IBM 8840 Hardware Maintenance Manual - Page 69

Field, replaceable, units

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Chapter 5. Field replaceable units Thermal grease 59 Fan bracket 60 Power cage assembly 61 Hard disk drive backplane 62 Media cage 63 Removing a microprocessor 64 System board 66 System-board option connectors 66 System-board internal cable connectors 67 System-board external connectors 67 System-board switches and jumpers 68 System-board LEDs 69 Removing the system board and shuttle 70 The following information describes procedures for removing and installing certain FRU inside the server. Only a qualified service technician is authorized to access the FRU described in this section. Important: The field-replaceable unit (FRU) procedures are intended for trained servicers who are familiar with IBM xSeries products. See the parts listing in "System" on page 108 to determine if the FRU being replaced is a customer-replaceable unit (CRU) or a FRU. Thermal grease This section contains information about removing and replacing the thermal grease between the heat sink and the microprocessor. Important: If you are installing the heat sink on the same processor that it was removed from, be sure that: v The thermal grease on the heat sink and microprocessor is not contaminated. v Addition thermal grease is not added to the existing thermal grease on the heat sink and microprocessor. Note: v Read "Installation guidelines" on page 23. v Read the safety notices at Appendix B, "Safety information," on page 117. v Read "Handling static-sensitive devices" on page 25. Complete the following steps to replace damaged or contaminated thermal grease on the microprocessor and heat sink: 1. Place the heat sink on a clean work surface. 2. Remove the cleaning pad from its package and unfold it completely. 3. Use the cleaning pad to wipe the thermal grease from the bottom of the heat sink. Note: Be sure that all of the thermal grease is removed. 4. Use a clean area of the cleaning pad to wipe the thermal grease from the microprocessor; then, dispose of the cleaning pad after all of the thermal grease is removed. © Copyright IBM Corp. 2005 59

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Chapter
5.
Field
replaceable
units
Thermal
grease
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. 59
Fan
bracket
.
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. 60
Power
cage
assembly
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.
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. 61
Hard
disk
drive
backplane
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. 62
Media
cage
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. 63
Removing
a
microprocessor
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. 64
System
board
.
.
.
.
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.
. 66
System-board
option
connectors
.
.
.
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.
. 66
System-board
internal
cable
connectors
.
.
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. 67
System-board
external
connectors
.
.
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.
. 67
System-board
switches
and
jumpers
.
.
.
.
.
.
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.
.
. 68
System-board
LEDs
.
.
.
.
.
.
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.
.
. 69
Removing
the
system
board
and
shuttle
.
.
.
.
.
.
.
.
.
.
.
.
.
. 70
The
following
information
describes
procedures
for
removing
and
installing
certain
FRU
inside
the
server.
Only
a
qualified
service
technician
is
authorized
to
access
the
FRU
described
in
this
section.
Important:
The
field-replaceable
unit
(FRU)
procedures
are
intended
for
trained
servicers
who
are
familiar
with
IBM
xSeries
products.
See
the
parts
listing
in
“System”
on
page
108
to
determine
if
the
FRU
being
replaced
is
a
customer-replaceable
unit
(CRU)
or
a
FRU.
Thermal
grease
This
section
contains
information
about
removing
and
replacing
the
thermal
grease
between
the
heat
sink
and
the
microprocessor.
Important:
If
you
are
installing
the
heat
sink
on
the
same
processor
that
it
was
removed
from,
be
sure
that:
v
The
thermal
grease
on
the
heat
sink
and
microprocessor
is
not
contaminated.
v
Addition
thermal
grease
is
not
added
to
the
existing
thermal
grease
on
the
heat
sink
and
microprocessor.
Note:
v
Read
“Installation
guidelines”
on
page
23.
v
Read
the
safety
notices
at
Appendix
B,
“Safety
information,”
on
page
117.
v
Read
“Handling
static-sensitive
devices”
on
page
25.
Complete
the
following
steps
to
replace
damaged
or
contaminated
thermal
grease
on
the
microprocessor
and
heat
sink:
1.
Place
the
heat
sink
on
a
clean
work
surface.
2.
Remove
the
cleaning
pad
from
its
package
and
unfold
it
completely.
3.
Use
the
cleaning
pad
to
wipe
the
thermal
grease
from
the
bottom
of
the
heat
sink.
Note:
Be
sure
that
all
of
the
thermal
grease
is
removed.
4.
Use
a
clean
area
of
the
cleaning
pad
to
wipe
the
thermal
grease
from
the
microprocessor;
then,
dispose
of
the
cleaning
pad
after
all
of
the
thermal
grease
is
removed.
©
Copyright
IBM
Corp.
2005
59