Intel 640 User Guide - Page 3

R Contents 1 Introduction ...9 1.1 Document Goals and Scope 9 1.1.1 Importance of Thermal Management 9 1.1.2 Document Goals 9 1.1.3 Document Scope 10 1.2 References ...11 1.3 Definition of Terms 12 2 Processor Thermal/Mechanical Information 15 2.1 Mechanical Requirements 15 2.1.1 Processor Package 15 2.1.2 Heatsink Attach 17 2.1.2.1 General Guidelines 17 2.1.2.2 Heatsink Clip Load Requirement 17 2.1.2.3 Additional Guidelines 18 2.2 Thermal Requirements 18 2.2.1 Processor Case Temperature 18 2.2.2 Thermal Profile 19 2.2.3 TCONTROL 20 2.3 Heatsink Design Considerations 21 2.3.1 Heatsink Size 22 2.3.2 Heatsink Mass 22 2.3.3 Package IHS Flatness 22 2.3.4 Thermal Interface Material 23 2.4 System Thermal Solution Considerations 23 2.4.1 Chassis Thermal Design Capabilities 23 2.4.2 Improving Chassis Thermal Performance 23 2.4.3 Summary 24 2.5 System Integration Considerations 24 3 Thermal Metrology ...25 3.1 Characterizing Cooling Performance Requirements 25 3.1.1 Example 26 3.2 Processor Thermal Solution Performance Assessment 27 3.3 Local Ambient Temperature Measurement Guidelines 27 3.4 Processor Case Temperature Measurement Guidelines 30 4 Thermal Management Logic and Thermal Monitor Feature 31 4.1 Processor Power Dissipation 31 4.2 Thermal Monitor Implementation 31 4.2.1 PROCHOT# Signal 32 4.2.2 Thermal Control Circuit 32 4.2.3 Operation and Configuration 33 Thermal/Mechanical Design Guide 3