Intel 640 User Guide - Page 66
Heatsink Selection Guidelines
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LGA775 Socket Heatsink Loading R A.3 Heatsink Selection Guidelines Evaluate carefully heatsinks that use motherboard stiffening devices (like backing plates), and conduct board deflection assessments based on the board deflection metric. Solutions derived from the reference design comply with the reference heatsink preload, for example: • The Intel Boxed Pentium 4 Processor in the 775-land LGA package. • The Intel RCBFH-3 Reference Design available from licensed suppliers (refer to Appendix H for contact information). Intel is also collaborating with vendors participating in its third party test house program to evaluate third party solutions. Vendor information will be available and updated regularly after product launch at http://developer.intel.com. After selecting the processor, go to the processor technical information page, and then select "Support component". § 66 Thermal/Mechanical Design Guide