HP Dc7700 HP Compaq dx7300 and dc7700 Business PC Technical Reference Guide, 1 - Page 51

Table 3-2, SPD Address Map SDRAM DIMM, The SPD address map is shown in Table 3-2. - manufacture date

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Processor/Memory Subsystem The SPD address map is shown in Table 3-2. Byte 0 1 2 3 4 5 6, 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 Table 3-2 SPD Address Map (SDRAM DIMM) Description Notes Byte Description No. of Bytes Written Into EEPROM Total Bytes (#) In EEPROM Memory Type No. of Row Addresses On DIMM No. of Column Addresses On DIMM No. of Module Banks On DIMM Data Width of Module Voltage Interface Standard of DIMM Cycletime @ Max CAS Latency (CL) Access From Clock Config. Type (Parity, Nonparity...) Refresh Rate/Type Width, Primary DRAM Error Checking Data Width Min. Clock Delay Burst Lengths Supported No. of Banks For Each Mem. Device CAS Latencies Supported CS# Latency Write Latency DIMM Attributes Memory Device Attributes Min. CLK Cycle Time at CL X-1 Max. Acc. Time From CLK @ CL X-1 [1] [2] [3] [4] [4] [4][5] [6] [4] [4] [4] [4] [7] [7] 25 26 27 28 29 30-31 32-61 62 63 64-71 72 73-90 91-92 93-94 95-98 99125 126 127 128 - 131 132 133 - 145 146 147 148 Min. CLK Cycle Time at CL X-2 Max. Acc. Time From CLK @ CL X-2 Min. Row Prechge. Time Min. Row Active to Delay Min. RAS to CAS Delay Reserved Superset Data SPD Revision Checksum Bytes 0-62 JEP-106E ID Code DIMM OEM Location OEM's Part Number OEM's Rev. Code Manufacture Date OEM's Assembly S/N OEM Specific Data Intel frequency check Reserved Compaq header "CPQ1" Header checksum Unit serial number DIMM ID Checksum Reserved Notes [7] [7] [7] [7] [7] [7] [7] [8] [8] [8] [8] [8] [8] [8] [9] [9] [9][10] [9][11] [9] [9] NOTES: [1] Programmed as 128 bytes by the DIMM OEM [2] Must be programmed to 256 bytes. [3] High order bit defines redundant addressing: if set (1), highest order RAS# address must be re-sent as highest order CAS# address. [4] Refer to memory manufacturer's datasheet [5] MSb is Self Refresh flag. If set (1), assembly supports self refresh. [6] Back-to-back random column addresses. [7] Field format proposed to JEDEC but not defined as standard at publication time. [8] Field specified as optional by JEDEC but required by this system. [9] HP usage. This system requires that the DIMM EEPROM have this space available for reads/writes. [10] Serial # in ASCII format (MSB is 133). Intended as backup identifier in case vender data is invalid. Can also be used to indicate s/n mismatch and flag system adminstrator of possible system Tampering. [11]Contains the socket # of the module (first module is "1"). Intended as backup identifier (refer to note [10]). Technical Reference Guide www.hp.com 3-7

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Technical Reference Guide
www.hp.com
3-7
Processor/Memory Subsystem
The SPD address map is shown in Table 3-2.
NOTES:
[1] Programmed as 128 bytes by the DIMM OEM
[2] Must be programmed to 256 bytes.
[3] High order bit defines redundant addressing: if set (1), highest order RAS# address must be re-sent as highest order CAS#
address.
[4] Refer to memory manufacturer’s datasheet
[5] MSb is Self Refresh flag. If set (1), assembly supports self refresh.
[6] Back-to-back random column addresses.
[7] Field format proposed to JEDEC but not defined as standard at publication time.
[8] Field specified as optional by JEDEC but required by this system.
[9] HP usage. This system requires that the DIMM EEPROM have this space available for reads/writes.
[10] Serial # in ASCII format (MSB is 133). Intended as backup identifier in case vender data is invalid.
Can also be used to indicate s/n mismatch and flag system adminstrator of possible system Tampering.
[11]Contains the socket # of the module (first module is “1”). Intended as backup identifier (refer to note [10]).
Table 3-2
SPD Address Map (SDRAM DIMM)
Byte
Description
Notes
Byte
Description
Notes
0
No. of Bytes Written Into EEPROM
[1]
25
Min. CLK Cycle Time at CL X-2
[7]
1
Total Bytes (#) In EEPROM
[2]
26
Max. Acc. Time From CLK @ CL X-2
[7]
2
Memory Type
27
Min. Row Prechge. Time
[7]
3
No. of Row Addresses On DIMM
[3]
28
Min. Row Active to Delay
[7]
4
No. of Column Addresses On DIMM
29
Min. RAS to CAS Delay
[7]
5
No. of Module Banks On DIMM
30-31
Reserved
6, 7
Data Width of Module
32-61
Superset Data
[7]
8
Voltage Interface Standard of DIMM
62
SPD Revision
[7]
9
Cycletime @ Max CAS Latency (CL)
[4]
63
Checksum Bytes 0-62
10
Access From Clock
[4]
64-71
JEP-106E ID Code
[8]
11
Config. Type (Parity, Nonparity...)
72
DIMM OEM Location
[8]
12
Refresh Rate/Type
[4][5]
73-90
OEM’s
Part Number
[8]
13
Width, Primary DRAM
91-92
OEM’s Rev. Code
[8]
14
Error Checking Data Width
93-94
Manufacture
Date
[8]
15
Min. Clock Delay
[6]
95-98
OEM’s Assembly S/N
[8]
16
Burst Lengths Supported
99-
125
OEM Specific Data
[8]
17
No. of Banks For Each Mem. Device
[4]
126
Intel frequency check
18
CAS Latencies Supported
[4]
127
Reserved
19
CS# Latency
[4]
128 - 131
Compaq header “CPQ1”
[9]
20
Write Latency
[4]
132
Header checksum
[9]
21
DIMM Attributes
133 - 145
Unit serial number
[9][10]
22
Memory Device Attributes
146
DIMM ID
[9][11]
23
Min. CLK Cycle Time at CL X-1
[7]
147
Checksum
[9]
24
Max. Acc. Time From CLK @ CL X-1
[7]
148
Reserved
[9]