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Recommended Test Sequence, 2.1.2.2, Post-Test Pass Criteria

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Intel® Thermal/Mechanical Reference Design Information R Figure 9. Shock Acceleration Curve 60 A c c 50 e l 40 e r 30 a t 20 i o n 10 (g) 0 0 2 4 6 8 10 12 Time (m illiseconds) 5.2.1.2.1 5.2.1.2.2 Recommended Test Sequence Each test sequence should start with components (i.e., motherboard, heatsink assembly, etc.) that have not been previously submitted to any reliability testing. The test sequence should always start with a visual inspection after assembly, and BIOS/Processor/Memory test (refer to Section 5.2.3). Prior to the mechanical shock and vibration stress test, the units under test should be preconditioned for 72 hours at 45 ºC. The purpose is to account for load relaxation during burn-in stage. The stress test should be followed by a visual inspection and then BIOS/Processor/Memory test. Post-Test Pass Criteria The post-test pass criteria are: 1. No significant physical damage to the heatsink attach mechanism (including such items as clip and motherboard fasteners). 2. Heatsink must remain attached to the motherboard. 3. Heatsink remains seated and its bottom remains mated flatly against IHS surface. No visible gap between the heatsink base and processor IHS. No visible tilt of the heatsink with respect to its attach mechanism. 4. No signs of physical damage on motherboard surface due to impact of heatsink or heatsink attach mechanism. 5. No visible physical damage to the processor package. 6. Successful BIOS/Processor/memory post-test of samples. 7. Thermal compliance testing to demonstrate that the case temperature specification can be met. Thermal/Mechanical Design Guide 43

Section	Page
Contents	3
Figures	6
Tables	7
Revision History	8
1 Introduction	9
1.1 Document Goals and Scope	9
1.1.1 Importance of Thermal Management	9
1.1.2 Document Goals	9
1.1.3 Document Scope	10
1.2 References	11
1.3 Definition of Terms	12
2 Processor Thermal/Mechanical Information	15
2.1 Mechanical Requirements	15
2.1.1 Processor Package	15
2.1.2 Heatsink Attach	17
2.1.2.1 General Guidelines	17
2.1.2.2 Heatsink Clip Load Requirement	17
2.1.2.3 Additional Guidelines	18
2.2 Thermal Requirements	18
2.2.1 Processor Case Temperature	18
2.2.2 Thermal Profile	19
2.2.3 TCONTROL	20
2.3 Heatsink Design Considerations	21
2.3.1 Heatsink Size	22
2.3.2 Heatsink Mass	22
2.3.3 Package IHS Flatness	22
2.3.4 Thermal Interface Material	23
2.4 System Thermal Solution Considerations	23
2.4.1 Chassis Thermal Design Capabilities	23
2.4.2 Improving Chassis Thermal Performance	23
2.4.3 Summary	24
2.5 System Integration Considerations	24
3 Thermal Metrology	25
3.1 Characterizing Cooling Performance Requirements	25
3.1.1 Example	26
3.2 Processor Thermal Solution Performance Assessment	27
3.3 Local Ambient Temperature Measurement Guidelines	27
3.4 Processor Case Temperature Measurement Guidelines	30
4 Thermal Management Logic and Thermal Monitor Feature	31
4.1 Processor Power Dissipation	31
4.2 Thermal Monitor Implementation	31
4.2.1 PROCHOT# Signal	32
4.2.2 Thermal Control Circuit	32
4.2.3 Operation and Configuration	33
4.2.4 On-Demand Mode	34
4.2.5 System Considerations	34
4.2.6 Operating System and Application Software Considerations	35
4.2.7 On-Die Thermal Diode	35
4.2.7.1 Reading the On-Die Thermal Diode Interface	35
4.2.7.2 Correction Factors for the On-Die Thermal Diode	36
4.2.8 THERMTRIP# Signal	37
4.2.8.1 Cooling System Failure Warning	37
5 Intel® Thermal/Mechanical Reference Design Information	39
5.1 Intel Validation Criteria for the Reference Design	39
5.1.1 Heatsink Performance Target	39
5.1.2 Acoustics	40
5.1.3 Altitude	40
5.1.4 Reference Heatsink Thermal Validation	41
5.1.5 Fan Performance for Active Heatsink Thermal Solution	41
5.2 Environmental Reliability Testing	42
5.2.1 Structural Reliability Testing	42
5.2.1.1 Random Vibration Test Procedure	42
5.2.1.2 Shock Test Procedure	42
5.2.2 Power Cycling	44
5.2.3 Recommended BIOS/Processor/Memory Test Procedures	44
5.3 Material and Recycling Requirements	44
5.4 Safety Requirements	45
5.5 Geometric Envelope for ATX Intel® Reference Thermal Mechanical Design	45
5.6 ATX Reference Thermal Mechanical Solution for the Intel® Pentium® 4 Processor in the 775–Land LGA Package	46
5.7 Reference Attach Mechanism	48
5.7.1 Structural Design Strategy	48
5.7.2 Mechanical Interface to the Reference Attach Mechanism	49
6 Acoustic Fan Speed Control	53
6.1 Acoustic Fan Speed Control	53
6.2 Thermal Solution Design	53
6.2.1 Compliance to Thermal Profile	53
6.2.2 Determine Thermistor Set Points	53
6.2.3 Minimum Fan Speed Set Point	54
6.3 Board and System Implementation	55
6.3.1 Choosing Fan Speed Control Settings	55
6.3.1.1 Temperature to begin Fan Acceleration	56
6.3.1.2 Minimum PWM Duty Cycle	58
6.4 Combining Thermistor and Thermal Diode Control	59

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Intel® Thermal/Mechanical Reference Design Information

Thermal/Mechanical Design Guide

Figure 9. Shock Acceleration Curve

Time (milliseconds)

(g)

5.2.1.2.1

Recommended Test Sequence

Each test sequence should start with components (i.e., motherboard, heatsink assembly, etc.) that

have not been previously submitted to any reliability testing.

The test sequence should always start with a visual inspection after assembly, and

BIOS/Processor/Memory test (refer to Section 5.2.3).

Prior to the mechanical shock and vibration stress test, the units under test should be

preconditioned for 72 hours at 45 ºC. The purpose is to account for load relaxation during burn-in

stage.

The stress test should be followed by a visual inspection and then BIOS/Processor/Memory test.

5.2.1.2.2

Post-Test Pass Criteria

The post-test pass criteria are:

No significant physical damage to the heatsink attach mechanism (including such items as

clip and motherboard fasteners).

Heatsink must remain attached to the motherboard.

Heatsink remains seated and its bottom remains mated flatly against IHS surface. No visible

gap between the heatsink base and processor IHS. No visible tilt of the heatsink with respect

to its attach mechanism.

No signs of physical damage on motherboard surface due to impact of heatsink or heatsink

attach mechanism.

No visible physical damage to the processor package.

Successful BIOS/Processor/memory post-test of samples.

Thermal compliance testing to demonstrate that the case temperature specification can be

met.