Intel 640 User Guide - Page 105

Intel Enabled Reference Solution Information

R

Thermal/Mechanical Design Guide

105

Appendix H Intel Enabled Reference

Solution Information

This appendix includes current supplier information for Intel enabled vendors for the Pentium 4

processor in the 775–land LGA package reference thermal solution.

The reference component designs are available for adoption by suppliers and heatsink integrators

pending completion of appropriate licensing contracts. For more information on licensing, contact

the Intel representative mentioned in Table 10.

Table 10. Intel Representative Contact for Licensing Information

Company

Contact

Phone

Email

Intel Corporation

Tony De Leon

(253) 371-9339

[email protected]

Table 11 lists current suppliers that produce Intel enabled reference components. The part

numbers listed below identifies these reference components. End-users are responsible for the

verification of the Intel enabled component offerings with the supplier. OEMs and System

Integrators are responsible for thermal, mechanical, and environmental validation of these

solutions.

Table 11. Intel Reference Component Thermal Solution Provider

Supplier

Part

Description

Part Number

Contact

Phone

Email

CCI

(Chaun-

Choung

Technology

Corp.)

Intel

®

RCBFH-3

Reference

Heatsink

C40387

Harry Lin

Monica

Chih

714-739-5797

+886-2-

29952666

Extension 131

[email protected]

monica_chih@ccic.

com.tw

AVC

(ASIA Vital

Components

Co., Ltd)

Intel

®

RCBFH-3

Reference

Heatsink

C40387

David

Chao

+886-2-

22996930

Extension:

619

[email protected]

m.tw

Sunon

RCBFH-3

Fan

Assembly

N/A

Tom

Blaskovich

714-255-0208

extension 206

[email protected]

ITW Fastex

RCBFH-3

Fastener

Base: C33389

Cap: C33390

Ron

Schmidt

847-299-2222

rschmidt@itwfastex.

com

Note:

These vendors and devices are listed by Intel as a convenience to Intel's general customer base,

but Intel does not make any representations or warranties whatsoever regarding quality,

reliability, functionality, or compatibility of these devices. This list and/or these devices may be

subject to change without notice.

§

Section	Page
Contents	3
Figures	6
Tables	7
Revision History	8
1 Introduction	9
1.1 Document Goals and Scope	9
1.1.1 Importance of Thermal Management	9
1.1.2 Document Goals	9
1.1.3 Document Scope	10
1.2 References	11
1.3 Definition of Terms	12
2 Processor Thermal/Mechanical Information	15
2.1 Mechanical Requirements	15
2.1.1 Processor Package	15
2.1.2 Heatsink Attach	17
2.1.2.1 General Guidelines	17
2.1.2.2 Heatsink Clip Load Requirement	17
2.1.2.3 Additional Guidelines	18
2.2 Thermal Requirements	18
2.2.1 Processor Case Temperature	18
2.2.2 Thermal Profile	19
2.2.3 TCONTROL	20
2.3 Heatsink Design Considerations	21
2.3.1 Heatsink Size	22
2.3.2 Heatsink Mass	22
2.3.3 Package IHS Flatness	22
2.3.4 Thermal Interface Material	23
2.4 System Thermal Solution Considerations	23
2.4.1 Chassis Thermal Design Capabilities	23
2.4.2 Improving Chassis Thermal Performance	23
2.4.3 Summary	24
2.5 System Integration Considerations	24
3 Thermal Metrology	25
3.1 Characterizing Cooling Performance Requirements	25
3.1.1 Example	26
3.2 Processor Thermal Solution Performance Assessment	27
3.3 Local Ambient Temperature Measurement Guidelines	27
3.4 Processor Case Temperature Measurement Guidelines	30
4 Thermal Management Logic and Thermal Monitor Feature	31
4.1 Processor Power Dissipation	31
4.2 Thermal Monitor Implementation	31
4.2.1 PROCHOT# Signal	32
4.2.2 Thermal Control Circuit	32
4.2.3 Operation and Configuration	33
4.2.4 On-Demand Mode	34
4.2.5 System Considerations	34
4.2.6 Operating System and Application Software Considerations	35
4.2.7 On-Die Thermal Diode	35
4.2.7.1 Reading the On-Die Thermal Diode Interface	35
4.2.7.2 Correction Factors for the On-Die Thermal Diode	36
4.2.8 THERMTRIP# Signal	37
4.2.8.1 Cooling System Failure Warning	37
5 Intel® Thermal/Mechanical Reference Design Information	39
5.1 Intel Validation Criteria for the Reference Design	39
5.1.1 Heatsink Performance Target	39
5.1.2 Acoustics	40
5.1.3 Altitude	40
5.1.4 Reference Heatsink Thermal Validation	41
5.1.5 Fan Performance for Active Heatsink Thermal Solution	41
5.2 Environmental Reliability Testing	42
5.2.1 Structural Reliability Testing	42
5.2.1.1 Random Vibration Test Procedure	42
5.2.1.2 Shock Test Procedure	42
5.2.2 Power Cycling	44
5.2.3 Recommended BIOS/Processor/Memory Test Procedures	44
5.3 Material and Recycling Requirements	44
5.4 Safety Requirements	45
5.5 Geometric Envelope for ATX Intel® Reference Thermal Mechanical Design	45
5.6 ATX Reference Thermal Mechanical Solution for the Intel® Pentium® 4 Processor in the 775–Land LGA Package	46
5.7 Reference Attach Mechanism	48
5.7.1 Structural Design Strategy	48
5.7.2 Mechanical Interface to the Reference Attach Mechanism	49
6 Acoustic Fan Speed Control	53
6.1 Acoustic Fan Speed Control	53
6.2 Thermal Solution Design	53
6.2.1 Compliance to Thermal Profile	53
6.2.2 Determine Thermistor Set Points	53
6.2.3 Minimum Fan Speed Set Point	54
6.3 Board and System Implementation	55
6.3.1 Choosing Fan Speed Control Settings	55
6.3.1.1 Temperature to begin Fan Acceleration	56
6.3.1.2 Minimum PWM Duty Cycle	58
6.4 Combining Thermistor and Thermal Diode Control	59

Intel 640 User Guide - Page 105

Appendix H Intel Enabled Reference, Solution Information

Page 105 highlights