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HP Dc7100 HP Compaq Business Desktop dc7100 Series Service Reference Guide, 3r - Page 142

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Removal and Replacement Procedures- Small Form Factor (SFF) Chassis 7.8 Memory Ä CAUTION: The memory module sockets have gold metal contacts. When upgrading the memory, it is important to use memory modules with gold metal contacts to prevent corrosion and/or oxidation resulting from having incompatible metals in contact with each other. Ä CAUTION: Static electricity can damage the electronic components of the computer or optional cards. Before beginning these procedures, ensure that you are discharged of static electricity by briefly touching a grounded metal object. Refer to Chapter 5, "Identifying the Chassis, Routine Care, and Disassembly Preparation," for more information. Ä CAUTION: When handling a memory module, be careful not to touch any of the contacts. Doing so may damage the module. 1. If you have locked the Smart Cover Lock, use Computer Setup to unlock the lock (Section 7.2, "Unlocking the Smart Cover Lock"). 2. Prepare the computer for disassembly (Section 7.1, "Preparation for Disassembly"). 3. Remove the computer cover (Section 7.5, "Computer Cover"). Å WARNING: To reduce risk of personal injury from hot surfaces, allow the internal system components to cool before touching. 4. Open both latches of the memory module socket 1, and insert the memory module into the socket 2. Refer to Appendix F for the correct sequence for installing memory modules to get optimal performance. ✎ A memory module can be installed in only one way. Match the notch on the module with the tab on the memory socket. 5. Push the module down into the socket, ensuring that the module is fully inserted and properly seated. Make sure the latches are in the closed position 3. 7-16 361288-003 Service Reference Guide, dc7100

