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B.3.1, Time-Zero, Room Temperature Preload Measurement, B.3.2, Preload Degradation under Bake

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Heatsink Clip Load Metrology R B.3.1 B.3.2 Time-Zero, Room Temperature Preload Measurement 1. Pre-assemble mechanical components on the board as needed prior to mounting the motherboard on an appropriate support fixture that replicates the board attach to a target chassis. • For example: standard ATX board should sit on ATX compliant stand-offs. If the attach mechanism includes fixtures on the back side of the board, those must be included, as the goal of the test is to measure the load provided by the actual heatsink mechanism. 2. Install the test vehicle in the socket 3. Assemble the heatsink reworked with the load cells to motherboard as shown for the Intel RCBFH-3 reference heatsink example in Figure 26, and actuate attach mechanism. 4. Collect continuous load cell data at 1 Hz for the duration of the test. A minimum time to allow the load cell to settle is generally specified by the load vendors (often in the order of 3 minutes). The time zero reading should be taken at the end of this settling time. 5. Record the preload measurement (total from all three load cells) at the target time and average the values over 10 seconds around this target time as well, i.e. in the interval , for example over [target time - 5 seconds ; target time + 5 seconds]. Preload Degradation under Bake Conditions This section describes an example of testing for potential clip load degradation under bake conditions. 1. Preheat thermal chamber to target temperature (45 ºC or 85 ºC for example) 2. Repeat time-zero, room temperature preload measurement 3. Place unit into preheated thermal chamber for specified time 4. Record continuous load cell data as follows: • Sample rate = 0.1 Hz for first 3 hrs • Sample rate = 0.01 Hz for the remainder of the bake test 5. Remove assembly from thermal chamber and set into room temperature conditions 6. Record continuous load cell data for next 30 minutes at sample rate of 1 Hz. § Thermal/Mechanical Design Guide 71

Section	Page
Contents	3
Figures	6
Tables	7
Revision History	8
1 Introduction	9
1.1 Document Goals and Scope	9
1.1.1 Importance of Thermal Management	9
1.1.2 Document Goals	9
1.1.3 Document Scope	10
1.2 References	11
1.3 Definition of Terms	12
2 Processor Thermal/Mechanical Information	15
2.1 Mechanical Requirements	15
2.1.1 Processor Package	15
2.1.2 Heatsink Attach	17
2.1.2.1 General Guidelines	17
2.1.2.2 Heatsink Clip Load Requirement	17
2.1.2.3 Additional Guidelines	18
2.2 Thermal Requirements	18
2.2.1 Processor Case Temperature	18
2.2.2 Thermal Profile	19
2.2.3 TCONTROL	20
2.3 Heatsink Design Considerations	21
2.3.1 Heatsink Size	22
2.3.2 Heatsink Mass	22
2.3.3 Package IHS Flatness	22
2.3.4 Thermal Interface Material	23
2.4 System Thermal Solution Considerations	23
2.4.1 Chassis Thermal Design Capabilities	23
2.4.2 Improving Chassis Thermal Performance	23
2.4.3 Summary	24
2.5 System Integration Considerations	24
3 Thermal Metrology	25
3.1 Characterizing Cooling Performance Requirements	25
3.1.1 Example	26
3.2 Processor Thermal Solution Performance Assessment	27
3.3 Local Ambient Temperature Measurement Guidelines	27
3.4 Processor Case Temperature Measurement Guidelines	30
4 Thermal Management Logic and Thermal Monitor Feature	31
4.1 Processor Power Dissipation	31
4.2 Thermal Monitor Implementation	31
4.2.1 PROCHOT# Signal	32
4.2.2 Thermal Control Circuit	32
4.2.3 Operation and Configuration	33
4.2.4 On-Demand Mode	34
4.2.5 System Considerations	34
4.2.6 Operating System and Application Software Considerations	35
4.2.7 On-Die Thermal Diode	35
4.2.7.1 Reading the On-Die Thermal Diode Interface	35
4.2.7.2 Correction Factors for the On-Die Thermal Diode	36
4.2.8 THERMTRIP# Signal	37
4.2.8.1 Cooling System Failure Warning	37
5 Intel® Thermal/Mechanical Reference Design Information	39
5.1 Intel Validation Criteria for the Reference Design	39
5.1.1 Heatsink Performance Target	39
5.1.2 Acoustics	40
5.1.3 Altitude	40
5.1.4 Reference Heatsink Thermal Validation	41
5.1.5 Fan Performance for Active Heatsink Thermal Solution	41
5.2 Environmental Reliability Testing	42
5.2.1 Structural Reliability Testing	42
5.2.1.1 Random Vibration Test Procedure	42
5.2.1.2 Shock Test Procedure	42
5.2.2 Power Cycling	44
5.2.3 Recommended BIOS/Processor/Memory Test Procedures	44
5.3 Material and Recycling Requirements	44
5.4 Safety Requirements	45
5.5 Geometric Envelope for ATX Intel® Reference Thermal Mechanical Design	45
5.6 ATX Reference Thermal Mechanical Solution for the Intel® Pentium® 4 Processor in the 775–Land LGA Package	46
5.7 Reference Attach Mechanism	48
5.7.1 Structural Design Strategy	48
5.7.2 Mechanical Interface to the Reference Attach Mechanism	49
6 Acoustic Fan Speed Control	53
6.1 Acoustic Fan Speed Control	53
6.2 Thermal Solution Design	53
6.2.1 Compliance to Thermal Profile	53
6.2.2 Determine Thermistor Set Points	53
6.2.3 Minimum Fan Speed Set Point	54
6.3 Board and System Implementation	55
6.3.1 Choosing Fan Speed Control Settings	55
6.3.1.1 Temperature to begin Fan Acceleration	56
6.3.1.2 Minimum PWM Duty Cycle	58
6.4 Combining Thermistor and Thermal Diode Control	59

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Heatsink Clip Load Metrology

Thermal/Mechanical Design Guide

B.3.1

Time-Zero, Room Temperature Preload Measurement

Pre-assemble mechanical components on the board as needed prior to mounting the

motherboard on an appropriate support fixture that replicates the board attach to a target

chassis.

•

For example: standard ATX board should sit on ATX compliant stand-offs. If the attach

mechanism includes fixtures on the back side of the board, those must be included, as the

goal of the test is to measure the load provided by the actual heatsink mechanism.

Install the test vehicle in the socket

Assemble the heatsink reworked with the load cells to motherboard as shown for the Intel

RCBFH-3 reference heatsink example in Figure 26, and actuate attach mechanism.

Collect continuous load cell data at 1 Hz for the duration of the test. A minimum time to

allow the load cell to settle is generally specified by the load vendors (often in the order of

3 minutes). The time zero reading should be taken at the end of this settling time.

Record the preload measurement (total from all three load cells) at the target time and

average the values over 10 seconds around this target time as well, i.e. in the interval , for

example over [target time – 5 seconds ; target time + 5 seconds].

B.3.2

Preload Degradation under Bake Conditions

This section describes an example of testing for potential clip load degradation under bake

conditions.

Preheat thermal chamber to target temperature (45 ºC or 85 ºC for example)

Repeat time-zero, room temperature preload measurement

Place unit into preheated thermal chamber for specified time

Record continuous load cell data as follows:

•

Sample rate = 0.1 Hz for first 3 hrs

•

Sample rate = 0.01 Hz for the remainder of the bake test

Remove assembly from thermal chamber and set into room temperature conditions

Record continuous load cell data for next 30 minutes at sample rate of 1 Hz.