IBM 887022X Maintenance Manual - Page 90

Handling, static-sensitive, devices, System, reliability, considerations

Page 90 highlights

Handling static-sensitive devices Attention: Static electricity can damage electronic devices and the server. To avoid damage, keep static-sensitive devices in their static-protective packages until you are ready to install them. To reduce the possibility of damage from electrostatic discharge, observe the following precautions: v Limit your movement. Movement can cause static electricity to build up around you. v Handle the device carefully, holding it by its edges or its frame. v Do not touch solder joints, pins, or exposed printed circuitry. v Do not leave the device where others can handle and damage it. v While the device is still in its static-protective package, touch it to an unpainted metal part of the server for at least 2 seconds. This drains static electricity from the package and from your body. v Remove the device from its package and install it directly into the server without setting it down. If it is necessary to set down the device, put it back into its static-protective package. Do not place the device on the server cover or on a metal surface. v Take additional care when handling devices during cold weather. Heating reduces indoor humidity and increases static electricity. System reliability considerations To help ensure proper cooling and system reliability, make sure that: v Each of the drive bays has a drive or a filler panel and electromagnetic compatibility (EMC) shield installed in it. v If the server has only one symmetrical multiprocessing (SMP) Expansion Module installed ensure that the SMP baffle is installed during normal operation. v There is adequate space around the server to allow the server cooling system to work properly. Leave approximately 50 mm (2.0 in.) of open space around the front and rear of the server. Do not place objects in front of the fans. v Do not leave open spaces above or below an installed server in a rack cabinet. To prevent damage to server components, always install a blank filler panel to cover the open space and to ensure proper air circulation. v You have followed the cabling instructions that come with optional adapters. v You have replaced a failed fan within 48 hours. v You have replaced a hot-swap drive within 2 minutes of removal. v Microprocessor socket 4 always contains either a microprocessor baffle or a microprocessor and heat sink. 80 xSeries 445 Type 8870: Hardware Maintenance Manual and Troubleshooting Guide

  • 1
  • 2
  • 3
  • 4
  • 5
  • 6
  • 7
  • 8
  • 9
  • 10
  • 11
  • 12
  • 13
  • 14
  • 15
  • 16
  • 17
  • 18
  • 19
  • 20
  • 21
  • 22
  • 23
  • 24
  • 25
  • 26
  • 27
  • 28
  • 29
  • 30
  • 31
  • 32
  • 33
  • 34
  • 35
  • 36
  • 37
  • 38
  • 39
  • 40
  • 41
  • 42
  • 43
  • 44
  • 45
  • 46
  • 47
  • 48
  • 49
  • 50
  • 51
  • 52
  • 53
  • 54
  • 55
  • 56
  • 57
  • 58
  • 59
  • 60
  • 61
  • 62
  • 63
  • 64
  • 65
  • 66
  • 67
  • 68
  • 69
  • 70
  • 71
  • 72
  • 73
  • 74
  • 75
  • 76
  • 77
  • 78
  • 79
  • 80
  • 81
  • 82
  • 83
  • 84
  • 85
  • 86
  • 87
  • 88
  • 89
  • 90
  • 91
  • 92
  • 93
  • 94
  • 95
  • 96
  • 97
  • 98
  • 99
  • 100
  • 101
  • 102
  • 103
  • 104
  • 105
  • 106
  • 107
  • 108
  • 109
  • 110
  • 111
  • 112
  • 113
  • 114
  • 115
  • 116
  • 117
  • 118
  • 119
  • 120
  • 121
  • 122
  • 123
  • 124
  • 125
  • 126
  • 127
  • 128
  • 129
  • 130
  • 131
  • 132
  • 133
  • 134
  • 135
  • 136
  • 137
  • 138
  • 139
  • 140
  • 141
  • 142
  • 143
  • 144
  • 145
  • 146
  • 147
  • 148
  • 149
  • 150
  • 151
  • 152
  • 153
  • 154
  • 155
  • 156
  • 157
  • 158
  • 159
  • 160
  • 161
  • 162
  • 163
  • 164
  • 165
  • 166
  • 167
  • 168
  • 169
  • 170
  • 171
  • 172
  • 173
  • 174
  • 175
  • 176
  • 177
  • 178
  • 179
  • 180
  • 181
  • 182
  • 183
  • 184
  • 185
  • 186
  • 187
  • 188
  • 189
  • 190
  • 191
  • 192
  • 193
  • 194
  • 195
  • 196
  • 197
  • 198
  • 199
  • 200
  • 201
  • 202
  • 203
  • 204
  • 205
  • 206
  • 207
  • 208
  • 209
  • 210
  • 211
  • 212
  • 213
  • 214
  • 215
  • 216
  • 217
  • 218
  • 219
  • 220
  • 221
  • 222
  • 223
  • 224
  • 225
  • 226
  • 227
  • 228
  • 229
  • 230
  • 231
  • 232
  • 233
  • 234
  • 235
  • 236
  • 237
  • 238
  • 239
  • 240
  • 241
  • 242
  • 243
  • 244
  • 245
  • 246
  • 247
  • 248
  • 249
  • 250
  • 251
  • 252
  • 253
  • 254
  • 255
  • 256
  • 257
  • 258
  • 259
  • 260
  • 261
  • 262
  • 263
  • 264
  • 265
  • 266
  • 267
  • 268
  • 269
  • 270
  • 271
  • 272
  • 273
  • 274
  • 275
  • 276
  • 277
  • 278
  • 279
  • 280
  • 281
  • 282
  • 283
  • 284
  • 285
  • 286
  • 287
  • 288
  • 289
  • 290
  • 291
  • 292
  • 293
  • 294
  • 295
  • 296
  • 297
  • 298
  • 299
  • 300
  • 301
  • 302
  • 303
  • 304
  • 305
  • 306
  • 307
  • 308
  • 309
  • 310
  • 311
  • 312
  • 313
  • 314
  • 315
  • 316
  • 317
  • 318
  • 319
  • 320
  • 321
  • 322
  • 323
  • 324

