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Intel 640 User Guide - Page 82

Position Bead on the Groove Step, Detailed Thermocouple Bead Placement

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Case Temperature Reference Metrology R 8. Place the processor under the microscope unit (similar to the one used in Figure 36) to continue with the process. It is also recommended to use a fixture (like a processor tray or a plate) to help hold the unit in place for the rest of the attach process. 9. Press the wire down about 6 mm [0.125"] from the thermocouple bead using the tweezers. Look in the microscope to perform this task. Place a piece of Kapton tape to hold the wire inside the groove (Figure 33). Refer to Figure 34 for detailed bead placement. Figure 33. Position Bead on the Groove Step Kapton* tape Wire section into the groove to prepare for final bead placement Figure 34. Detailed Thermocouple Bead Placement 10. Using the micromanipulator, install the needle near to the end of the groove on top of the thermocouple. Using the X, Y, and Z axes on the arm place the tip of the needle on top of the thermocouple bead. Press down until the bead is seated at the end of the groove on top of the step (see Figure 34 and Figure 35). 82 Thermal/Mechanical Design Guide

Section	Page
Contents	3
Figures	6
Tables	7
Revision History	8
1 Introduction	9
1.1 Document Goals and Scope	9
1.1.1 Importance of Thermal Management	9
1.1.2 Document Goals	9
1.1.3 Document Scope	10
1.2 References	11
1.3 Definition of Terms	12
2 Processor Thermal/Mechanical Information	15
2.1 Mechanical Requirements	15
2.1.1 Processor Package	15
2.1.2 Heatsink Attach	17
2.1.2.1 General Guidelines	17
2.1.2.2 Heatsink Clip Load Requirement	17
2.1.2.3 Additional Guidelines	18
2.2 Thermal Requirements	18
2.2.1 Processor Case Temperature	18
2.2.2 Thermal Profile	19
2.2.3 TCONTROL	20
2.3 Heatsink Design Considerations	21
2.3.1 Heatsink Size	22
2.3.2 Heatsink Mass	22
2.3.3 Package IHS Flatness	22
2.3.4 Thermal Interface Material	23
2.4 System Thermal Solution Considerations	23
2.4.1 Chassis Thermal Design Capabilities	23
2.4.2 Improving Chassis Thermal Performance	23
2.4.3 Summary	24
2.5 System Integration Considerations	24
3 Thermal Metrology	25
3.1 Characterizing Cooling Performance Requirements	25
3.1.1 Example	26
3.2 Processor Thermal Solution Performance Assessment	27
3.3 Local Ambient Temperature Measurement Guidelines	27
3.4 Processor Case Temperature Measurement Guidelines	30
4 Thermal Management Logic and Thermal Monitor Feature	31
4.1 Processor Power Dissipation	31
4.2 Thermal Monitor Implementation	31
4.2.1 PROCHOT# Signal	32
4.2.2 Thermal Control Circuit	32
4.2.3 Operation and Configuration	33
4.2.4 On-Demand Mode	34
4.2.5 System Considerations	34
4.2.6 Operating System and Application Software Considerations	35
4.2.7 On-Die Thermal Diode	35
4.2.7.1 Reading the On-Die Thermal Diode Interface	35
4.2.7.2 Correction Factors for the On-Die Thermal Diode	36
4.2.8 THERMTRIP# Signal	37
4.2.8.1 Cooling System Failure Warning	37
5 Intel® Thermal/Mechanical Reference Design Information	39
5.1 Intel Validation Criteria for the Reference Design	39
5.1.1 Heatsink Performance Target	39
5.1.2 Acoustics	40
5.1.3 Altitude	40
5.1.4 Reference Heatsink Thermal Validation	41
5.1.5 Fan Performance for Active Heatsink Thermal Solution	41
5.2 Environmental Reliability Testing	42
5.2.1 Structural Reliability Testing	42
5.2.1.1 Random Vibration Test Procedure	42
5.2.1.2 Shock Test Procedure	42
5.2.2 Power Cycling	44
5.2.3 Recommended BIOS/Processor/Memory Test Procedures	44
5.3 Material and Recycling Requirements	44
5.4 Safety Requirements	45
5.5 Geometric Envelope for ATX Intel® Reference Thermal Mechanical Design	45
5.6 ATX Reference Thermal Mechanical Solution for the Intel® Pentium® 4 Processor in the 775–Land LGA Package	46
5.7 Reference Attach Mechanism	48
5.7.1 Structural Design Strategy	48
5.7.2 Mechanical Interface to the Reference Attach Mechanism	49
6 Acoustic Fan Speed Control	53
6.1 Acoustic Fan Speed Control	53
6.2 Thermal Solution Design	53
6.2.1 Compliance to Thermal Profile	53
6.2.2 Determine Thermistor Set Points	53
6.2.3 Minimum Fan Speed Set Point	54
6.3 Board and System Implementation	55
6.3.1 Choosing Fan Speed Control Settings	55
6.3.1.1 Temperature to begin Fan Acceleration	56
6.3.1.2 Minimum PWM Duty Cycle	58
6.4 Combining Thermistor and Thermal Diode Control	59

Match case Limit results 1 per page

Case Temperature Reference Metrology

Thermal/Mechanical Design Guide

Place the processor under the microscope unit (similar to the one used in Figure 36) to

continue with the process. It is also recommended to use a fixture (like a processor tray or a

plate) to help hold the unit in place for the rest of the attach process.

Press the wire down about 6 mm [0.125”] from the thermocouple bead using the tweezers.

Look in the microscope to perform this task. Place a piece of Kapton tape to hold the wire

inside the groove (Figure 33). Refer to Figure 34 for detailed bead placement.

Figure 33. Position Bead on the Groove Step

Figure 34. Detailed Thermocouple Bead Placement

10.

Using the micromanipulator, install the needle near to the end of the groove on top of the

thermocouple. Using the X, Y, and Z axes on the arm place the tip of the needle on top of the

thermocouple bead. Press down until the bead is seated at the end of the groove on top of the

step (see Figure 34 and Figure 35).

Wire section

into the

groove to

prepare for

final bead

placement

Kapton* tape