amount of airflow required for their specific application and environmental conditions. Intel
Corporation cannot be held responsible, if components fail or the server board does not operate
correctly when used outside any of their published operating or non-operating limits.
10.2 Board-level Calculated MTBF
This section provides results of MTBF (Mean Time Between Failures) testing done by a third
party testing facility. MTBF is a standard measure for the reliability and performance of the
board under extreme working conditions. The MTBF was measured at 20000 hours at 35
degrees Celsius.
Please go to
to get the updated MTBF report
for Intel
®
Server Board S1200BT family.
10.2.1
Processor Power Support
The server board supports the Thermal Design Power (TDP) guideline for Intel
®
Xeon
®
processor. The Flexible Motherboard Guidelines (FMB) was also followed to help determine the