Handling
static-sensitive
devices
Attention:
Static
electricity
can
damage
electronic
devices
and
the
server.
To
avoid
damage,
keep
static-sensitive
devices
in
their
static-protective
packages
until
you
are
ready
to
install
them.
To
reduce
the
possibility
of
damage
from
electrostatic
discharge,
observe
the
following
precautions:
v
Limit
your
movement.
Movement
can
cause
static
electricity
to
build
up
around
you.
v
Handle
the
device
carefully,
holding
it
by
its
edges
or
its
frame.
v
Do
not
touch
solder
joints,
pins,
or
exposed
printed
circuitry.
v
Do
not
leave
the
device
where
others
can
handle
and
damage
it.
v
While
the
device
is
still
in
its
static-protective
package,
touch
it
to
an
unpainted
metal
part
of
the
server
for
at
least
2
seconds.
This
drains
static
electricity
from
the
package
and
from
your
body.
v
Remove
the
device
from
its
package
and
install
it
directly
into
the
server
without
setting
it
down.
If
it
is
necessary
to
set
down
the
device,
put
it
back
into
its
static-protective
package.
Do
not
place
the
device
on
the
server
cover
or
on
a
metal
surface.
v
Take
additional
care
when
handling
devices
during
cold
weather.
Heating
reduces
indoor
humidity
and
increases
static
electricity.
System
reliability
considerations
To
help
ensure
proper
cooling
and
system
reliability,
make
sure
that:
v
Each
of
the
drive
bays
has
a
drive
or
a
filler
panel
and
electromagnetic
compatibility
(EMC)
shield
installed
in
it.
v
If
the
server
has
only
one
symmetrical
multiprocessing
(SMP)
Expansion
Module
installed
ensure
that
the
SMP
baffle
is
installed
during
normal
operation.
v
There
is
adequate
space
around
the
server
to
allow
the
server
cooling
system
to
work
properly.
Leave
approximately
50
mm
(2.0
in.)
of
open
space
around
the
front
and
rear
of
the
server.
Do
not
place
objects
in
front
of
the
fans.
v
Do
not
leave
open
spaces
above
or
below
an
installed
server
in
a
rack
cabinet.
To
prevent
damage
to
server
components,
always
install
a
blank
filler
panel
to
cover
the
open
space
and
to
ensure
proper
air
circulation.
v
You
have
followed
the
cabling
instructions
that
come
with
optional
adapters.
v
You
have
replaced
a
failed
fan
within
48
hours.
v
You
have
replaced
a
hot-swap
drive
within
2
minutes
of
removal.
v
Microprocessor
socket
4
always
contains
either
a
microprocessor
baffle
or
a
microprocessor
and
heat
sink.
80
xSeries
445
Type
8870:
Hardware
Maintenance
Manual
and
Troubleshooting
Guide