Intel BFCBASE Data Sheet - Page 6

6

Document Number: 318080-002

6-8

Conceptual Fan Control Diagram For a PECI-Based Platform

..................................

108

7-1

Stop Clock State Machine

..................................................................................

114

7-2

Logical Schematic of SMBus Circuitry

..................................................................

117

Tables

1-1

Quad-Core Intel® Xeon® Processor 7300 Series Processor Features

........................

10

1-2

Dual-Core Intel® Xeon® Processor 7200 Series Processor Features

.........................

10

2-1

Core Frequency to FSB Multiplier Configuration

......................................................

17

2-2

BSEL[2:0] Frequency Table

.................................................................................

17

2-3

Voltage Identification Definition

...........................................................................

19

2-4

FSB Signal Groups

.............................................................................................

21

2-5

AGTL+ Signal Description Table

...........................................................................

22

2-6

Non AGTL+ Signal Description Table

.....................................................................

22

2-7

Signal Reference Voltages

...................................................................................

22

2-8

Processor Absolute Maximum Ratings

...................................................................

23

2-9

Voltage and Current Specifications

.......................................................................

25

2-10

VCC Static and Transient Tolerance

......................................................................

30

2-11

AGTL+ Signal Group DC Specifications

..................................................................

34

2-12

CMOS Signal Input/Output Group DC Specifications

................................................

35

2-13

Open Drain Signal Group DC Specifications

...........................................................

35

2-14

SMBus Signal Group DC Specifications

..................................................................

35

2-15

PECI DC Electrical Limits

.....................................................................................

36

2-16

VCC Overshoot Specifications

..............................................................................

37

2-17

AGTL+ Bus Voltage Definitions

............................................................................

39

2-18

FSB Differential BCLK Specifications

.....................................................................

39

2-19

Front Side Bus Differential Clock AC Specifications

.................................................

40

2-20

Front Side Bus Common Clock AC Specifications

....................................................

40

2-21

FSB Source Synchronous AC Specifications

............................................................

41

2-22

Miscellaneous GTL+ AC Specifications

...................................................................

42

2-23

Front Side Bus AC Specifications (Reset Conditions)

...............................................

42

2-24

TAP Signal Group AC Specifications

......................................................................

42

2-25

VID Signal Group AC Specifications

......................................................................

44

2-26

SMBus Signal Group AC Specifications

..................................................................

44

3-1

Processor Loading Specifications

..........................................................................

66

3-2

Package Handling Guidelines

...............................................................................

67

3-3

Processor Materials

............................................................................................

67

4-1

Pin Listing by Pin Name

......................................................................................

71

4-2

Pin Listing by Pin Number

...................................................................................

79

5-1

Signal Definitions

...............................................................................................

87

6-1

Quad-Core Intel® Xeon® E7300 Processor Thermal Specifications

...........................

96

6-2

Quad-Core Intel® Xeon® E7300 Processor Thermal Profile Table

.............................

97

6-3

Quad-Core Intel® Xeon® X7350 Processor Thermal Specifications

...........................

98

6-4

Quad-Core Intel® Xeon® X7350 Processor Thermal Profile Table

.............................

99

6-5

Quad-Core Intel® Xeon® L7345 Processor Thermal Specifications

...........................

99

6-6

Quad-Core Intel® Xeon® L7345 Processor Thermal Profile

....................................

100

6-7

Dual-Core Intel® Xeon® Processor 7200 Series Thermal Specifications

..................

101

6-8

Dual-Core Intel® Xeon® Processor 7200 Series Thermal Profile

.............................

102

6-9

BREQ# signal assertion during power on

.............................................................

109

6-10

PECI Address assigned to processor

...................................................................

109

6-11

GetTemp0() and GetTemp1() Error Codes

...........................................................

110

7-1

Power-On Configuration Option pins

...................................................................

111

Section	Page
1 Introduction	9
1.1 Terminology	11
1.2 State of Data	13
1.3 References	13
2 Electrical Specifications	15
2.1 Front Side Bus and GTLREF	15
2.2 Decoupling Guidelines	15
2.2.1 VCC Decoupling	16
2.2.2 VTT Decoupling	16
2.2.3 Front Side Bus AGTL+ Decoupling	16
2.3 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking	16
2.3.1 Front Side Bus Frequency Select Signals (BSEL[2:0])	17
2.3.2 PLL Power Supply	17
2.4 Voltage Identification (VID)	17
2.5 Reserved, Unused, or Test Signals	20
2.6 Front Side Bus Signal Groups	20
2.7 CMOS Asynchronous and Open Drain Asynchronous Signals	22
2.8 Test Access Port (TAP) Connection	22
2.9 Mixing Processors	23
2.10 Absolute Maximum and Minimum Ratings	23
2.11 Processor DC Specifications	24
2.11.1 Flexible Motherboard Guidelines (FMB)	25
2.11.2 Platform Environmental Control Interface (PECI) DC Specifications	35
2.11.3 VCC Overshoot Specification	37
2.11.4 AGTL+ FSB Specifications	38
2.12 Front Side Bus AC Specifications	40
2.13 Processor AC Timing Waveforms	45
3 Mechanical Specifications	57
3.1 Package Mechanical Drawing	57
3.2 Processor Component Keepout Zones	60
3.3 Package Loading Specifications	66
3.4 Package Handling Guidelines	67
3.5 Package Insertion Specifications	67
3.6 Processor Mass Specifications	67
3.7 Processor Materials	67
3.8 Processor Markings	68
3.9 Processor Pin-Out Coordinates	69
4 Pin Listing	71
4.1 Pin Assignments	71
4.1.1 Pin Listing by Pin Name	71
4.1.2 Pin Listing by Pin Number	79
5 Signal Definitions	87
5.1 Signal Definitions.	87
6 Thermal Specifications	95
6.1 Package Thermal Specifications	95
6.1.1 Thermal Specifications	95
6.1.2 Thermal Metrology	102
6.2 Processor Thermal Features	103
6.2.1 Thermal Monitor Features	103
6.2.2 Thermal Monitor	103
6.2.3 Thermal Monitor 2	104
6.2.4 On-Demand Mode	105
6.2.5 PROCHOT# Signal	106
6.2.6 FORCEPR# Signal	106
6.2.7 THERMTRIP# Signal	106
6.3 Platform Environment Control Interface (PECI)	107
6.3.1 Introduction	107
6.3.2 PECI Specifications	108
7 Features	111
7.1 Power-On Configuration Options	111
7.2 Clock Control and Low Power States	111
7.2.1 Normal State	112
7.2.2 HALT or Extended HALT State	112
7.2.3 Stop-Grant State	114
7.2.4 Extended HALT Snoop or HALT Snoop State, Stop Grant Snoop State	115
7.3 Enhanced Intel SpeedStep® Technology	115
7.4 System Management Bus (SMBus) Interface	116
7.4.1 SMBus Device Addressing	117
7.4.2 PIROM and Scratch EEPROM Supported SMBus Transactions	118
7.4.3 Processor Information ROM (PIROM)	119
7.4.4 Checksums	137
7.4.5 Scratch EEPROM	137
8 Boxed Processor Specifications	139
8.1 Introduction	139
8.2 Thermal Specifications	139
8.2.1 Boxed Processor Cooling Requirements	139
9 Debug Tools Specifications	141
9.1 Debug Port System Requirements	141
9.2 Logic Analyzer Interface (LAI)	141
9.2.1 Mechanical Considerations	141

Intel BFCBASE Data Sheet - Page 6

Tables, Quad-Core Intel® Xeon® X7350 Processor Thermal Profile Table

Page 6 highlights