Intel BFCBASE Data Sheet - Page 67

Mechanical Specifications 3.4 Package Handling Guidelines Table 3-2 includes a list of guidelines on package handling in terms of recommended maximum loading on the processor IHS relative to a fixed substrate. These package handling loads may be experienced during heatsink removal. Table 3-2. Package Handling Guidelines Parameter Maximum Recommended Notes Shear Tensile Torque 356 N [80 lbf] 1, 2 156 N [35 lbf] 3, 2 8 N-m [70 lbf-in] 4, 2 Notes: 1. A shear load is defined as a load applied to the IHS in a direction parallel to the IHS top surface. 2. These guidelines are based on limited testing for design characterization. 3. A tensile load is defined as a pulling load applied to the IHS in the direction normal to the IHS surface. 4. A torque load is defined as a twisting load applied to the IHS in an axis of rotation normal to the IHS top surface. 3.5 Package Insertion Specifications The Intel® Xeon® Processor 7200 Series and 7300 Series can be inserted into and removed from a mPGA604 socket 15 times. The socket should meet the mPGA604 requirements detailed in the mPGA604 Socket Design Guidelines. 3.6 Processor Mass Specifications The typical mass of the Intel® Xeon® Processor 7200 Series and 7300 Series is 37.6 g (1.5oz). This mass [weight] includes all the components that are included in the package. 3.7 Processor Materials Table 3-3 lists some of the package components and associated materials. Table 3-3. Processor Materials Component Integrated Heat Spreader (IHS) Substrate Substrate Pins Material Nickel Plated Copper Fiber-Reinforced Resin Gold Plated Copper Document Number: 318080-002 67