Intel BFCBASE Data Sheet - Page 97
Quad-Core Intel® Xeon® E7300 Processor Thermal Profile, Table 6-2., Quad-Core Intel® Xeon
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Thermal Specifications Figure 6-1.Quad-Core Intel® Xeon® E7300 Processor Thermal Profile Therm al Profile 70.0 60.0 Temperature (C) 50.0 40.0 Tcase= 0.263 x Pow er + 45 30.0 20.0 0 10 20 30 40 50 60 70 80 Pow er(W) Notes: 1. Please refer to Table 6-2 for discrete points that constitute the thermal profile. 2. Implementation of Thermal Profile should result in virtually no TCC activation. Furthermore, utilization of thermal solutions that do not meet processor Thermal Profile will result in increased probability of TCC activation and may incur measurable performance loss. (See Section 6.2 for details on TCC activation). 3. Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the maximum power that the processor can dissipate. TDP is measured at maximum TCASE. 4. These specifications are based pre-silicon estimates and simulations. These specifications will be updated with characterized data from silicon measurements in a future release of this document. 5. Power specifications are defined at all VIDs found in Table 2-3. The Quad-Core Intel® Xeon® E7300 Processor may be shipped under multiple VIDs for each frequency. 6. FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor frequency requirements. Table 6-2. Quad-Core Intel® Xeon® E7300 Processor Thermal Profile Table Power (W) 0 10 20 30 40 50 60 70 80 TCASE_MAX (° C) 45.0 47.6 50.3 52.9 55.5 58.2 60.8 63.4 66.0 Document Number: 318080-002 97