Intel BFCBASE Data Sheet - Page 95
Thermal Specifications
UPC - 735858197373
View all Intel BFCBASE manuals
Add to My Manuals
Save this manual to your list of manuals |
Page 95 highlights
Thermal Specifications 6 Thermal Specifications 6.1 6.1.1 Package Thermal Specifications The Intel® Xeon® Processor 7200 Series and 7300 Series requires a thermal solution to maintain temperatures within its operating limits. Any attempt to operate the processor outside these operating limits may result in permanent damage to the processor and potentially other components within the system. As processor technology changes, thermal management becomes increasingly crucial when building computer systems. Maintaining the proper thermal environment is key to reliable, long-term system operation. A complete solution includes both component and system level thermal management features. Component level thermal solutions can include active or passive heatsinks attached to the processor integrated heat spreader (IHS). Typical system level thermal solutions may consist of system fans combined with ducting and venting. This section provides data necessary for developing a complete thermal solution. For more information on designing a component level thermal solution, refer to the DualCore Intel® Xeon® Processor 7200 Series and Quad-Core Intel® Xeon® Processor 7300 Series Thermal / Mechanical Design Guide. Thermal Specifications To allow the optimal operation and long-term reliability of Intel processor-based systems, the processor must remain within the minimum and maximum case temperature (TCASE) specifications as defined by the applicable thermal profile (see Table 6-1 and Figure 6-1 for Quad-Core Intel® Xeon® Processor E7300 Series, Table 6-3 and Figure 6-2 for Quad-Core Intel® Xeon® X7350 Processor, Table 6-5 and Figure 6-3 for Quad-Core Intel® Xeon® L7345 Processor, Table 6-7 and Figure 6-4 for Dual-Core Intel® Xeon® Processor 7200 Series). Thermal solutions not designed to provide this level of thermal capability may affect the long-term reliability of the processor and system. For more details on thermal solution design, please refer to the Dual-Core Intel® Xeon® Processor 7200 Series and Quad-Core Intel® Xeon® Processor 7300 Series Thermal / Mechanical Design Guide. The Intel® Xeon® Processor 7200 Series and 7300 Series implement a methodology for managing processor temperatures which is intended to support acoustic noise reduction through fan speed control and to assure processor reliability. Selection of the appropriate fan speed is based on the relative temperature data reported by the processor's Platform Environment Control Interface (PECI) bus as described in Section 6.3. The temperature reported over PECI is always a negative value and represents a delta below the onset of thermal control circuit (TCC) activation, as indicated by PROCHOT# (see Section 6.2, Processor Thermal Features). Systems that implement fan speed control should be designed to use this data. Systems that do not alter the fan speed also need to guarantee the case temperature meets the thermal profile specifications. The Quad-Core Intel® Xeon® Processor E7300 Series (see Figure 6-1; Table 6-2), Quad-Core Intel® Xeon® L7345 Processor (see Figure 6-3; Table 6-6) and Dual-Core Intel® Xeon® Processor 7200 Series (see Figure 6-4; Table 6-8) supports a single Thermal Profile. The Thermal Profile is indicative of a constrained thermal environment (Ex: 1U form factor). Because of the reduced cooling capability represented by this solution, the probability of TCC activation and performance loss is increased. Document Number: 318080-002 95