Section	Page
1	9
1.1 Installing or Upgrading Device Drivers	9
1.2 Transferring Files and Settings	10
1.3 Backing Up and Restoring Files	10
1.3.1 Creating a Backup File-Windows XP Professional	10
1.3.2 Restoring from the Backup File-Windows XP Professional	10
1.4 Converting to NTFS	10
1.5 HP Software	10
2	13
2.1 Power-On Self-Test (POST)	13
2.2 Computer Setup Utilities	14
2.2.1 Using Computer Setup (F10) Utilities	15
2.2.2 Computer Setup Menu	16
2.3 Diagnostics for Windows	26
2.3.1 Detecting Diagnostics for Windows	27
2.3.2 Installing Diagnostics for Windows	27
2.3.3 Using Categories in Diagnostics for Windows	28
2.3.4 Running Diagnostic Tests in Diagnostics for Windows	29
2.4 Configuration Record	30
2.4.1 Installing Configuration Record	31
2.4.2 Running Configuration Record	31
3	33
3.1 Initial Configuration and Deployment	33
3.2 Remote System Installation	34
3.3 Software Updating and Management	34
3.3.1 HP Client Manager Software	34
3.3.2 Altiris Client Management Solutions	35
3.3.3 System Software Manager	35
3.3.4 Proactive Change Notification (PCN)	36
3.3.5 Subscriber’s Choice	36
3.3.6 ROM Flash	36
3.3.7 Remote ROM Flash	36
3.3.8 HPQFlash	37
3.3.9 FailSafe Boot Block ROM	37
3.3.10 Replicating the Setup	38
3.3.11 Dual-State Power Button	44
3.3.12 World Wide Web Site	44
3.3.13 Building Blocks and Partners	44
3.4 Asset Tracking and Security	45
3.4.1 Password Security	49
3.4.2 Establishing a Setup Password Using Computer Setup	49
3.4.3 Establishing a Power-On Password Using Computer Setup	49
3.4.4 DriveLock	52
3.4.5 Smart Cover Sensor	54
3.4.6 Master Boot Record Security	56
3.4.7 Before You Partition or Format the Current Bootable Disk	57
3.4.8 Cable Lock Provision	57
3.4.9 Fingerprint Identification Technology	57
3.5 Fault Notification and Recovery	58
3.5.1 Drive Protection System	58
3.5.2 Surge-Tolerant Power Supply	58
3.5.3 Thermal Sensor	58
4	59
4.1 SATA and PATA Device Information	59
4.2 ATA Cables	60
4.2.1 SATA Data Cable	60
4.2.2 SATA Power Cable	60
4.2.3 PATA Data Cable	61
4.2.4 PATA Power Cable	61
4.2.5 PATA Cable Layout	62
4.3 PATA Drive Installation Guidelines	63
4.3.1 PATA Device Classes	63
4.3.2 PATA Attach Sequence Rules by Class Priority	64
4.3.3 PATA Attach Sequence Worksheet	65
4.3.4 PATA Additional Drive Application Notes	67
4.4 ATA SMART Drives	68
4.5 Drive Capacities	68
4.6 SATA BIOS	69
4.6.1 Legacy Mode	69
4.6.2 Native Mode	69
4.7 Mixed Devices Boot and Drive Letter Ordering	70
5	71
5.1 Chassis Designations	71
5.1.1 Convertible Minitower (CMT)	71
5.1.2 Small Form Factor (SFF)	72
5.1.3 Ultra-Slim Desktop (USDT)	72
5.2 Electrostatic Discharge Information	73
5.2.1 Generating Static	73
5.2.2 Preventing Electrostatic Damage to Equipment	73
5.2.3 Personal Grounding Methods and Equipment	74
5.2.4 Grounding the Work Area	74
5.2.5 Recommended Materials and Equipment	74
5.3 Operating Guidelines	75
5.4 Routine Care	75
5.4.1 General Cleaning Safety Precautions	75
5.4.2 Cleaning the Computer Case	76
5.4.3 Cleaning the Keyboard	77
5.4.4 Cleaning the Monitor	77
5.4.5 Cleaning the Mouse	77
5.5 Service Considerations	78
5.5.1 Power Supply Fan	78
5.5.2 Tools and Software Requirements	78
5.5.3 Screws	78
5.5.4 Cables and Connectors	79
5.5.5 Hard Drives	79
5.5.6 Lithium Coin Cell Battery	79
6	81
6.1 Preparation for Disassembly	81
6.2 Unlocking the Smart Cover Lock	82
6.3 Hood Sensor	83
6.4 External Security Devices	84
6.4.1 Cable Lock	84
6.4.2 Padlock	85
6.5 Computer Access Panel	86
6.6 Front Bezel	87
6.7 Front Drive Bezels	88
6.7.1 5.25” Drive Bezel Blank	88
6.7.2 Diskette Drive Bezel or Bezel Blank	89
6.8 Cable Management	90
6.9 Memory	91
6.10 Expansion Cards	93
6.11 PCI Retainer Latch	97
6.12 Expansion Card Guide	99
6.13 Drives	100
6.13.1 Drive Positions	100
6.13.2 Hard Drive	101
6.13.3 Optical Drive	104
6.13.4 Diskette Drive	107
6.14 Front I/O Device	108
6.15 Power Switch Assembly	109
6.16 System Board	110
6.17 Battery	111
6.17.1 Type 1 Battery Holder	112
6.17.2 Type 2 Battery Holder	113
6.18 Heatsink	114
6.19 Processor	115
6.20 Speaker	117
6.21 Chassis Fan	118
6.22 Power Supply	119
6.23 Changing from Desktop to Minitower	120
6.24 Changing from Minitower to Desktop	123
Removal and Replacement Procedures- Small Form Factor (SFF) Chassis	127
7.1 Preparation for Disassembly	127
7.2 Unlocking the Smart Cover Lock	128
7.3 Hood Sensor	130
7.4 External Security Devices	131
7.4.1 Security Clip	131
7.4.2 Cable Lock	131
7.4.3 Padlock	132
7.4.4 Universal Chassis Clamp Lock	132
7.5 Computer Cover	137
7.6 Front Drive Bezels	138
7.7 Cable Management	140
7.8 Memory	142
7.9 Vertically Oriented Expansion Card	144
7.9.1 Expansion Card Retainer	144
7.9.2 PCI Expansion Card	145
7.9.3 PCI Express Expansion Card	147
7.10 Horizontally Oriented Expansion Card	148
7.10.1 Expansion Card Cage	148
7.10.2 PCI Expansion Card	148
7.10.3 Riser Card	151
7.11 Drives	152
7.11.1 Drive Positions	152
7.11.2 Optical Drive	153
7.11.3 External 3.5-inch Drive	155
7.11.4 Primary Hard Drive	156
7.12 Fan Shroud	160
7.13 Front I/O Devices	161
7.14 Power Switch Assembly	165
7.15 Heatsink	166
7.16 Processor	167
7.17 Speaker	169
7.18 Power Supply	170
7.19 System Board	172
7.20 Chassis Fan	176
7.21 Backwall	177
7.22 Battery	184
7.22.1 Type 1 Battery Holder	185
7.22.2 Type 2 Battery Holder	186
7.22.3 Type 3 Battery Holder	187
8	189
8.1 Preparation for Disassembly	189
8.2 External Security Devices	191
8.2.1 Installing a Cable Lock	191
8.2.2 Installing a Padlock	192
8.3 Computer Access Panel	193
8.4 MultiBay Device	194
8.5 MultiBay Riser Card	195
8.6 Front Panel Assembly	196
8.7 Front Bezel	197
8.8 Chassis Fan	198
8.9 Cable Management	199
8.10 Memory	200
8.11 Expansion Card Cage	202
8.12 Expansion Card	203
8.13 Hood Sensor	205
8.14 Expansion Card Retaining Latch	206
8.15 Hard Drive	207
8.16 Front I/O Device	209
8.17 Heatsink Assembly	210
8.17.1 Heatsink Fan with Shroud	211
8.18 Processor	212
8.19 Power Supply	214
8.20 Battery	215
8.20.1 Type 1 Battery Holder	216
8.20.2 Type 2 Battery Holder	217
8.20.3 Type 3 Battery	218
8.21 Speaker	219
8.22 System Board	220
A	221
B	231
C	233
D	243
E	277

