Intel S1200BTL Product Specification - Page 13

Outline, Server Board Use Disclaimer - chassis

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Intel®Server Board S1200BT TPS Introduction 1. Introduction This Technical Product Specification (TPS) provides board specific information detailing the features, functionality, and high-level architecture of the Intel® Server Board S1200BT. In addition, you can obtain design-level information for specific subsystems by ordering the External Product Specifications (EPS) or External Design Specifications (EDS) for a given subsystem. EPS and EDS documents are not publicly available and must be ordered through your local Intel® representative. 1.1 Chapter Outline This document is divided into the following chapters:  Chapter 1 - Introduction  Chapter 2 - Server Board Overview  Chapter 3 - Functional Architecture  Chapter 4 - Platform Management  Chapter 5 - Server Management Capability  Chapter 6 - BIOS User Interface  Chapter 7 - Connector/Header Locations and Pin-outs  Chapter 8 - Jumpers Blocks  Chapter 9 - Intel® Light-Guided Diagnostics  Chapter 10 - Design and Environmental Specifications  Appendix A - Integration and Usage Tips  Appendix B - Integrated BMC Sensor Tables  Appendix C - POST Code Diagnostic LED Decoder  Appendix D - POST Code Errors  Appendix E - Supported Intel® Server Chassis  Glossary  Reference Documents 1.2 Server Board Use Disclaimer Intel Corporation server boards contain a number of high-density VLSI and power delivery components that need adequate airflow to cool. Intel® ensures through its own chassis development and testing that when Intel® server building blocks are used together, the fully integrated system meets the intended thermal requirements of these components. It is the responsibility of the system integrator who chooses not to use Intel® developed server building blocks to consult vendor datasheets and operating parameters to determine the amount of airflow required for their specific application and environmental conditions. Intel Corporation cannot be held responsible if components fail or the server board does not operate correctly when used outside any of their published operating or non-operating limits. Revision 1.0 1 Intel order number G13326-003

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Intel®
Server Board S1200BT TPS
Introduction
Revision 1.0
Intel order number G13326-003
1
1.
Introduction
This Technical Product Specification (TPS) provides board specific information detailing the
features, functionality, and high-level architecture of the Intel
®
Server Board S1200BT.
In addition, you can obtain design-level information for specific subsystems by ordering the
External Product Specifications (EPS) or External Design Specifications (EDS) for a given
subsystem. EPS and EDS documents are not publicly available and must be ordered through
your local Intel
®
representative.
1.1
Chapter Outline
This document is divided into the following chapters:
Chapter 1
–
Introduction
Chapter 2
–
Server Board Overview
Chapter 3
–
Functional Architecture
Chapter 4
–
Platform Management
Chapter 5
–
Server Management Capability
Chapter 6
–
BIOS User Interface
Chapter 7
–
Connector/Header Locations and Pin-outs
Chapter 8
–
Jumpers Blocks
Chapter 9
–
Intel
®
Light-Guided Diagnostics
Chapter 10
–
Design and Environmental Specifications
Appendix A
–
Integration and Usage Tips
Appendix B
–
Integrated BMC Sensor Tables
Appendix C
–
POST Code Diagnostic LED Decoder
Appendix D
–
POST Code Errors
Appendix E
–
Supported Intel
®
Server Chassis
Glossary
Reference Documents
1.2
Server Board Use Disclaimer
Intel Corporation server boards contain a number of high-density VLSI and power delivery
components that need adequate airflow to cool. Intel
®
ensures through its own chassis
development and testing that when Intel
®
server building blocks are used together, the fully
integrated system meets the intended thermal requirements of these components. It is the
responsibility of the system integrator who chooses not to use Intel
®
developed server building
blocks to consult vendor datasheets and operating parameters to determine the amount of
airflow required for their specific application and environmental conditions. Intel Corporation
cannot be held responsible if components fail or the server board does not operate correctly
when used outside any of their published operating or non-operating limits.