Intel BFCBASE Data Sheet - Page 57

Mechanical Specifications, 3.1 Package Mechanical Drawing

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Mechanical Specifications 3 Mechanical Specifications The Intel® Xeon® Processor 7200 Series and 7300 Series is packaged in a FC-mPGA6 package that interfaces with the motherboard via a mPGA604 socket. The package consists of two processor dies mounted on a substrate pin-carrier. An IHS is attached to the package substrate and die and serves as the mating surface for processor component thermal solutions, such as a heatsink. Figure 3-1 shows a sketch of the processor package components and how they are assembled together. Refer to the mPGA604 Socket Design Guidelines for complete details on the mPGA604 socket. The package components shown in Figure 3-1 include the following: 1. IHS 2. Processor die 3. FC-mPGA6 package 4. Pin-side capacitors 5. Package pin Figure 3-1. Processor Package Assembly Sketch Note: 3.1 Figure 3-1 is not to scale and is for reference only. The mPGA604 socket is not shown. Package Mechanical Drawing The package mechanical drawings are shown in Figure 3-2 and Figure 3-3. The drawings include dimensions necessary to design a thermal solution for the processor. These dimensions include: 1. Package reference with tolerances (total height, length, width, etc.) 2. IHS parallelism and tilt 3. Pin dimensions 4. Top-side and back-side component keepout dimensions 5. Reference datums All drawing dimension are in mm [in]. Document Number: 318080-002 57

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Document Number: 318080-002
57
Mechanical Specifications
3
Mechanical Specifications
The Intel
®
Xeon
®
Processor 7200 Series and 7300 Series is packaged in a FC-mPGA6
package that interfaces with the motherboard via a mPGA604 socket. The package
consists of two processor dies mounted on a substrate pin-carrier. An IHS is attached
to the package substrate and die and serves as the mating surface for processor
component thermal solutions, such as a heatsink.
Figure 3-1
shows a sketch of the
processor package components and how they are assembled together. Refer to the
mPGA604 Socket Design Guidelines
for complete details on the mPGA604 socket.
The package components shown in
Figure 3-1
include the following:
1. IHS
2.
Processor die
3.
FC-mPGA6 package
4.
Pin-side capacitors
5.
Package pin
Note:
Figure 3-1
is not to scale and is for reference only. The mPGA604 socket is not shown.
3.1
Package Mechanical Drawing
The package mechanical drawings are shown in
Figure 3-2
and
Figure 3-3
. The
drawings include dimensions necessary to design a thermal solution for the processor.
These dimensions include:
1.
Package reference with tolerances (total height, length, width, etc.)
2.
IHS parallelism and tilt
3.
Pin dimensions
4.
Top-side and back-side component keepout dimensions
5.
Reference datums
All drawing dimension are in mm [in].
Figure 3-1.
Processor Package Assembly Sketch