Intel BFCBASE Data Sheet - Page 66

Package Loading Specifications, Table 3-1., Processor Loading Specifications

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Mechanical Specifications 3.3 Package Loading Specifications Table 3-1 provides dynamic and static load specifications for the processor package. These mechanical load limits should not be exceeded during heatsink assembly, shipping conditions, or standard use condition. Also, any mechanical system or component testing should not exceed the maximum limits. The processor package substrate should not be used as a mechanical reference or load-bearing surface for thermal and mechanical solutions. The minimum loading specification must be maintained by any thermal and mechanical solution. Table 3-1. Processor Loading Specifications Parameter Minimum Maximum Unit Notes Static Compressive Load Dynamic Compressive Load Transient 44 222 N 10 50 lbf 44 288 N 10 65 lbf 222 N + 0.45 kg * 100 G N 50 lbf (static) + 1 lbm * 100 G lbf 288 N + 0.45 kg * 100 G N 65 lbf (static) + 1 lbm * 100 G lbf 445 N 100 lbf 1, 2, 3, 4 1, 2, 3, 5 1, 3, 4, 6, 7 1, 3, 5, 6, 7 1, 3, 8 Notes: 1. These specifications apply to uniform compressive loading in a direction perpendicular to the IHS top surface. 2. This is the minimum and maximum static force that can be applied by the heatsink and retention solution to maintain the heatsink and processor interface. 3. These parameters are based on limited testing for design characterization. Loading limits are for the package only and do not include the limits of the processor socket. 4. This specification applies for thermal retention solutions that allow baseboard deflection. 5. This specification applies either for thermal retention solutions that prevent baseboard deflection or for the Intel enabled reference solution (CEK). 6. Dynamic loading is defined as an 11 ms duration average load superimposed on the static load requirement. 7. Experimentally validated test condition used a heatsink mass of 1 lbm (~0.45 kg) with 100 G acceleration measured at heatsink mass. The dynamic portion of this specification in the product application can have flexibility in specific values, but the ultimate product of mass times acceleration should not exceed this validated dynamic load (1 lbm x 100 G = 100 lb). 8. Transient loading is defined as a 2 second duration peak load superimposed on the static load requirement, representative of loads experienced by the package during heatsink installation. 66 Document Number: 318080-002

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Mechanical Specifications
66
Document Number: 318080-002
3.3
Package Loading Specifications
Table 3-1
provides dynamic and static load specifications for the processor package.
These mechanical load limits should not be exceeded during heatsink assembly,
shipping conditions, or standard use condition. Also, any mechanical system or
component testing should not exceed the maximum limits. The processor package
substrate should not be used as a mechanical reference or load-bearing surface for
thermal and mechanical solutions. The minimum loading specification must be
maintained by any thermal and mechanical solution.
Table 3-1.
Processor Loading Specifications
Parameter
Minimum
Maximum
Unit
Notes
Static Compressive
Load
44
10
222
50
N
lbf
1,
2,
3,
4
Notes:
1.
These specifications apply to uniform compressive loading in a direction perpendicular to the IHS top surface.
2.
This is the minimum and maximum static force that can be applied by the heatsink and retention solution to
maintain the heatsink and processor interface.
3.
These parameters are based on limited testing for design characterization. Loading limits are for the package
only and do not include the limits of the processor socket.
4.
This specification applies for thermal retention solutions that allow baseboard deflection.
44
10
288
65
N
lbf
1,
2,
3,
5
5.
This specification applies either for thermal retention solutions that prevent baseboard deflection or for the
Intel enabled reference solution (CEK).
Dynamic
Compressive Load
222 N + 0.45 kg * 100 G
50 lbf (static) + 1 lbm * 100 G
N
lbf
1,
3,
4,
6,
7
6.
Dynamic loading is defined as an 11 ms duration average load superimposed on the static load requirement.
7.
Experimentally validated test condition used a heatsink mass of 1 lbm (~0.45 kg) with 100 G acceleration
measured at heatsink mass. The dynamic portion of this specification in the product application can have
flexibility in specific values, but the ultimate product of mass times acceleration should not exceed this
validated dynamic load (1 lbm x 100 G = 100 lb).
288 N + 0.45 kg * 100 G
65 lbf (static) + 1 lbm * 100 G
N
lbf
1,
3,
5,
6,
7
Transient
445
100
N
lbf
1,
3,
8
8.
Transient loading is defined as a 2 second duration peak load superimposed on the static load requirement,
representative of loads experienced by the package during heatsink installation.