Intel 640 User Guide - Page 5

R A.2.2 Motherboard Deflection Metric Definition 62 A.2.3 Board Deflection Limits 63 A.2.4 Board Deflection Metric Implementation Example 64 A.2.5 Additional Considerations 65 A.2.5.1 Motherboard Stiffening Considerations 65 A.3 Heatsink Selection Guidelines 66 Appendix B Appendix C Heatsink Clip Load Metrology 67 B.1 Overview...67 B.2 Test Preparation 67 B.2.1 Heatsink Preparation 67 B.2.2 Typical Test Equipment 70 B.3 Test Procedure Examples 70 B.3.1 Time-Zero, Room Temperature Preload Measurement 71 B.3.2 Preload Degradation under Bake Conditions 71 Thermal Interface Management 73 C.1 Bond Line Management 73 C.2 Interface Material Area 73 C.3 Interface Material Performance 73 Appendix D Case Temperature Reference Metrology 75 D.1 Objective and Scope 75 D.2 Definitions...75 D.3 Supporting Test Equipment 76 D.4 Thermal Calibration and Controls 77 D.5 IHS Groove...77 D.6 Thermocouple Attach Procedure 80 D.6.1 Thermocouple Conditioning and Preparation 80 D.6.2 Thermocouple Attachment to the IHS 80 D.6.3 Curing Process 84 D.7 Thermocouple Wire Management 86 Appendix E Board Level PWM and Fan Speed Control Requirements 87 Appendix F Balanced Technology Extended (BTX) System Thermal Considerations 91 Appendix G Mechanical Drawings...93 Appendix H Intel Enabled Reference Solution Information 105 Thermal/Mechanical Design Guide 5