Home » Intel Manuals » Processors » Intel 640 » Manual Viewer

Intel 640 User Guide - Page 24

System Integration Considerations

UPC - 683728178901

Add to My Manuals
Save this manual to your list of manuals

Page 24 highlights

Processor Thermal/Mechanical Information R 2.4.3 2.5 To ease the burden on thermal solutions, the Thermal Monitor feature and associated logic have been integrated into the silicon of the Pentium 4 processor in the 775-land LGA package. By taking advantage of the Thermal Monitor feature, system designers may reduce thermal solution cost by designing to TDP instead of maximum power. Thermal Monitor attempts to protect the processor during sustained workload above TDP. Implementation options and recommendations are described in Chapter 4. Summary In summary, considerations in heatsink design include: • The local ambient temperature TA at the heatsink, which is a function of chassis design. • The thermal design power (TDP) of the processor, and the corresponding maximum TC as calculated from the thermal profile. These parameters are usually combined in a single cooling performance parameter, ΨCA (case to air thermal characterization parameter). More information on the definition and the use of ΨCA is given Section 3.1. • Heatsink interface to IHS surface characteristics, including flatness and roughness. • The performance of the thermal interface material used between the heatsink and the IHS. • The required heatsink clip static load, between 18 lbf to 70 lbf throughout the life of the product (Refer to Section 2.1.2.2 for further information). • Surface area of the heatsink. • Heatsink material and technology. • Volume of airflow over the heatsink surface area. • Development of airflow entering and within the heatsink area. • Physical volumetric constraints placed by the system System Integration Considerations Boxed Intel® Pentium® 4 Processor in the 775-Land LGA Package - Integration Video provides best known methods for package and heatsink installation and removal for LGA775 socket based platforms and systems manufacturing. The video is available on the Web, from http://www.intel.com/go/integration. § 24 Thermal/Mechanical Design Guide

Section	Page
Contents	3
Figures	6
Tables	7
Revision History	8
1 Introduction	9
1.1 Document Goals and Scope	9
1.1.1 Importance of Thermal Management	9
1.1.2 Document Goals	9
1.1.3 Document Scope	10
1.2 References	11
1.3 Definition of Terms	12
2 Processor Thermal/Mechanical Information	15
2.1 Mechanical Requirements	15
2.1.1 Processor Package	15
2.1.2 Heatsink Attach	17
2.1.2.1 General Guidelines	17
2.1.2.2 Heatsink Clip Load Requirement	17
2.1.2.3 Additional Guidelines	18
2.2 Thermal Requirements	18
2.2.1 Processor Case Temperature	18
2.2.2 Thermal Profile	19
2.2.3 TCONTROL	20
2.3 Heatsink Design Considerations	21
2.3.1 Heatsink Size	22
2.3.2 Heatsink Mass	22
2.3.3 Package IHS Flatness	22
2.3.4 Thermal Interface Material	23
2.4 System Thermal Solution Considerations	23
2.4.1 Chassis Thermal Design Capabilities	23
2.4.2 Improving Chassis Thermal Performance	23
2.4.3 Summary	24
2.5 System Integration Considerations	24
3 Thermal Metrology	25
3.1 Characterizing Cooling Performance Requirements	25
3.1.1 Example	26
3.2 Processor Thermal Solution Performance Assessment	27
3.3 Local Ambient Temperature Measurement Guidelines	27
3.4 Processor Case Temperature Measurement Guidelines	30
4 Thermal Management Logic and Thermal Monitor Feature	31
4.1 Processor Power Dissipation	31
4.2 Thermal Monitor Implementation	31
4.2.1 PROCHOT# Signal	32
4.2.2 Thermal Control Circuit	32
4.2.3 Operation and Configuration	33
4.2.4 On-Demand Mode	34
4.2.5 System Considerations	34
4.2.6 Operating System and Application Software Considerations	35
4.2.7 On-Die Thermal Diode	35
4.2.7.1 Reading the On-Die Thermal Diode Interface	35
4.2.7.2 Correction Factors for the On-Die Thermal Diode	36
4.2.8 THERMTRIP# Signal	37
4.2.8.1 Cooling System Failure Warning	37
5 Intel® Thermal/Mechanical Reference Design Information	39
5.1 Intel Validation Criteria for the Reference Design	39
5.1.1 Heatsink Performance Target	39
5.1.2 Acoustics	40
5.1.3 Altitude	40
5.1.4 Reference Heatsink Thermal Validation	41
5.1.5 Fan Performance for Active Heatsink Thermal Solution	41
5.2 Environmental Reliability Testing	42
5.2.1 Structural Reliability Testing	42
5.2.1.1 Random Vibration Test Procedure	42
5.2.1.2 Shock Test Procedure	42
5.2.2 Power Cycling	44
5.2.3 Recommended BIOS/Processor/Memory Test Procedures	44
5.3 Material and Recycling Requirements	44
5.4 Safety Requirements	45
5.5 Geometric Envelope for ATX Intel® Reference Thermal Mechanical Design	45
5.6 ATX Reference Thermal Mechanical Solution for the Intel® Pentium® 4 Processor in the 775–Land LGA Package	46
5.7 Reference Attach Mechanism	48
5.7.1 Structural Design Strategy	48
5.7.2 Mechanical Interface to the Reference Attach Mechanism	49
6 Acoustic Fan Speed Control	53
6.1 Acoustic Fan Speed Control	53
6.2 Thermal Solution Design	53
6.2.1 Compliance to Thermal Profile	53
6.2.2 Determine Thermistor Set Points	53
6.2.3 Minimum Fan Speed Set Point	54
6.3 Board and System Implementation	55
6.3.1 Choosing Fan Speed Control Settings	55
6.3.1.1 Temperature to begin Fan Acceleration	56
6.3.1.2 Minimum PWM Duty Cycle	58
6.4 Combining Thermistor and Thermal Diode Control	59

Match case Limit results 1 per page

Processor Thermal/Mechanical Information

Thermal/Mechanical Design Guide

To ease the burden on thermal solutions, the Thermal Monitor feature and associated logic have

been integrated into the silicon of the Pentium 4 processor in the 775–land LGA package. By

taking advantage of the Thermal Monitor feature, system designers may reduce thermal solution

cost by designing to TDP instead of maximum power. Thermal Monitor attempts to protect the

processor during sustained workload above TDP. Implementation options and recommendations

are described in Chapter 4.

2.4.3

Summary

In summary, considerations in heatsink design include:

•

The local ambient temperature T

at the heatsink, which is a function of chassis design.

•

The thermal design power (TDP) of the processor, and the corresponding maximum T

calculated from the thermal profile. These parameters are usually combined in a single

cooling performance parameter,

(case to air thermal characterization parameter). More

information on the definition and the use of

is given Section 3.1.

•

Heatsink interface to IHS surface characteristics, including flatness and roughness.

•

The performance of the thermal interface material used between the heatsink and the IHS.

•

The required heatsink clip static load, between 18 lbf to 70 lbf throughout the life of the

product (Refer to Section 2.1.2.2 for further information).

•

Surface area of the heatsink.

•

Heatsink material and technology.

•

Volume of airflow over the heatsink surface area.

•

Development of airflow entering and within the heatsink area.

•

Physical volumetric constraints placed by the system

2.5

System Integration Considerations

Boxed Intel

Pentium

4 Processor in the 775-Land LGA Package - Integration Video

provides

best known methods for package and heatsink installation and removal for LGA775 socket based

platforms and systems manufacturing. The video is available on the Web, from

http://www.intel.com/go/integration