HP Surestore Disk Array FC60 HP SureStore E Disk Array 12H User's and Service - Page 6

Appendix B. Regulatory/safety Statements, Appendix C. Cabinet Configurations

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Page 6 highlights

OPERATING CHARACTERISTICS AND REQUIREMENTS 212 Power Requirements: ...212 Airflow Space ...212 Heat Dissipation ...212 Electromagnetic Emissions ...213 Acoustic Emissions...213 ENVIRONMENTAL REQUIREMENTS...213 Temperature Ranges ...213 Humidity Ranges...213 Altitude Ranges ...214 Vibration ...214 Shock...214 Line Input Requirements ...214 Electromagnetic Susceptibility Operating Range 215 ENCLOSURE FEATURES...215 MODULE SPECIFICATIONS...216 Disk Module ...216 Controller Module...216 Power Module...216 Fan Module...216 APPENDIX B. REGULATORY/SAFETY STATEMENTS 217 FCC STATEMENT (FOR U.S.A. ONLY) ...217 SPÉCIFICATION ATI CLASSE A (FRANCE SEULEMENT 219 PRODUCT NOISE DECLARATION (FOR GERMANY ONLY 220 GERÄUSCHEMISSION (FOR GERMANY ONLY 220 ELECTROMAGNETIC COMPATIBILITY...221 SAFETY SPECIFICATIONS ...221 DECLARATION OF CONFORMITY ...222 APPENDIX C. CABINET CONFIGURATIONS 223 CABINET CONFIGURATIONS AVAILABLE 223 DESKSIDE CABINET ...223 UNPACKING THE DESKSIDE CABINET ...224 INSTALLING THE DISK ARRAY INTO THE DESKSIDE CABINET 226 DESKSIDE CABINET CABLING ...228 RACKMOUNT CABINETS...229 Installing the Disk Array into a Rack 230 APPENDIX D. BACK-TO-BACK RACKING 235 PRODUCT DESCRIPTION ...235 Components...236 Other Documentation...238 6

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6
O
PERATING
C
HARACTERISTICS AND
R
EQUIREMENTS
..............................................................................
212
Power Requirements:
..........................................................................................................................
212
Airflow Space
......................................................................................................................................
212
Heat Dissipation
.................................................................................................................................
212
Electromagnetic Emissions
.................................................................................................................
213
Acoustic Emissions
..............................................................................................................................
213
E
NVIRONMENTAL
R
EQUIREMENTS
...........................................................................................................
213
Temperature Ranges
...........................................................................................................................
213
Humidity Ranges
.................................................................................................................................
213
Altitude Ranges
...................................................................................................................................
214
Vibration
.............................................................................................................................................
214
Shock
...................................................................................................................................................
214
Line Input Requirements
.....................................................................................................................
214
Electromagnetic Susceptibility Operating Range
...............................................................................
215
E
NCLOSURE
F
EATURES
............................................................................................................................
215
M
ODULE
S
PECIFICATIONS
........................................................................................................................
216
Disk Module
........................................................................................................................................
216
Controller Module
...............................................................................................................................
216
Power Module
.....................................................................................................................................
216
Fan Module
.........................................................................................................................................
216
APPENDIX B. REGULATORY/SAFETY STATEMENTS
.................................................................
217
FCC S
TATEMENT
(F
OR
U.S.A. O
NLY
)
....................................................................................................
217
S
PÉCIFICATION
ATI C
LASSE
A (F
RANCE
S
EULEMENT
)
...........................................................................
219
P
RODUCT
N
OISE
D
ECLARATION
(F
OR
G
ERMANY
O
NLY
)
.........................................................................
220
G
ERÄUSCHEMISSION
(F
OR
G
ERMANY
O
NLY
)
..........................................................................................
220
E
LECTROMAGNETIC
C
OMPATIBILITY
.......................................................................................................
221
S
AFETY
S
PECIFICATIONS
.........................................................................................................................
221
D
ECLARATION OF
C
ONFORMITY
..............................................................................................................
222
APPENDIX C. CABINET CONFIGURATIONS
..................................................................................
223
C
ABINET
C
ONFIGURATIONS
A
VAILABLE
.................................................................................................
223
D
ESKSIDE
C
ABINET
.................................................................................................................................
223
U
NPACKING THE
D
ESKSIDE
C
ABINET
......................................................................................................
224
I
NSTALLING THE
D
ISK
A
RRAY INTO THE
D
ESKSIDE
C
ABINET
..................................................................
226
D
ESKSIDE
C
ABINET
C
ABLING
..................................................................................................................
228
R
ACKMOUNT
C
ABINETS
...........................................................................................................................
229
Installing the Disk Array into a Rack
..................................................................................................
230
APPENDIX D. BACK-TO-BACK RACKING
.......................................................................................
235
P
RODUCT
D
ESCRIPTION
...........................................................................................................................
235
Components
.........................................................................................................................................
236
Other Documentation
..........................................................................................................................
238