Intel BFCBASE Data Sheet - Page 60
Processor Component Keepout Zones, to either the topside or pin-side of the package substrate. See
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3.2 Mechanical Specifications Processor Component Keepout Zones The processor may contain components on the substrate that define component keepout zone requirements. A thermal and mechanical solution design must not intrude into the required keepout zones. Decoupling capacitors are typically mounted to either the topside or pin-side of the package substrate. See Figure 3-4 and Figure 3-5 for keepout zones. 60 Document Number: 318080-002
Mechanical Specifications
60
Document Number: 318080-002
3.2
Processor Component Keepout Zones
The processor may contain components on the substrate that define component
keepout zone requirements. A thermal and mechanical solution design must not
intrude into the required keepout zones. Decoupling capacitors are typically mounted
to either the topside or pin-side of the package substrate. See
Figure 3-4
and
Figure 3-5
for keepout zones.