Match case Limit results 1 per page

7–16

361288-003

Service Reference Guide, dc7100

Removal and Replacement Procedures— Small Form Factor (SFF) Chassis

7.8 Memory

CAUTION:

The memory module sockets have gold metal contacts. When upgrading the memory, it is

important to use memory modules with gold metal contacts to prevent corrosion and/or oxidation

resulting from having incompatible metals in contact with each other.

CAUTION:

Static electricity can damage the electronic components of the computer or optional cards.

Before beginning these procedures, ensure that you are discharged of static electricity by briefly touching

a grounded metal object. Refer to

Chapter 5, “Identifying the Chassis, Routine Care, and Disassembly

Preparation,”

for more information.

CAUTION:

When handling a memory module, be careful not to touch any of the contacts. Doing so

may damage the module.

1. If you have locked the Smart Cover Lock, use Computer Setup to unlock the lock (

Section

7.2, “Unlocking the Smart Cover Lock”

2. Prepare the computer for disassembly (

Section 7.1, “Preparation for Disassembly”

3. Remove the computer cover (

Section 7.5, “Computer Cover”

WARNING:

To reduce risk of personal injury from hot surfaces, allow the internal system components to

cool before touching.

4. Open both latches of the memory module socket

, and insert the memory module into the

socket

. Refer to Appendix F for the correct sequence for installing memory modules to get

optimal performance.

A memory module can be installed in only one way. Match the notch on the module with the tab

on the memory socket.

5. Push the module down into the socket, ensuring that the module is fully inserted and

properly seated. Make sure the latches are in the closed position