Home » Intel Manuals » Processors » Intel 640 » Manual Viewer

Intel 640 User Guide - Page 85

Removing Excess Adhesive from IHS, Filling the Groove with Adhesive

UPC - 683728178901

Add to My Manuals
Save this manual to your list of manuals

Page 85 highlights

Case Temperature Reference Metrology R 18. Use a blade to carefully shave excess adhesive above the IHS surface (Figure 39). Note: Take usual safety precautions when using open blades and performing this operation. Figure 39. Removing Excess Adhesive from IHS 19. Install new Kapton tape to hold the thermocouple wire down and fill the rest of the groove with adhesive (see Figure 40). Make sure the wire and insulation is entirely within the groove and below the IHS surface. Figure 40. Filling the Groove with Adhesive Filling with Adhesive Kapton* Tape 20. Curing time for the rest of the adhesive in the groove can be reduced using Loctite Accelerator 7452. 21. Repeat step 5 to remove any access adhesive to ensure flat IHS for proper mechanical contact to the heatsink surface. Thermal/Mechanical Design Guide 85

Section	Page
Contents	3
Figures	6
Tables	7
Revision History	8
1 Introduction	9
1.1 Document Goals and Scope	9
1.1.1 Importance of Thermal Management	9
1.1.2 Document Goals	9
1.1.3 Document Scope	10
1.2 References	11
1.3 Definition of Terms	12
2 Processor Thermal/Mechanical Information	15
2.1 Mechanical Requirements	15
2.1.1 Processor Package	15
2.1.2 Heatsink Attach	17
2.1.2.1 General Guidelines	17
2.1.2.2 Heatsink Clip Load Requirement	17
2.1.2.3 Additional Guidelines	18
2.2 Thermal Requirements	18
2.2.1 Processor Case Temperature	18
2.2.2 Thermal Profile	19
2.2.3 TCONTROL	20
2.3 Heatsink Design Considerations	21
2.3.1 Heatsink Size	22
2.3.2 Heatsink Mass	22
2.3.3 Package IHS Flatness	22
2.3.4 Thermal Interface Material	23
2.4 System Thermal Solution Considerations	23
2.4.1 Chassis Thermal Design Capabilities	23
2.4.2 Improving Chassis Thermal Performance	23
2.4.3 Summary	24
2.5 System Integration Considerations	24
3 Thermal Metrology	25
3.1 Characterizing Cooling Performance Requirements	25
3.1.1 Example	26
3.2 Processor Thermal Solution Performance Assessment	27
3.3 Local Ambient Temperature Measurement Guidelines	27
3.4 Processor Case Temperature Measurement Guidelines	30
4 Thermal Management Logic and Thermal Monitor Feature	31
4.1 Processor Power Dissipation	31
4.2 Thermal Monitor Implementation	31
4.2.1 PROCHOT# Signal	32
4.2.2 Thermal Control Circuit	32
4.2.3 Operation and Configuration	33
4.2.4 On-Demand Mode	34
4.2.5 System Considerations	34
4.2.6 Operating System and Application Software Considerations	35
4.2.7 On-Die Thermal Diode	35
4.2.7.1 Reading the On-Die Thermal Diode Interface	35
4.2.7.2 Correction Factors for the On-Die Thermal Diode	36
4.2.8 THERMTRIP# Signal	37
4.2.8.1 Cooling System Failure Warning	37
5 Intel® Thermal/Mechanical Reference Design Information	39
5.1 Intel Validation Criteria for the Reference Design	39
5.1.1 Heatsink Performance Target	39
5.1.2 Acoustics	40
5.1.3 Altitude	40
5.1.4 Reference Heatsink Thermal Validation	41
5.1.5 Fan Performance for Active Heatsink Thermal Solution	41
5.2 Environmental Reliability Testing	42
5.2.1 Structural Reliability Testing	42
5.2.1.1 Random Vibration Test Procedure	42
5.2.1.2 Shock Test Procedure	42
5.2.2 Power Cycling	44
5.2.3 Recommended BIOS/Processor/Memory Test Procedures	44
5.3 Material and Recycling Requirements	44
5.4 Safety Requirements	45
5.5 Geometric Envelope for ATX Intel® Reference Thermal Mechanical Design	45
5.6 ATX Reference Thermal Mechanical Solution for the Intel® Pentium® 4 Processor in the 775–Land LGA Package	46
5.7 Reference Attach Mechanism	48
5.7.1 Structural Design Strategy	48
5.7.2 Mechanical Interface to the Reference Attach Mechanism	49
6 Acoustic Fan Speed Control	53
6.1 Acoustic Fan Speed Control	53
6.2 Thermal Solution Design	53
6.2.1 Compliance to Thermal Profile	53
6.2.2 Determine Thermistor Set Points	53
6.2.3 Minimum Fan Speed Set Point	54
6.3 Board and System Implementation	55
6.3.1 Choosing Fan Speed Control Settings	55
6.3.1.1 Temperature to begin Fan Acceleration	56
6.3.1.2 Minimum PWM Duty Cycle	58
6.4 Combining Thermistor and Thermal Diode Control	59

Match case Limit results 1 per page

Case Temperature Reference Metrology

Thermal/Mechanical Design Guide

18.

Use a blade to carefully shave excess adhesive above the IHS surface (Figure 39).

Note:

Take usual safety precautions when using open blades and performing this operation.

Figure 39. Removing Excess Adhesive from IHS

19.

Install new Kapton tape to hold the thermocouple wire down and fill the rest of the groove

with adhesive (see Figure 40). Make sure the wire and insulation is entirely within the groove

and below the IHS surface.

Figure 40. Filling the Groove with Adhesive

Kapton* Tape

Filling with

Adhesive

20.

Curing time for the rest of the adhesive in the groove can be reduced using Loctite

Accelerator 7452.

21.

Repeat step 5 to remove any access adhesive to ensure flat IHS for proper mechanical contact

to the heatsink surface.