Intel BFCBASE Data Sheet - Page 102
Thermal Metrology, Table 6-8., Dual-Core Intel® Xeon® Processor 7200 Series Thermal Profile
UPC - 735858197373
View all Intel BFCBASE manuals
Add to My Manuals
Save this manual to your list of manuals |
Page 102 highlights
Thermal Specifications 3. Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the maximum power that the processor can dissipate. TDP is measured at maximum TCASE. 4. These specifications are based pre-silicon estimates and simulations. These specifications will be updated with characterized data from silicon measurements in a future release of this document. 5. Power specifications are defined at all VIDs found in Table 2-3. The Dual-Core Intel® Xeon® Processor 7200 Series may be shipped under multiple VIDs for each frequency. 6. FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor frequency requirements. Table 6-8. Dual-Core Intel® Xeon® Processor 7200 Series Thermal Profile Power (W) 0 10 20 30 40 50 60 70 80 TCASE_MAX (° C) 45.0 47.4 49.8 52.1 54.5 56.9 59.3 61.7 64.0 6.1.2 Thermal Metrology The minimum and maximum case temperatures (TCASE) are specified in Table 6-2, through Table 6-8, and are measured at the geometric top center of the processor integrated heat spreader (IHS). Figure 6-5 illustrates the location where TCASE temperature measurements should be made. For detailed guidelines on temperature measurement methodology, refer to the Dual-Core Intel® Xeon® Processor 7200 Series and Quad-Core Intel® Xeon® Processor 7300 Series Thermal / Mechanical Design Guide. 102 Document Number: 318080-002