Intel 640 User Guide - Page 50

Intel® Thermal/Mechanical Reference Design Information

R

50

Thermal/Mechanical Design Guide

The mechanical interface with the reference attach mechanism is defined in Figure 14 and Figure

15. Complying with the mechanical interface parameters is critical to generating a heatsink

preload compliant with the minimum preload requirement given in Section 2.1.2.2.

Additional requirements for the reference attach mechanism (clip and fasteners) include:

•

Total assembly weight, including heatsink/fan weight (

≤

450 g), clip and fasteners <480 g

•

Whole assembly center of gravity

≤

25.4 mm, measured from the top of the IHS

⎯

Whole assembly = Heatsink + Fan + Attach clip + Fasteners

Vendor information for the reference plastic fastener assembly is given in Appendix H.

For heatsink installation procedure, Refer to the video entitled

Boxed Intel

®

Pentium

®

4 Processor

in the 775-Land LGA Package - Integration Video

. This video is available on the Web, at

http://www.intel.com/go/integration

.

Caution:

Assess the potential risk of Musculoskeletal Disorders.

Many factors impact the risk of introducing

Musculoskeletal Disorders (MSDs)

when installing

and assembling computers and similar equipment. Along with common injuries such as cuts,

lacerations and bruises, frequent and prolonged repeated forceful exertions can cause soreness,

aches, pains, and fatigue, in hands, wrists and shoulders and can lead to chronic MSDs.

To minimize the risk of

MSDs

use of the correct tools and assembly techniques and supporting

equipment is recommended. Intel can assist in the selection of a tool for the installation of this

heat sink when the risk of MSD needs to be minimized. Contact your Intel field sales

representative for assistance.

Additional information on preventing MSDs may be found by contacting your local government

agency in charge of the assessment of worker health and safety. References can be found at the

following WEB sites:

Canadian Centre for Occupational Health and Safety:

http://www.ccohs.ca/oshanswers/ergonomics/handtools/workspace.html

United States Government OSHA web site:

http://www.osha.gov/index.html

Section	Page
Contents	3
Figures	6
Tables	7
Revision History	8
1 Introduction	9
1.1 Document Goals and Scope	9
1.1.1 Importance of Thermal Management	9
1.1.2 Document Goals	9
1.1.3 Document Scope	10
1.2 References	11
1.3 Definition of Terms	12
2 Processor Thermal/Mechanical Information	15
2.1 Mechanical Requirements	15
2.1.1 Processor Package	15
2.1.2 Heatsink Attach	17
2.1.2.1 General Guidelines	17
2.1.2.2 Heatsink Clip Load Requirement	17
2.1.2.3 Additional Guidelines	18
2.2 Thermal Requirements	18
2.2.1 Processor Case Temperature	18
2.2.2 Thermal Profile	19
2.2.3 TCONTROL	20
2.3 Heatsink Design Considerations	21
2.3.1 Heatsink Size	22
2.3.2 Heatsink Mass	22
2.3.3 Package IHS Flatness	22
2.3.4 Thermal Interface Material	23
2.4 System Thermal Solution Considerations	23
2.4.1 Chassis Thermal Design Capabilities	23
2.4.2 Improving Chassis Thermal Performance	23
2.4.3 Summary	24
2.5 System Integration Considerations	24
3 Thermal Metrology	25
3.1 Characterizing Cooling Performance Requirements	25
3.1.1 Example	26
3.2 Processor Thermal Solution Performance Assessment	27
3.3 Local Ambient Temperature Measurement Guidelines	27
3.4 Processor Case Temperature Measurement Guidelines	30
4 Thermal Management Logic and Thermal Monitor Feature	31
4.1 Processor Power Dissipation	31
4.2 Thermal Monitor Implementation	31
4.2.1 PROCHOT# Signal	32
4.2.2 Thermal Control Circuit	32
4.2.3 Operation and Configuration	33
4.2.4 On-Demand Mode	34
4.2.5 System Considerations	34
4.2.6 Operating System and Application Software Considerations	35
4.2.7 On-Die Thermal Diode	35
4.2.7.1 Reading the On-Die Thermal Diode Interface	35
4.2.7.2 Correction Factors for the On-Die Thermal Diode	36
4.2.8 THERMTRIP# Signal	37
4.2.8.1 Cooling System Failure Warning	37
5 Intel® Thermal/Mechanical Reference Design Information	39
5.1 Intel Validation Criteria for the Reference Design	39
5.1.1 Heatsink Performance Target	39
5.1.2 Acoustics	40
5.1.3 Altitude	40
5.1.4 Reference Heatsink Thermal Validation	41
5.1.5 Fan Performance for Active Heatsink Thermal Solution	41
5.2 Environmental Reliability Testing	42
5.2.1 Structural Reliability Testing	42
5.2.1.1 Random Vibration Test Procedure	42
5.2.1.2 Shock Test Procedure	42
5.2.2 Power Cycling	44
5.2.3 Recommended BIOS/Processor/Memory Test Procedures	44
5.3 Material and Recycling Requirements	44
5.4 Safety Requirements	45
5.5 Geometric Envelope for ATX Intel® Reference Thermal Mechanical Design	45
5.6 ATX Reference Thermal Mechanical Solution for the Intel® Pentium® 4 Processor in the 775–Land LGA Package	46
5.7 Reference Attach Mechanism	48
5.7.1 Structural Design Strategy	48
5.7.2 Mechanical Interface to the Reference Attach Mechanism	49
6 Acoustic Fan Speed Control	53
6.1 Acoustic Fan Speed Control	53
6.2 Thermal Solution Design	53
6.2.1 Compliance to Thermal Profile	53
6.2.2 Determine Thermistor Set Points	53
6.2.3 Minimum Fan Speed Set Point	54
6.3 Board and System Implementation	55
6.3.1 Choosing Fan Speed Control Settings	55
6.3.1.1 Temperature to begin Fan Acceleration	56
6.3.1.2 Minimum PWM Duty Cycle	58
6.4 Combining Thermistor and Thermal Diode Control	59

Intel 640 User Guide - Page 50

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