Intel 640 User Guide - Page 10

Introduction

R

10

Thermal/Mechanical Design Guide

1.1.3

Document Scope

This design guide supports the following processors:

•

Pentium 4 processors 570/571, 560/561, 550/551, 540/541, 530/531, and 520/521 in the 775-

land LGA package

•

Pentium 4 processor 670/672, 660/662, 650, 640, and 630 in the 775-land LGA package

•

Pentium 4 processor Extreme Edition in the 775-land LGA package

In this document, when a reference is made to “the processor” and/or “the Pentium 4 processor in

the 775–Land LGA package”, it is intended that this includes all the processors supported by this

document. If needed for clarity, the specific processor will be listed.

In this document, when a reference is made to “the datasheet”, the reader should refer to either the

Intel

®

Pentium

®

4 Processors 570571, 560/561, 550/551, 540/541, 530/531, and 520/521

∆

– On

90 nm Process in the 775–Land LGA Package and Supporting Hyper-Threading Technology

Datasheet

or the

Intel

®

Pentium

®

4 Processor 6xx

∆

Sequence and Intel

®

Pentium

®

4 Processor

Extreme Edition Datasheet – On 90 nm Process in the 775-land LGA Package,

supporting Intel

®

Extended Memory 64 Technology

Φ

, and supporting Intel

®

Virtualization Technology

as

appropriate. If needed for clarity, the specific processor datasheet will be referenced.

Chapter 2 discusses package thermal mechanical requirements to design a thermal solution for the

Pentium 4 processor in the 775–land LGA package in the context of personal computer

applications. Chapter 3 discusses the thermal solution considerations and metrology

recommendations to validate a processor thermal solution. Chapter 4 addresses the benefits of the

processor’s integrated thermal management logic for thermal design.

Chapter 5 provides information on the common Intel reference thermal solution for the Pentium 4

processor in the 775–land LGA package discussed in this document. Chapter 6 discusses the

implementation of acoustic fan speed control.

THE PHYSICAL DIMENSIONS AND THERMAL SPECIFICATIONS OF THE PROCESSOR

THAT ARE USED IN THIS DOCUMENT ARE FOR ILLUSTRATION ONLY. REFER TO

THE

DATASHEET

FOR THE PRODUCT DIMENSIONS, THERMAL POWER DISSIPATION

AND MAXIMUM CASE TEMPERATURE. IN CASE OF CONFLICT, THE DATA IN THE

DATASHEET SUPERSEDES ANY DATA IN THIS DOCUMENT.

Section	Page
Contents	3
Figures	6
Tables	7
Revision History	8
1 Introduction	9
1.1 Document Goals and Scope	9
1.1.1 Importance of Thermal Management	9
1.1.2 Document Goals	9
1.1.3 Document Scope	10
1.2 References	11
1.3 Definition of Terms	12
2 Processor Thermal/Mechanical Information	15
2.1 Mechanical Requirements	15
2.1.1 Processor Package	15
2.1.2 Heatsink Attach	17
2.1.2.1 General Guidelines	17
2.1.2.2 Heatsink Clip Load Requirement	17
2.1.2.3 Additional Guidelines	18
2.2 Thermal Requirements	18
2.2.1 Processor Case Temperature	18
2.2.2 Thermal Profile	19
2.2.3 TCONTROL	20
2.3 Heatsink Design Considerations	21
2.3.1 Heatsink Size	22
2.3.2 Heatsink Mass	22
2.3.3 Package IHS Flatness	22
2.3.4 Thermal Interface Material	23
2.4 System Thermal Solution Considerations	23
2.4.1 Chassis Thermal Design Capabilities	23
2.4.2 Improving Chassis Thermal Performance	23
2.4.3 Summary	24
2.5 System Integration Considerations	24
3 Thermal Metrology	25
3.1 Characterizing Cooling Performance Requirements	25
3.1.1 Example	26
3.2 Processor Thermal Solution Performance Assessment	27
3.3 Local Ambient Temperature Measurement Guidelines	27
3.4 Processor Case Temperature Measurement Guidelines	30
4 Thermal Management Logic and Thermal Monitor Feature	31
4.1 Processor Power Dissipation	31
4.2 Thermal Monitor Implementation	31
4.2.1 PROCHOT# Signal	32
4.2.2 Thermal Control Circuit	32
4.2.3 Operation and Configuration	33
4.2.4 On-Demand Mode	34
4.2.5 System Considerations	34
4.2.6 Operating System and Application Software Considerations	35
4.2.7 On-Die Thermal Diode	35
4.2.7.1 Reading the On-Die Thermal Diode Interface	35
4.2.7.2 Correction Factors for the On-Die Thermal Diode	36
4.2.8 THERMTRIP# Signal	37
4.2.8.1 Cooling System Failure Warning	37
5 Intel® Thermal/Mechanical Reference Design Information	39
5.1 Intel Validation Criteria for the Reference Design	39
5.1.1 Heatsink Performance Target	39
5.1.2 Acoustics	40
5.1.3 Altitude	40
5.1.4 Reference Heatsink Thermal Validation	41
5.1.5 Fan Performance for Active Heatsink Thermal Solution	41
5.2 Environmental Reliability Testing	42
5.2.1 Structural Reliability Testing	42
5.2.1.1 Random Vibration Test Procedure	42
5.2.1.2 Shock Test Procedure	42
5.2.2 Power Cycling	44
5.2.3 Recommended BIOS/Processor/Memory Test Procedures	44
5.3 Material and Recycling Requirements	44
5.4 Safety Requirements	45
5.5 Geometric Envelope for ATX Intel® Reference Thermal Mechanical Design	45
5.6 ATX Reference Thermal Mechanical Solution for the Intel® Pentium® 4 Processor in the 775–Land LGA Package	46
5.7 Reference Attach Mechanism	48
5.7.1 Structural Design Strategy	48
5.7.2 Mechanical Interface to the Reference Attach Mechanism	49
6 Acoustic Fan Speed Control	53
6.1 Acoustic Fan Speed Control	53
6.2 Thermal Solution Design	53
6.2.1 Compliance to Thermal Profile	53
6.2.2 Determine Thermistor Set Points	53
6.2.3 Minimum Fan Speed Set Point	54
6.3 Board and System Implementation	55
6.3.1 Choosing Fan Speed Control Settings	55
6.3.1.1 Temperature to begin Fan Acceleration	56
6.3.1.2 Minimum PWM Duty Cycle	58
6.4 Combining Thermistor and Thermal Diode Control	59

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