Intel 640 User Guide - Page 63
A.2.3, Board Deflection Limits
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R Figure 22. Board Deflection Definition d1 LGA775 Socket Heatsink Loading d'1 d2 d'2 A.2.3 Board Deflection Limits Deflection limits for the ATX/µATX form factor are: d_BOL - d_ref ≥ 0.09 mm and d_EOL - d_ref ≥ 0.15 mm And d'_BOL - d'_ref ≥ 0.09 mm and d_EOL' - d_ref' ≥ 0.15 mm NOTES: 1. The heatsink preload must remain within the static load limits defined in the processor datasheet at all times. 2. Board deflection should not exceed motherboard manufacturer specifications. Thermal/Mechanical Design Guide 63
LGA775 Socket Heatsink Loading
R
Thermal/Mechanical Design Guide
63
Figure 22. Board Deflection Definition
d1
d2
d’1
d’2
A.2.3
Board Deflection Limits
Deflection limits for the ATX/μATX form factor are:
d_BOL – d_ref
≥
0.09 mm and d_EOL – d_ref
≥
0.15 mm
And
d’_BOL – d’_ref
≥
0.09 mm and d_EOL’ – d_ref’
≥
0.15 mm
NOTES:
1.
The heatsink preload must remain within the static load limits defined in the processor datasheet at all
times.
2.
Board deflection should not exceed motherboard manufacturer specifications.