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Intel 640 User Guide - Page 79

IHS Reference Groove on the 775-Land LGA Package, IHS Groove Orientation

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Case Temperature Reference Metrology R The orientation of the groove relative to the package pin 1 indicator (gold triangle in one corner of the package) is shown in Figure 28 for the 775-land LGA package IHS. Figure 28. IHS Reference Groove on the 775-Land LGA Package IHS Groove Pin1 indicator When the processor is installed in the LGA775 socket, the groove is perpendicular to the socket load lever, and on the opposite side of the lever, as shown in Figure 29. Figure 29. IHS Groove Orientation Relative to the LGA775 Socket Select a machine shop that is capable of complying with drawing specified tolerances. IHS channel geometry is critical for repeatable placement of the thermocouple bead, ensuring precise thermal measurements. The specified dimensions minimize the impact of the groove on the IHS under the socket load. A larger groove may cause the IHS to warp under the socket load such that it does not represent the performance of an ungrooved IHS on production packages. Inspect parts for compliance to specifications before accepting from machine shop. Thermal/Mechanical Design Guide 79

Section	Page
Contents	3
Figures	6
Tables	7
Revision History	8
1 Introduction	9
1.1 Document Goals and Scope	9
1.1.1 Importance of Thermal Management	9
1.1.2 Document Goals	9
1.1.3 Document Scope	10
1.2 References	11
1.3 Definition of Terms	12
2 Processor Thermal/Mechanical Information	15
2.1 Mechanical Requirements	15
2.1.1 Processor Package	15
2.1.2 Heatsink Attach	17
2.1.2.1 General Guidelines	17
2.1.2.2 Heatsink Clip Load Requirement	17
2.1.2.3 Additional Guidelines	18
2.2 Thermal Requirements	18
2.2.1 Processor Case Temperature	18
2.2.2 Thermal Profile	19
2.2.3 TCONTROL	20
2.3 Heatsink Design Considerations	21
2.3.1 Heatsink Size	22
2.3.2 Heatsink Mass	22
2.3.3 Package IHS Flatness	22
2.3.4 Thermal Interface Material	23
2.4 System Thermal Solution Considerations	23
2.4.1 Chassis Thermal Design Capabilities	23
2.4.2 Improving Chassis Thermal Performance	23
2.4.3 Summary	24
2.5 System Integration Considerations	24
3 Thermal Metrology	25
3.1 Characterizing Cooling Performance Requirements	25
3.1.1 Example	26
3.2 Processor Thermal Solution Performance Assessment	27
3.3 Local Ambient Temperature Measurement Guidelines	27
3.4 Processor Case Temperature Measurement Guidelines	30
4 Thermal Management Logic and Thermal Monitor Feature	31
4.1 Processor Power Dissipation	31
4.2 Thermal Monitor Implementation	31
4.2.1 PROCHOT# Signal	32
4.2.2 Thermal Control Circuit	32
4.2.3 Operation and Configuration	33
4.2.4 On-Demand Mode	34
4.2.5 System Considerations	34
4.2.6 Operating System and Application Software Considerations	35
4.2.7 On-Die Thermal Diode	35
4.2.7.1 Reading the On-Die Thermal Diode Interface	35
4.2.7.2 Correction Factors for the On-Die Thermal Diode	36
4.2.8 THERMTRIP# Signal	37
4.2.8.1 Cooling System Failure Warning	37
5 Intel® Thermal/Mechanical Reference Design Information	39
5.1 Intel Validation Criteria for the Reference Design	39
5.1.1 Heatsink Performance Target	39
5.1.2 Acoustics	40
5.1.3 Altitude	40
5.1.4 Reference Heatsink Thermal Validation	41
5.1.5 Fan Performance for Active Heatsink Thermal Solution	41
5.2 Environmental Reliability Testing	42
5.2.1 Structural Reliability Testing	42
5.2.1.1 Random Vibration Test Procedure	42
5.2.1.2 Shock Test Procedure	42
5.2.2 Power Cycling	44
5.2.3 Recommended BIOS/Processor/Memory Test Procedures	44
5.3 Material and Recycling Requirements	44
5.4 Safety Requirements	45
5.5 Geometric Envelope for ATX Intel® Reference Thermal Mechanical Design	45
5.6 ATX Reference Thermal Mechanical Solution for the Intel® Pentium® 4 Processor in the 775–Land LGA Package	46
5.7 Reference Attach Mechanism	48
5.7.1 Structural Design Strategy	48
5.7.2 Mechanical Interface to the Reference Attach Mechanism	49
6 Acoustic Fan Speed Control	53
6.1 Acoustic Fan Speed Control	53
6.2 Thermal Solution Design	53
6.2.1 Compliance to Thermal Profile	53
6.2.2 Determine Thermistor Set Points	53
6.2.3 Minimum Fan Speed Set Point	54
6.3 Board and System Implementation	55
6.3.1 Choosing Fan Speed Control Settings	55
6.3.1.1 Temperature to begin Fan Acceleration	56
6.3.1.2 Minimum PWM Duty Cycle	58
6.4 Combining Thermistor and Thermal Diode Control	59

Match case Limit results 1 per page

Case Temperature Reference Metrology

Thermal/Mechanical Design Guide

The orientation of the groove relative to the package pin 1 indicator (gold triangle in one corner

of the package) is shown in Figure 28 for the 775-land LGA package IHS.

Figure 28. IHS Reference Groove on the 775-Land LGA Package

When the processor is installed in the LGA775 socket, the groove is perpendicular to the socket

load lever, and on the opposite side of the lever, as shown in Figure 29.

Figure 29. IHS Groove Orientation Relative to the LGA775 Socket

Select a machine shop that is capable of complying with drawing specified tolerances. IHS

channel geometry is critical for repeatable placement of the thermocouple bead, ensuring precise

thermal measurements. The specified dimensions minimize the impact of the groove on the IHS

under the socket load. A larger groove may cause the IHS to warp under the socket load such that

it does not represent the performance of an ungrooved IHS on production packages.

Inspect parts for compliance to specifications before accepting from machine shop.

Pin1 indicator

IHS Groove