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Intel 640 User Guide - Page 45

Safety Requirements, Geometric Envelope for ATX Intel, Reference, Thermal Mechanical Design

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5.4 5.5 Intel® Thermal/Mechanical Reference Design Information R Safety Requirements Heatsink and attachment assemblies shall be consistent with the manufacture of units that meet the following safety standards: • UL Recognition-approved for flammability at the system level. All mechanical and thermal enabling components must be a minimum UL94V-2 approved. • CSA Certification. All mechanical and thermal enabling components must have CSA certification. • All components (in particular the heatsink fins) must meet the test requirements of UL1439 for sharp edges. • If the International Accessibility Probe specified in IEC 950 can access the moving parts of the fan, consider adding additional safety feature so that there is no risk of personal injury. Geometric Envelope for ATX Intel® Reference Thermal Mechanical Design Figure 45, Figure 46, and Figure 47 in Appendix G provide detailed reference ATX/μATX motherboard keep-out information for the reference thermal/mechanical enabling design. These drawings include height restrictions in the enabling component region. The maximum height of the reference solution above the motherboard is 71.12 mm [2.8 inches], and is compliant with the motherboard primary side height constraints defined in the ATX Specification revision 2.1 and the microATX Motherboard Interface Specification revision 1.1 found at http://www.formfactors.org. The reference solution requires a chassis obstruction height of at least 81.28 mm [3.2 inches], measured from the top of the motherboard (refer to Sections 3.3 and 5.1.4). This allows for appropriate fan inlet airflow to ensure fan performance, and therefore overall cooling solution performance. This is compliant with the recommendations found in both ATX Specification V2.1 and microATX Motherboard Interface Specification V1.1 documents. Thermal/Mechanical Design Guide 45

Section	Page
Contents	3
Figures	6
Tables	7
Revision History	8
1 Introduction	9
1.1 Document Goals and Scope	9
1.1.1 Importance of Thermal Management	9
1.1.2 Document Goals	9
1.1.3 Document Scope	10
1.2 References	11
1.3 Definition of Terms	12
2 Processor Thermal/Mechanical Information	15
2.1 Mechanical Requirements	15
2.1.1 Processor Package	15
2.1.2 Heatsink Attach	17
2.1.2.1 General Guidelines	17
2.1.2.2 Heatsink Clip Load Requirement	17
2.1.2.3 Additional Guidelines	18
2.2 Thermal Requirements	18
2.2.1 Processor Case Temperature	18
2.2.2 Thermal Profile	19
2.2.3 TCONTROL	20
2.3 Heatsink Design Considerations	21
2.3.1 Heatsink Size	22
2.3.2 Heatsink Mass	22
2.3.3 Package IHS Flatness	22
2.3.4 Thermal Interface Material	23
2.4 System Thermal Solution Considerations	23
2.4.1 Chassis Thermal Design Capabilities	23
2.4.2 Improving Chassis Thermal Performance	23
2.4.3 Summary	24
2.5 System Integration Considerations	24
3 Thermal Metrology	25
3.1 Characterizing Cooling Performance Requirements	25
3.1.1 Example	26
3.2 Processor Thermal Solution Performance Assessment	27
3.3 Local Ambient Temperature Measurement Guidelines	27
3.4 Processor Case Temperature Measurement Guidelines	30
4 Thermal Management Logic and Thermal Monitor Feature	31
4.1 Processor Power Dissipation	31
4.2 Thermal Monitor Implementation	31
4.2.1 PROCHOT# Signal	32
4.2.2 Thermal Control Circuit	32
4.2.3 Operation and Configuration	33
4.2.4 On-Demand Mode	34
4.2.5 System Considerations	34
4.2.6 Operating System and Application Software Considerations	35
4.2.7 On-Die Thermal Diode	35
4.2.7.1 Reading the On-Die Thermal Diode Interface	35
4.2.7.2 Correction Factors for the On-Die Thermal Diode	36
4.2.8 THERMTRIP# Signal	37
4.2.8.1 Cooling System Failure Warning	37
5 Intel® Thermal/Mechanical Reference Design Information	39
5.1 Intel Validation Criteria for the Reference Design	39
5.1.1 Heatsink Performance Target	39
5.1.2 Acoustics	40
5.1.3 Altitude	40
5.1.4 Reference Heatsink Thermal Validation	41
5.1.5 Fan Performance for Active Heatsink Thermal Solution	41
5.2 Environmental Reliability Testing	42
5.2.1 Structural Reliability Testing	42
5.2.1.1 Random Vibration Test Procedure	42
5.2.1.2 Shock Test Procedure	42
5.2.2 Power Cycling	44
5.2.3 Recommended BIOS/Processor/Memory Test Procedures	44
5.3 Material and Recycling Requirements	44
5.4 Safety Requirements	45
5.5 Geometric Envelope for ATX Intel® Reference Thermal Mechanical Design	45
5.6 ATX Reference Thermal Mechanical Solution for the Intel® Pentium® 4 Processor in the 775–Land LGA Package	46
5.7 Reference Attach Mechanism	48
5.7.1 Structural Design Strategy	48
5.7.2 Mechanical Interface to the Reference Attach Mechanism	49
6 Acoustic Fan Speed Control	53
6.1 Acoustic Fan Speed Control	53
6.2 Thermal Solution Design	53
6.2.1 Compliance to Thermal Profile	53
6.2.2 Determine Thermistor Set Points	53
6.2.3 Minimum Fan Speed Set Point	54
6.3 Board and System Implementation	55
6.3.1 Choosing Fan Speed Control Settings	55
6.3.1.1 Temperature to begin Fan Acceleration	56
6.3.1.2 Minimum PWM Duty Cycle	58
6.4 Combining Thermistor and Thermal Diode Control	59

Match case Limit results 1 per page

Intel® Thermal/Mechanical Reference Design Information

Thermal/Mechanical Design Guide

5.4

Safety Requirements

Heatsink and attachment assemblies shall be consistent with the manufacture of units that meet

the following safety standards:

•

UL Recognition-approved for flammability at the system level. All mechanical and thermal

enabling components must be a minimum UL94V-2 approved.

•

CSA Certification. All mechanical and thermal enabling components must have CSA

certification.

•

All components (in particular the heatsink fins) must meet the test requirements of UL1439

for sharp edges.

•

If the International Accessibility Probe specified in IEC 950 can access the moving parts of

the fan, consider adding additional safety feature so that there is no risk of personal injury.

5.5

Geometric Envelope for ATX Intel

Reference

Thermal Mechanical Design

Figure 45, Figure 46, and Figure 47 in Appendix G provide detailed reference ATX/

ATX

motherboard keep-out information for the reference thermal/mechanical enabling design. These

drawings include height restrictions in the enabling component region.

The maximum height of the reference solution above the motherboard is 71.12 mm [2.8 inches],

and is compliant with the motherboard primary side height constraints defined in the

ATX

Specification revision 2.1

and the

microATX Motherboard Interface Specification revision 1.1

found at

http://www.formfactors.org

. The reference solution requires a chassis obstruction height

of at least 81.28 mm [3.2 inches], measured from the top of the motherboard (refer to

Sections 3.3 and 5.1.4). This allows for appropriate fan inlet airflow to ensure fan performance,

and therefore overall cooling solution performance. This is compliant with the recommendations

found in both

ATX Specification V2.1

and

microATX Motherboard Interface Specification V1.1

documents.