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Thermocouple Attach Procedure

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Case Temperature Reference Metrology R D.6 Thermocouple Attach Procedure D.6.1 Thermocouple Conditioning and Preparation 1. Use a calibrated thermocouple as specified in Sections D.3 and D.4. 2. Measure the thermocouple resistance by holding both wires on one probe and the tip of thermocouple to the other probe of the DMM (measurement should be about~75 ohms for 40-gauge type T thermocouple). 3. Straighten the wire for about 38 mm [1 ½ inch] from the bead to place it inside the channel. 4. Bend the tip of the thermocouple at approximately 45 degree angle by about 0.8 mm [0.030 inch] from the tip (Figure 30). Figure 30. Bending the Tip of the Thermocouple D.6.2 Thermocouple Attachment to the IHS 5. Clean groove with IPA and a lint free cloth removing all residues prior to thermocouple attachment. 6. Place the thermocouple wire inside the groove; letting the exposed wire and bead extend about 3.2 mm [0.125 inch] past the end of groove. Secure it with Kapton tape (Figure 31). 80 Thermal/Mechanical Design Guide

Section	Page
Contents	3
Figures	6
Tables	7
Revision History	8
1 Introduction	9
1.1 Document Goals and Scope	9
1.1.1 Importance of Thermal Management	9
1.1.2 Document Goals	9
1.1.3 Document Scope	10
1.2 References	11
1.3 Definition of Terms	12
2 Processor Thermal/Mechanical Information	15
2.1 Mechanical Requirements	15
2.1.1 Processor Package	15
2.1.2 Heatsink Attach	17
2.1.2.1 General Guidelines	17
2.1.2.2 Heatsink Clip Load Requirement	17
2.1.2.3 Additional Guidelines	18
2.2 Thermal Requirements	18
2.2.1 Processor Case Temperature	18
2.2.2 Thermal Profile	19
2.2.3 TCONTROL	20
2.3 Heatsink Design Considerations	21
2.3.1 Heatsink Size	22
2.3.2 Heatsink Mass	22
2.3.3 Package IHS Flatness	22
2.3.4 Thermal Interface Material	23
2.4 System Thermal Solution Considerations	23
2.4.1 Chassis Thermal Design Capabilities	23
2.4.2 Improving Chassis Thermal Performance	23
2.4.3 Summary	24
2.5 System Integration Considerations	24
3 Thermal Metrology	25
3.1 Characterizing Cooling Performance Requirements	25
3.1.1 Example	26
3.2 Processor Thermal Solution Performance Assessment	27
3.3 Local Ambient Temperature Measurement Guidelines	27
3.4 Processor Case Temperature Measurement Guidelines	30
4 Thermal Management Logic and Thermal Monitor Feature	31
4.1 Processor Power Dissipation	31
4.2 Thermal Monitor Implementation	31
4.2.1 PROCHOT# Signal	32
4.2.2 Thermal Control Circuit	32
4.2.3 Operation and Configuration	33
4.2.4 On-Demand Mode	34
4.2.5 System Considerations	34
4.2.6 Operating System and Application Software Considerations	35
4.2.7 On-Die Thermal Diode	35
4.2.7.1 Reading the On-Die Thermal Diode Interface	35
4.2.7.2 Correction Factors for the On-Die Thermal Diode	36
4.2.8 THERMTRIP# Signal	37
4.2.8.1 Cooling System Failure Warning	37
5 Intel® Thermal/Mechanical Reference Design Information	39
5.1 Intel Validation Criteria for the Reference Design	39
5.1.1 Heatsink Performance Target	39
5.1.2 Acoustics	40
5.1.3 Altitude	40
5.1.4 Reference Heatsink Thermal Validation	41
5.1.5 Fan Performance for Active Heatsink Thermal Solution	41
5.2 Environmental Reliability Testing	42
5.2.1 Structural Reliability Testing	42
5.2.1.1 Random Vibration Test Procedure	42
5.2.1.2 Shock Test Procedure	42
5.2.2 Power Cycling	44
5.2.3 Recommended BIOS/Processor/Memory Test Procedures	44
5.3 Material and Recycling Requirements	44
5.4 Safety Requirements	45
5.5 Geometric Envelope for ATX Intel® Reference Thermal Mechanical Design	45
5.6 ATX Reference Thermal Mechanical Solution for the Intel® Pentium® 4 Processor in the 775–Land LGA Package	46
5.7 Reference Attach Mechanism	48
5.7.1 Structural Design Strategy	48
5.7.2 Mechanical Interface to the Reference Attach Mechanism	49
6 Acoustic Fan Speed Control	53
6.1 Acoustic Fan Speed Control	53
6.2 Thermal Solution Design	53
6.2.1 Compliance to Thermal Profile	53
6.2.2 Determine Thermistor Set Points	53
6.2.3 Minimum Fan Speed Set Point	54
6.3 Board and System Implementation	55
6.3.1 Choosing Fan Speed Control Settings	55
6.3.1.1 Temperature to begin Fan Acceleration	56
6.3.1.2 Minimum PWM Duty Cycle	58
6.4 Combining Thermistor and Thermal Diode Control	59

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Case Temperature Reference Metrology

Thermal/Mechanical Design Guide

D.6

Thermocouple Attach Procedure

D.6.1

Thermocouple Conditioning and Preparation

Use a calibrated thermocouple as specified in Sections D.3 and D.4.

Measure the thermocouple resistance by holding both wires on one probe and the tip of

thermocouple to the other probe of the DMM (measurement should be about~75 ohms for

40-gauge type T thermocouple).

Straighten the wire for about 38 mm [1 ½ inch] from the bead to place it inside the channel.

Bend the tip of the thermocouple at approximately 45 degree angle by about 0.8 mm

[0.030 inch] from the tip (Figure 30).

Figure 30. Bending the Tip of the Thermocouple

D.6.2

Thermocouple Attachment to the IHS

Clean groove with IPA and a lint free cloth removing all residues prior to thermocouple

attachment.

Place the thermocouple wire inside the groove; letting the exposed wire and bead extend

about 3.2 mm [0.125 inch] past the end of groove. Secure it with Kapton tape (Figure 31).