Intel 640 User Guide - Page 84
D.6.3, Curing Process
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Case Temperature Reference Metrology R Figure 37. Applying the Adhesive on the Thermocouple Bead 13. Measure the resistance from the thermocouple end wires again using the DMM (refer to Section D.6.1, step 2) and to ensure the bead is still properly contacting the IHS. D.6.3 Curing Process 14. Let the thermocouple attach set in the open-air for at least 1/2 Hr. It is not recommended to use any curing accelerator like Loctite Accelerator 7452 for this step, as rapid contraction of the adhesive during curing may weaken bead attach on the IHS. 15. Reconfirm electrical connectivity with DMM before removing the micromanipulator (Figure 36) ( see Section D.6.1, step 2 and above). 16. Remove the 3D Arm needle by holding down the processor unit and lifting the arm. 17. Remove the Kapton tape, straighten the wire in the groove so it lays flat all the way to the end of the groove Figure 38. Figure 38. Thermocouple Wire Management in the Groove 84 Thermal/Mechanical Design Guide